SP485E

Enhanced Low EMI Half-Duplex RS-485 Transceiver

Description

The SP481E and SP485E are a family of half-duplex transceivers that meet the specifications of RS-485 and RS-422 serial protocols with enhanced ESD performance. The ESD tolerance has been improved on these devices to over +15kV for both Human Body Model and IEC1000-4-2 Air Discharge Method. These devices are pin-to-pin compatible with Exar's SP481 and SP485 devices as well as popular industry standards. As with the original versions, the SP481E and SP485E feature Exar's BiCMOS design allowing low power operation without sacrificing performance. The SP481E and SP485E meet the requirements of the RS-485 and RS-422 protocols up to 10Mbps under load. The SP481E is equipped with a low power shutdown mode.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.
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Features

  • +5V Only
  • Low Power BiCMOS
  • Driver/Receiver Enable for Multi-Drop configurations
  • Enhanced ESD Specifications:
    • ±15KV Human Body Model
    • ±15KV IEC1000-4-2 Air Discharge

Application

Design Tools

Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.65 max
  • Lead Pitch: 1.27
PDIP8
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 84.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.365
  • Width: 0.250
  • Thickness: 0.130
  • Lead Pitch: 0.100

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP485ECN NSOIC8 0 70 OBS Suggested:
SP485ECN-L
SP485ECN/TR NSOIC8 0 70 OBS Suggested:
SP485ECN-L/TR
SP485ECN-L NSOIC8 0 70 Active
SP485ECN-L/TR NSOIC8 0 70 Active
SP485ECP PDIP8 0 70 OBS Suggested:
SP485ECP-L
SP485ECP-L PDIP8 0 70 Active
SP485EEN NSOIC8 -40 85 OBS Suggested:
SP485EEN-L
SP485EEN/TR NSOIC8 -40 85 OBS Suggested:
SP485EEN-L/TR
SP485EEN-L NSOIC8 -40 85 Active
SP485EEN-L/TR NSOIC8 -40 85 Active
SP485EEP PDIP8 -40 85 OBS Suggested:
SP485EEP-L
SP485EEP-L PDIP8 -40 85 Active
SP485EMN NSOIC8 -40 125 OBS Suggested:
SP485EMN-L
SP485EMN/TR NSOIC8 -40 125 OBS Suggested:
SP485EMN-L/TR
SP485EMN-L NSOIC8 -40 125 OBS
SP485EMN-L/TR NSOIC8 -40 125 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
12/19/2016 Qualification of alternate assembly subcon, ANST, China. PCN 16-0835-04 ANST-1033.pdf
07/26/2016 Product discontinuation notification. Discontinued. PDN 16-0626-01-1033.pdf
04/28/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0207-03 JCET-1033.pdf
01/06/2016 Alternate assembly site Addition of an alternate assembly supplier JCET (China). PCN 15-0834-03 JCET-1033.PDF
07/13/2015 Alternate foundry Qualification of TSMC for 0.25um HV20 process PCN 15-0520-03 TSMC -1033.pdf
01/29/2015 Alternate foundry and process changes. Qualification of TSMC foundry for 0.25um HV20 process. PCN_14-1147-01-1033.pdf
01/27/2014 Addition of an alternate qualified 8, 14, 16, 40 PDIP assembly site, Greatek, Taiwan. Alternate assembly site. PCN 13-0834-02 Greatek 8-14-16-40 PDIP-1033.pdf
08/16/2013 Remove 8KV contact discharge ESD specification to align with Industry Standard ESD specifications for Serial Transceiver products. Datasheet correction. PCN_13-0503-01-1033.pdf
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes. PCN_13-0507-02-1033.pdf
07/02/2013 Qualification of an alternate qualified PDIP assembly site, Cirtek (Philippines), in addition to the current assembly site, Unisem (Malaysia). Alternate assembly site. PCN_12-1106-01-1033.pdf
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified. PCN_12-1107-01-1033.pdf
08/10/2011 Material change and a new assembly & test supplier (ASE, Kunshan). Business consolidation. PCN_11-0724-01-1033.pdf
07/26/2011 Datasheet Change. Datasheet typos. PCN_11-0630-02-1033.pdf
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free). PCN_09-0911-01-1033.pdf
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN 081126-01-1033.pdf
11/26/2008 Notice of Obsolescence Package Discontinuation Notice PDN_081126-01-1033.pdf
04/20/2007 Migrating product from 5um CMOS process technology to 2um CMOS process technology to be sourced from both Episil, Taiwan, and Silan, Hangzhou, China foundries. To assure continuity of supply of wafers for these products. PCN_07-0426-01-1033.pdf
04/04/2007 Power Management and Interface products as listed are being transferred to external wafer foundry, due to cessation of operations of the Sipex Hillview Wafer Fabrication manufacturing site. Updating previously announced transfer of certain Power Management and Interface Products from the Hillview wafer fabrication facility to wafer foundry Silan. PCN_07-0328-01-1033.pdf
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-08a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-24-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-08-1033.pdf