High Efficiency Charge Pump Regulator for White LEDs


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  • Ideal for white LED driver
  • Low profile, inductorless regulator
  • X1.5 and X2 modes for highest efficiency
  • 2.7V to 5.5V input voltage range
  • Fast turn-on time, 175μS
  • 1mA quiescent current
  • <1.5μA shutdown current
  • Built-in 600kHz oscillator
  • Programmable output current or voltage
  • PWM dimming control with enable pin
  • Shutdown to disconnect output from input
  • Soft-start to eliminate in-rush current
  • Industry standard 10-pin MSOP package and small 10-pin DFN package



Evaluation Board Manual

Product FAQs

SP6682 FAQ

Product Brochure

Power Management Brochure


Design Tools

Technical Library
Reference Designs


Pkg Code Details Quantities Dimensions PDF

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP6682ER DFN10 -40 85 OBS
SP6682ER/TR DFN10 -40 85 OBS
SP6682ER-L DFN10 -40 85 OBS Suggested:
SP6682ER-L/TR DFN10 -40 85 OBS Suggested:
SP6682EU DFN10 -40 85 OBS
SP6682EU/TR DFN10 -40 85 OBS
SP6682EU-L DFN10 -40 85 OBS Suggested:
SP6682EU-L/TR DFN10 -40 85 OBS Suggested:
SP6682UEB Board 0 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
07/20/2015 Product discontinuation notification PDN_15-0105-01-1033.pdf
10/04/2013 Addition of an alternate qualified assembly site, UTAC Thailand, for assembly using copper or gold wire bonding. Material change and alternate assembly site. PCN_13-0522-04-1033.pdf
08/29/2011 Material change: Mold compound and die attach material are changed and the listed parts will be fully Green (halogen-free). Migrating to green environment and material standardization. PCN_11-0810-01-1033.pdf
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued. POL_022807-1033.pdf
09/01/2005 Sipex qualified UMC as an alternative manufacturing source for the SP6682. Sipex plans to add UMC for additional capacity for the SP6682. PCN-05-0801-02-1033.pdf
04/14/2005 UMC has been added as Qualified wafer fab. subcontractor for SP6682 & SP6684 product families. Consolidation of wafer fab subcontractors which will result in decrease manufacturing cycle. PCN-04-0410-01-1033.pdf