SP6260

200mA RF Ultra-Low Dropout Regulator (LDO)

Description

The SP6260 family is a series of CMOS positive low noise voltage regulators capable of delivering up to 200mA of continuous current. Each of these devices consists of a voltage reference, an error amplifier, a resistor network for setting the output voltage, a current limit circuit for current protection and a chip enabled circuit.

The SP6260 series feature high ripple rejection, low dropout voltage, low noise, high output voltage accuracy and low current consumption which make them ideal for use in various battery powered and handheld devices.

The SP6260 series is offered in the following fixed output voltage options: 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.2V and 3.3V.

The SP6260 family is available in a standard lead free, RoHS compliant 5-pin SOT-23 package.

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Features

  • 200mA continuous output current
    • 150mV dropout voltage @ IOUT=100mA (except 1.2V and 1.5V version)
    • 1.2V to 3.3V fixed output voltages
    • ±2% output voltage accuracy
  • 2V minimum input voltage
  • 30µVrms output noise (10Hz-100KHz)
  • 70dB power supply rejection ratio
  • 4mV line regulation (typ)
  • 12mV load regulation (typ)
  • Low standby current: 0.1µA yypical
  • Low quiescent current: 25µA typical
  • Lead-free, RoHS compliant 5-pin, SOT-23 package

Documentation

Application

  • Handheld equipment
  • Wireless communication devices
  • Battery powered equipment
  • Industrial and medical equipment

Design Tools

Packaging

Pkg Code Details Quantities Dimensions PDF
SOT-23-5
  • JEDEC Reference: MO-178
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 191ºC/W
  • Bulk Pack Style: Canister
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 3000
  • Quantity per Tube: n/a
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 180 x 8 x 12
  • Tape & Reel Unit Orientation: 3 Pins at sprocket hole.
  • Dimensions: mm
  • Length: 2.90
  • Width: 1.60
  • Thickness: 1.15
  • Lead Pitch: 0.95

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP6260AEK-L SOT-23-5 -40 85 OBS
SP6260AEK-L/TR SOT-23-5 -40 85 EOL Suggested:
SP6260GEK-L/TR
SP6260BEK-L SOT-23-5 -40 85 OBS
SP6260BEK-L/TR SOT-23-5 -40 85 EOL Suggested:
SP6260GEK-L/TR
SP6260CEK-L SOT-23-5 -40 85 OBS
SP6260CEK-L/TR SOT-23-5 -40 85 EOL
SP6260DEK-L SOT-23-5 -40 85 OBS
SP6260DEK-L/TR SOT-23-5 -40 85 EOL Suggested:
SP6260GEK-L/TR
SP6260EEK-L SOT-23-5 -40 85 OBS
SP6260EEK-L/TR SOT-23-5 -40 85 EOL Suggested:
SP6260GEK-L/TR
SP6260FEK-L SOT-23-5 -40 85 OBS
SP6260FEK-L/TR SOT-23-5 -40 85 OBS Suggested:
SP6260GEK-L/TR
SP6260GEK-L SOT-23-5 -40 85 OBS
SP6260GEK-L/TR SOT-23-5 -40 85 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
07/11/2017 Product Discontinuation Notification PDN_17-0623-01-1033.pdf
02/24/2016 Reactivation of SP6260DEK-L/TR. Exar has reactivated previously announced discontinued product due to continuing customer demand. PCN 15-1042-01 SP6260DEK-LTR-1033.PDF
02/19/2016 Material change. Qualified copper wire bonding assembly. PCN 15-1250-01 Cu wire bonding-1033.pdf
07/16/2015 Product discontinuation notification PDN_14-1250-02-1033.pdf
01/09/2015 Alternate Assembly Site Change. Qualified JCET ChuZhou for assembly of the listed parts. PCN_14-0835-01-1033.pdf
08/07/2009 Notice of Obsolescence – Selected Power Management Parts Discontinued due to low market demand, effective immediately. PDN_090807-01-1033-1033.pdf
07/15/2009 These products will be dry packed to eliminate possible moisture related failures at board assembly. There is no change to Form, Fit, or Function as stated in the applicable datasheets. Products having moisture sensitivity greater than level 1 require dry packs according to the internal procedures and JEDEC guidelines. PCN_090715-01-1033.pdf