SP507

5V, Single Chip WAN Multi-Mode Serial Transceiver

Description

The SP507 is a monolithic IC that supports seven (7) popular serial interface standards for DTE/DCE connectivity. The seven (7) drivers and seven (7) receivers transmit and receive signals at over 20Mbps. The SP507 requires no additional external components for compliant operation for all seven (7) modes of operation. All necessary termination is integrated within the SP507 and is switchable when V.35 drivers, V.35 receivers, and V.11 receivers are used.  The SP507 can operate as either a DTE or DCE.

Additional features include a latch enable pin with the driver and receiver address decoder. Tri-state ability for the driver and receiver outputs is controlled by supplying a 3-bit word into the address decoder. Four (4) drivers and four (4) receivers in the SP507 include separate enable pins for added convenience.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.

Read More

Features

  • Interface Modes Supported:
    • RS-232 (V.28)
    • X.21/RS-422 (V.11)
    • EIA-530 (V.10 & V.11)
    • EIA-530A (V.10 & V.11)
    • RS-449 (V.10 & V.11)
    • V.35 (V.35 & V.28)
  • Software Selectable Protocols
  • Highest Differential Transmission Rates available at over 20Mbps
  • +5V Only Operation
  • Seven (7) Drivers and Seven (7) Receivers
  • Driver and Receiver Tri-state Control
  • Internal Transceiver Termination Resistors for V.11 and V.35 Protocols
  • Improved ESD Tolerance for Analog I/Os
  • Compliant to NET1/2 and TBR2 Physical Layer Requirements
  • Used in WAN Serial Ports in Routers Switches, DSU/CSU's and other Access Devices
  • Available in 132-Lead Small Scale Ball Grid Array and 80-Lead MQFP

Documentation

Process Qualification Report

EPISIL 5um CMOS Process Qualification Report

Product FAQs

SP507 FAQ

Product Brochure

Interface Brochure

Application

Design Tools

Technical Library
Reference Designs

Packaging

Pkg Code Details Quantities Dimensions PDF
LQFP80 12x12
  • JEDEC Reference: MS-026
  • MSL Pb-Free: L3 @ 260°C
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 41ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1000
  • Quantity per Tube: n/a
  • Quantity per Tray: 119
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 20
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 12.00
  • Width: 12.00
  • Thickness: 1.60
  • Lead Pitch: 0.50
MQFP80
  • JEDEC Reference: MS-022
  • MSL Pb-Free: L2a @ 250ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 44.0ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 500
  • Quantity per Tube: n/a
  • Quantity per Tray: 84
  • Reel Size (Dia. x Width x Pitch): 330 x 32 x 24
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 14.00
  • Width: 14.00
  • Thickness: 2.00
  • Lead Pitch: 0.65

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP507CF MQFP80 0 70 OBS
SP507CF-L MQFP80 0 70 OBS
SP507CM-L LQFP80 12x12 0 70 EOL Suggested:
SP508ECF-L
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
12/07/2016 Product Discontinuation Notification PDN 16-0939-01-1033.pdf
02/11/2016 Foundry line qualification, Addition of qualified 6 inch wafer processing line in Silan PCN 15-0727-03 Silan 6 inch-1033.pdf
10/03/2013 Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes. PCN_13-0522-02-1033.pdf
10/03/2013 Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Material change and alternate assembly site. PCN_13-0623-03-1033.pdf
07/30/2010 Process Change. Capacity enhancement. PCN_10-0715-01-1033.pdf
01/08/2008 Change of assembly subcontractor for all Sipex part numbers packaged in the 100 lead LQFP packages from Carsem to Unisem’s Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem’s Batam plant (formerly AIT). Current subcontractor, Carsem, is discontinuing the packages. pcn07-1102-06a-1033.pdf
04/04/2007 Power Management and Interface products as listed are being transferred to external wafer foundry, due to cessation of operations of the Sipex Hillview Wafer Fabrication manufacturing site. Updating previously announced transfer of certain Power Management and Interface Products from the Hillview wafer fabrication facility to wafer foundry Silan. PCN_07-0328-01-1033.pdf
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN 06-0130-21b-1033.pdf
02/15/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-21a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-21-1033.pdf