SP3232E

True +3.0V to +5.5V RS-232 Transceivers

Description

The SP3222E/3232E series is an RS-232 transceiver solution intended for portable or hand- held applications such as notebook or palmtop computers. The SP3222E/3232E series has a high-efficiency, charge-pump power supply that requires only 0.1μF capacitors in 3.3V operation. This charge pump allows the SP3222E/3232E series to deliver true RS-232 performance from a single power supply ranging from +3.3V to +5.0V. The SP3222E/3232E are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222E/3232E devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge test methods. The SP3222E device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1μA.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.
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Features

  • Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
  • Minimum 120Kbps Data Rate Under Full Load
  • Interoperable with RS-232 down to +2.7V power source
  • Enhanced ESD Specifications:
    • ±15kV Human Body Model
    • ±15kV IEC1000-4-2 Air Discharge
    • ±8kV IEC1000-4-2 Contact Discharge

Application

Design Tools

Simulation Models
Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC16
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 82.2ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 49
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 9.90
  • Width: 3.90
  • Thickness: 1.65 max
  • Lead Pitch: 1.27
PDIP16
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.9ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 25
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.75
  • Width: 0.25
  • Thickness: 0.13
  • Lead Pitch: 0.10
SSOP16
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 87ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 76
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 6.20
  • Width: 5.30
  • Thickness: 1.75
  • Lead Pitch: 0.65
TSSOP16
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 100.4ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 95
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 5.00
  • Width: 4.40
  • Thickness: 1.00
  • Lead Pitch: 0.65
WSOIC16
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 47
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 10.30
  • Width: 7.50
  • Thickness: 2.55 max
  • Lead Pitch: 1.27

