SP3223E

Intelligent +3.0V to +5.5V RS-232 Transceivers

Description

The SP3223 products are RS-232 transceiver solutions intended for portable applications such as notebook and hand held computers. These products use an internal high-efficiency, charge-pump power supply that requires only 0.1μF capacitors in 3.3V operation. This charge pump and Exar's driver architecture allow the SP3223 series to deliver compliant RS-232 performance from a single power supply ranging from +3.3V to +5.0V. The SP3223 is a 2-driver/2-receiver device ideal for laptop/notebook computer and PDA applications.

The AUTO ON-LINE® feature allows the device to automatically "wake-up" during a shutdown state when an RS-232 cable is connected and a connected peripheral is turned on. Otherwise, the device automatically shuts itself down drawing less than 1μA.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.

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Features

  • Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
  • Interoperable with EIA/TIA-232 and adheres to EIA/TIA-562 down to a +2.7V power source
  • AUTO ON-LINE® circuitry automatically wakes up from a 1μA shutdown
  • Minimum 250Kbps data rate under load (EB)
  • 1 Mbps data rate for high speed RS-232 (EU)
  • Regulated Charge Pump Yields Stable RS-232 Outputs Regardless of Vcc Variations
  • ESD Specifications:
    • ±15KV Human Body Model
    • ±15KV IEC1000-4-2 Air Discharge
    • ±8KV IEC1000-4-2 Contact Discharge

Application

Design Tools

Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
PDIP20
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: n/a
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 18
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 1.03
  • Width: 0.25
  • Thickness: 0.13
  • Lead Pitch: 0.10
SSOP20
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 83ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 66
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole
  • Dimensions: mm
  • Length: 7.20
  • Width: 5.30
  • Thickness: 1.75
  • Lead Pitch: 0.65
TSSOP20
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 110.7ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 74
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 6.5
  • Width: 4.4
  • Thickness: 1
  • Lead Pitch: 0.65

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP3223EBCP-L PDIP20 0 70 OBS
SP3223EBEP-L PDIP20 -40 85 OBS
SP3223ECA SSOP20 0 70 OBS
SP3223ECA/TR SSOP20 0 70 OBS
SP3223ECA-L SSOP20 0 70 EOL Suggested:
SP3223ECA-L/TR
SP3223ECA-L/TR SSOP20 0 70 Active
SP3223ECP PDIP20 0 70 OBS
SP3223ECP-L OBS
SP3223ECY TSSOP20 0 70 OBS Suggested:
SP3223ECY-L
SP3223ECY/TR TSSOP20 0 70 OBS Suggested:
SP3223ECY-L/TR
SP3223ECY-L TSSOP20 0 70 Active
SP3223ECY-L/TR TSSOP20 0 70 Active
SP3223EEA SSOP20 -40 85 OBS
SP3223EEA/TR SSOP20 -40 85 OBS
SP3223EEA-L SSOP20 -40 85 Active
SP3223EEA-L/TR SSOP20 -40 85 Active
SP3223EEP PDIP20 -40 85 OBS
SP3223EEP-L OBS
SP3223EEY TSSOP20 -40 85 OBS
SP3223EEY/TR TSSOP20 -40 85 OBS
SP3223EEY-L TSSOP20 -40 85 Active
SP3223EEY-L/TR TSSOP20 -40 85 Active
SP3223EHEA SSOP20 -40 85 OBS
SP3223EHEA/TR SSOP20 -40 85 OBS
SP3223EHEP PDIP20 -40 85 OBS
SP3223EHEY TSSOP20 -40 85 OBS
SP3223EHEY/TR TSSOP20 -40 85 OBS
SP3223EP-L OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
08/10/2017 Fab transfer including re-design for new foundry process rules. Qualification of TSMC foundry for 0.25um HV20 process. PCN 17-0205-01 TSMC-1033.pdf
07/11/2017 Product Discontinuation Notification PDN_17-0626-02-1033.pdf
05/10/2017 Qualification of alternate assembly subcon, JCET. PCN 17-0208-03 JCET-1033.pdf
02/23/2017 Qualification of alternate assembly subcon, ANST, China. PCN 16-1149-02-01 ANST-1033.pdf
02/15/2017 Qualification of alternate assembly subcon, ANST. PCN 16-1149-02 ANST-1033.pdf
02/14/2017 Qualification of alternate assembly subcon, GREATEK, Taiwan. PCN 17-0102-01 Greatek-1033.pdf
08/11/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0521-05 JCET-1033.pdf
07/26/2016 Product discontinuation notification. Discontinued. PDN 16-0626-01-1033.pdf
09/09/2013 Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 20 and 28 lead SSOP package using copper wire bonding. Material Change PCN_13-0521-01-1033.pdf
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes. PCN_13-0507-02-1033.pdf
05/23/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change. PCN_13-0125-02-1033.pdf
08/24/2012 Material Change - Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity. PCN_12-0712-05-1033.pdf
06/06/2011 Material Change: Convert all products in 20ld TSSOP package to Green (halogen-free) material using the same Bill of Material as 16ld TSSOP. Migrating to green environment and material standardization. PCN_11-0516-01-1033.pdf
07/15/2010 Change in packing quantity per reel and also carrier tape width/pitch. Standardization PCN_10-0706-02-1033.pdf
12/14/2009 Material Change. Use environmental friendly Green (halogen free) material and also for standardization. PCN_09-1109-01-1033.pdf
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN 081126-01-1033.pdf
11/26/2008 Notice of Obsolescence Package Discontinuation Notice PDN_081126-01-1033.pdf
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued. POL_022807-1033.pdf
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-06a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-06-1033.pdf