SP504

WAN Multi-Mode Serial Transceiver

Description

The SP504 is a single chip device that supports eight (8) physical serial interface standards for Wide Area Network Connectivity. The SP504 is fabricated using a low power BiCMOS process technology, and incorporates a Sipex patented (5,306,954) charge pump allowing +5V only operation. Seven (7) drivers and seven (7) receivers can be configured via software for any of the above interface modes at any time. The SP504 is suited for DTE-DCE applications. The SP504 requires only one external resistor per V.35 driver for compliant V.35 operation.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.

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Features

  • +5V Only
  • Seven (7) Drivers and Seven (7) Receivers
  • Driver and Receiver Tri-State Control
  • Reduced V.35 Termination Network
  • Pin Compatible with the SP503
  • Software Selectable Interface Modes:
    • RS-232E (V.28)
    • RS-422A (V.11, X.21)
    • RS-449 (V.11 & V.10)
    • RS-485
    • V.35
    • EIA-530 (V.11 & V.10)
    • EIA-530A (V.11 & V.10)
    • V.36

Documentation

Process Qualification Report

EPISIL 5um CMOS Process Qualification Report

Product FAQs

SP504 FAQ

Product Brochure

Interface Brochure

Application

Design Tools

Reference Designs

Packaging

Pkg Code Details Quantities Dimensions PDF
LQFP80 12x12
  • JEDEC Reference: MS-026
  • MSL Pb-Free: L3 @ 260°C
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 41ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1000
  • Quantity per Tube: n/a
  • Quantity per Tray: 119
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 20
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 12.00
  • Width: 12.00
  • Thickness: 1.60
  • Lead Pitch: 0.50
MQFP80
  • JEDEC Reference: MS-022
  • MSL Pb-Free: L2a @ 250ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 44.0ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 500
  • Quantity per Tube: n/a
  • Quantity per Tray: 84
  • Reel Size (Dia. x Width x Pitch): 330 x 32 x 24
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 14.00
  • Width: 14.00
  • Thickness: 2.00
  • Lead Pitch: 0.65

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP504MCF MQFP80 OBS
SP504MCF-L MQFP80 OBS
SP504MCF-L/TR MQFP80 OBS
SP504MCM-L LQFP80 12x12 0 70 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
10/03/2013 Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes. PCN_13-0522-02-1033.pdf
10/03/2013 Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Material change and alternate assembly site. PCN_13-0623-03-1033.pdf
07/30/2010 Process Change. Capacity enhancement. PCN_10-0715-01-1033.pdf
10/22/2008 ESD rating of 500V HBM was added. Product Re-Characterization. pcn_08-1022-01-1033.pdf
01/08/2008 Change of assembly subcontractor for all Sipex part numbers packaged in the 100 lead LQFP packages from Carsem to Unisem’s Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem’s Batam plant (formerly AIT). Current subcontractor, Carsem, is discontinuing the packages. pcn07-1102-06a-1033.pdf
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN 06-0130-26a(1)-1033.pdf
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN 06-0130-26a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-26-1033.pdf