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP3232ECA SSOP16 0 70 OBS Suggested:
SP3232ECA-L
SP3232ECA/TR SSOP16 0 70 OBS Suggested:
SP3232ECA-L/TR
SP3232ECA-L SSOP16 0 70 Active
SP3232ECA-L/TR SSOP16 0 70 Active
SP3232ECN NSOIC16 0 70 OBS Suggested:
SP3232ECN-L
SP3232ECN/TR NSOIC16 0 70 OBS Suggested:
SP3232ECN-L/TR
SP3232ECN-L NSOIC16 0 70 Active
SP3232ECN-L/TR NSOIC16 0 70 Active
SP3232ECP PDIP16 0 70 OBS Suggested:
SP3232ECP-L
SP3232ECP-L PDIP16 0 70 Active
SP3232ECT WSOIC16 0 70 OBS Suggested:
SP3232ECT-L
SP3232ECT/TR WSOIC16 0 70 OBS Suggested:
SP3232ECT-L/TR
SP3232ECT-L WSOIC16 0 70 Active
SP3232ECT-L/TR WSOIC16 0 70 Active
SP3232ECY TSSOP16 0 70 OBS Suggested:
SP3232ECY-L
SP3232ECY/TR TSSOP16 0 70 OBS Suggested:
SP3232ECY-L/TR
SP3232ECY-L TSSOP16 0 70 Active
SP3232ECY-L/TR TSSOP16 0 70 Active
SP3232EEA SSOP16 -40 85 OBS Suggested:
SP3232EEA-L
SP3232EEA/TR SSOP16 -40 85 OBS Suggested:
SP3232EEA-L/TR
SP3232EEA-L SSOP16 -40 85 Active
SP3232EEA-L/TR SSOP16 -40 85 Active
SP3232EEN NSOIC16 -40 85 OBS Suggested:
SP3232EEN-L
SP3232EEN/TR NSOIC16 -40 85 OBS Suggested:
SP3232EEN-L/TR
SP3232EEN-L NSOIC16 -40 85 Active
SP3232EEN-L/TR NSOIC16 -40 85 Active
SP3232EEP PDIP16 -40 85 OBS Suggested:
SP3232EEP-L
SP3232EEP-L PDIP16 -40 85 Active
SP3232EET WSOIC16 -40 85 OBS Suggested:
SP3232EET-L
SP3232EET/TR WSOIC16 -40 85 OBS Suggested:
SP3232EET-L/TR
SP3232EET-L WSOIC16 -40 85 Active
SP3232EET-L/TR WSOIC16 -40 85 Active
SP3232EEY TSSOP16 -40 85 OBS Suggested:
SP3232EEY-L
SP3232EEY/TR TSSOP16 -40 85 OBS Suggested:
SP3232EEY-L/TR
SP3232EEY-L TSSOP16 -40 85 Active
SP3232EEY-L/TR TSSOP16 -40 85 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
02/23/2017 Qualification of alternate assembly subcon, ANST, China. PCN 16-1149-02-01 ANST-1033.pdf
02/15/2017 Qualification of alternate assembly subcon, ANST. PCN 16-1149-02 ANST-1033.pdf
01/16/2017 Material Change. ANST qualified Mitsui as alternate lead frame supplier for TSSOP16L package, in addition to current qualified lead frame supplier FULL RIVER. PCN 16-0835-05 Mitsui lead frame-1033.pdf
08/23/2016 Product Discontinuation Notification PDN 16-0519-01-1033.pdf
08/12/2016 Addition of an alternate qualified location, JCET, for assembly using copper wire bonding. PCN 16-0522-03 JCET-1033.pdf
08/11/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0521-05 JCET-1033.pdf
07/26/2016 Product discontinuation notification. Discontinued. PDN 16-0626-01-1033.pdf
02/05/2016 Alternate assembly site. Addition of an alternate assembly supplier ANST (China) PCN 15-1041-01 ANST-1033.PDF
11/16/2015 Updated information subsequent to original published PCN 15-0625-02 on 09/29/2015. Addendum: Update to package marking. PCN 15-0625-02A UPDATE-1033.pdf
09/29/2015 Greatek as alternate assembly site Addition of an alternate production site, Greatek, Taiwan for 16L, 24L and 28L SOICW PCN 15-0625-02 16L-24L-28L SOICW Greatek-1033.pdf
09/11/2015 Alternate assembly site Addition of an alternate assembly supplier Greatek in Taiwan. PCN 15-0625-04 Greatek-1033.pdf
07/14/2014 Qualified 0.25um foundry process in TSMC and SSOP 16L in Greatek. Both copper and gold wire bonding processes qualified. Alternate Foundry and Assembly Site. PCN_13-0834-05-1033.pdf
06/04/2014 Qualification of alternate foundry site, TSMC, using 0.25um CMOS process. Qualification of alternate assembly site, Carsem, for SOIC and TSSOP packages. Qualification of alternate assembly site, Greatek, for SSOP packages. Alternate Foundry & Assembly Site. PCN_14-0520-01-1033.pdf
01/27/2014 Addition of an alternate qualified 8, 14, 16, 40 PDIP assembly site, Greatek, Taiwan. Alternate assembly site. PCN 13-0834-02 Greatek 8-14-16-40 PDIP-1033.pdf
09/16/2013 Qualification of an alternate foundry TSMC using 0.25um CMOS process. Alternate Foundry Site & Process Changes. PCN_13-0730-02-1033.pdf
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes. PCN_13-0507-02-1033.pdf
07/02/2013 Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 14 and 16 lead NSOIC package using copper wire bonding. Material change. PCN_13-0128-01-1033.pdf
05/23/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change. PCN_13-0125-02-1033.pdf
09/24/2012 Material Change - Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity. PCN_12-0914-01-1033.pdf
06/16/2011 Add an alternative qualified assembly & test supplier, JCET, China. Capacity enhancement. PCN_11-0609-01-1033.pdf
05/10/2011 Product Discontinuation Notice. Discontinued due to low market demand. PDN_11-0510-01-1033.pdf
01/26/2011 Use 6’’ production line in the Silan, China wafer fabrication. Capacity enhancement. PCN_11-0117-01-1033.pdf
10/05/2010 Addition of an alternative qualified assembly and test supplier – JCET, China. Capacity enhancement PCN_10-0920-01-1033.pdf
01/25/2010 Material Change; Product transfer to a qualified assembly supplier. To enhance production capacity and also to use environmentally friendly Green material. PCN_10-0107-01-1033.pdf
12/14/2009 Material Change. Use environmental friendly Green (halogen free) material and also for standardization. PCN_09-1109-01-1033.pdf
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free). PCN_09-0911-01-1033.pdf
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN 081126-01-1033.pdf
11/26/2008 Notice of Obsolescence Package Discontinuation Notice PDN_081126-01-1033.pdf
09/29/2008 Product assembly of 14/16/18 lead PDIP families will be transferred from Unisem-Ipoh (Malaysia) to Unisem-Batam (Indonesia). Business consolidation and use of environmental friendly material. pcn08-0929-01-1033.pdf
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued. POL_022807-1033.pdf
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-06a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-06-1033.pdf