SP6682

High Efficiency Charge Pump Regulator for White LEDs

Description

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Features

  • Ideal for white LED driver
  • Low profile, inductorless regulator
  • X1.5 and X2 modes for highest efficiency
  • 2.7V to 5.5V input voltage range
  • Fast turn-on time, 175μS
  • 1mA quiescent current
  • <1.5μA shutdown current
  • Built-in 600kHz oscillator
  • Programmable output current or voltage
  • PWM dimming control with enable pin
  • Shutdown to disconnect output from input
  • Soft-start to eliminate in-rush current
  • Industry standard 10-pin MSOP package and small 10-pin DFN package

Documentation

Manuals

Evaluation Board Manual

Product FAQs

SP6682 FAQ

Product Brochure

Power Management Brochure

Application

Design Tools

Technical Library
Reference Designs

Packaging

Pkg Code Details Quantities Dimensions PDF

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP6682ER DFN10 -40 85 OBS
SP6682ER/TR DFN10 -40 85 OBS
SP6682ER-L DFN10 -40 85 OBS Suggested:
SP6699EK-L
SP6682ER-L/TR DFN10 -40 85 OBS Suggested:
SP6699EK-L/TR
SP6682EU DFN10 -40 85 OBS
SP6682EU/TR DFN10 -40 85 OBS
SP6682EU-L DFN10 -40 85 OBS Suggested:
SP6699EK-L
SP6682EU-L/TR DFN10 -40 85 OBS Suggested:
SP6699EK-L/TR
SP6682UEB Board 0 85 OBS
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Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
07/20/2015 Product discontinuation notification PDN_15-0105-01-1033.pdf
10/04/2013 Addition of an alternate qualified assembly site, UTAC Thailand, for assembly using copper or gold wire bonding. Material change and alternate assembly site. PCN_13-0522-04-1033.pdf
08/29/2011 Material change: Mold compound and die attach material are changed and the listed parts will be fully Green (halogen-free). Migrating to green environment and material standardization. PCN_11-0810-01-1033.pdf
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued. POL_022807-1033.pdf
09/01/2005 Sipex qualified UMC as an alternative manufacturing source for the SP6682. Sipex plans to add UMC for additional capacity for the SP6682. PCN-05-0801-02-1033.pdf
04/14/2005 UMC has been added as Qualified wafer fab. subcontractor for SP6682 & SP6684 product families. Consolidation of wafer fab subcontractors which will result in decrease manufacturing cycle. PCN-04-0410-01-1033.pdf