SP813

Low Power Microprocessor Supervisory Circuits

Description

Read More

Features

  • Precision voltage monitor:
    • SP705/707/813L at 4.65V
    • SP706/708/813M at 4.40V
  • RESET pulse width - 200ms
  • Independent watchdog timer - 1.6s
  • Timeout (SP705/706/813L/813M)
  • 60mA maximum supply current
  • Debounced TTL/CMOS manual reset input
  • RESET asserted down to VCC = 1V
  • Voltage monitor for power failure or low battery warning
  • Available in 8-pin PDIP, NSOIC, and uSOIC packages
  • Pin compatible enhancement to industry standard 705-708/813L series
  • Functionally compatible to industry standard 1232 series

Application

Design Tools

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.65 max
  • Lead Pitch: 1.27
PDIP8
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 84.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.365
  • Width: 0.250
  • Thickness: 0.130
  • Lead Pitch: 0.100
MSOP8
  • JEDEC Reference:
  • MSL Pb-Free:
  • MSL SnPb Eutectic:
  • ThetaJA:
  • Bulk Pack Style:
  • Quantity per Bulk Pack:
  • Quantity per Reel:
  • Quantity per Tube:
  • Quantity per Tray:
  • Reel Size (Dia. x Width x Pitch):
  • Tape & Reel Unit Orientation:
  • Dimensions:
  • Length:
  • Width:
  • Thickness:
  • Lead Pitch:

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP813LCN NSOIC8 0 70 OBS
SP813LCN/TR NSOIC8 0 70 OBS
SP813LCN-L NSOIC8 0 70 OBS Suggested:
SP813LEN-L/TR
SP813LCN-L/TR NSOIC8 0 70 OBS Suggested:
SP813LEN-L/TR
SP813LCP PDIP8 0 70 OBS
SP813LCP-L PDIP8 0 70 Active
SP813LCU NSOIC8 0 70 OBS
SP813LCU/TR MSOP8 0 70 OBS
SP813LCU-L NSOIC8 0 70 OBS
SP813LCU-L/TR NSOIC8 0 70 OBS
SP813LEN NSOIC8 -40 85 OBS
SP813LEN/TR NSOIC8 -40 85 OBS
SP813LEN-L NSOIC8 -40 85 Active
SP813LEN-L/TR NSOIC8 -40 85 Active
SP813LEP PDIP8 -40 85 OBS
SP813LEP-L PDIP8 -40 85 Active
SP813LEU NSOIC8 -40 85 OBS
SP813LEU/TR MSOP8 -40 85 OBS
SP813LEU-L NSOIC8 -40 85 OBS
SP813LEU-L/TR NSOIC8 -40 85 OBS
SP813LXN NSOIC8 OBS
SP813LXN-1 NSOIC8 OBS
SP813LXN-2 NSOIC8 OBS
SP813LXP PDIP8 OBS
SP813LXP-1 PDIP8 OBS
SP813LXP-2 PDIP8 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
02/15/2017 Qualification of alternate assembly subcon, ANST. PCN 16-1149-02 ANST-1033.pdf
07/26/2016 Product discontinuation notification. Discontinued. PDN 16-0626-01-1033.pdf
04/13/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0207-02 JCET-1033.pdf
03/14/2016 Foundry line qualification. Addition of qualified 6 inch wafer processing line in Silan. PCN 16-0207-04 Silan 6 inch-1033.pdf
01/27/2014 Addition of an alternate qualified 8, 14, 16, 40 PDIP assembly site, Greatek, Taiwan. Alternate assembly site. PCN 13-0834-02 Greatek 8-14-16-40 PDIP-1033.pdf
07/02/2013 Qualification of an alternate qualified PDIP assembly site, Cirtek (Philippines), in addition to the current assembly site, Unisem (Malaysia). Alternate assembly site. PCN_12-1106-01-1033.pdf
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified. PCN_12-1107-01-1033.pdf
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free). PCN_09-0911-01-1033.pdf
03/04/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN_090304-01-1033.pdf
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued. POL_022807-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-37-1033.pdf