SP3485

3.3V Low Power Half-Duplex RS-485 Transceivers with 10Mbps Data Rate

Description

The SP3481 and the SP3485 are a family of +3.3V low power half-duplex transceivers that meet the specifications of the RS-485 and RS-422 serial protocols. These devices are pin-to- pin compatible with the Exar SP481, SP483, and SP485 devices as well as popular industry standards. The SP3481 and the SP3485 feature Exar's BiCMOS process, allowing low power operation without sacrificing performance. The SP3481 and SP3485 meet the electrical specifications of RS-485 and RS-422 serial protocols up to 10Mbps under load. The SP3481 is equipped with a low power Shutdown mode.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.
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Features

  • RS-485 and RS-422 Transceivers
  • Operates from a single +3.3V supply
  • Interoperable with +5.0V logic
  • Driver/Receiver Enable
  • -7V to +12V Common-Mode Input Voltage Range
  • Allows up to 32 transceivers on the serial bus
  • Compatibility with the industry standard 75176 pinout
  • Driver Output Short-Circuit Protection

Application

Design Tools

Simulation Models
Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.65 max
  • Lead Pitch: 1.27

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP3485CN-L NSOIC8 0 70 Active
SP3485CN-L/TR NSOIC8 0 70 Active
SP3485EN-L NSOIC8 -40 85 Active
SP3485EN-L/TR NSOIC8 -40 85 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
02/15/2017 Qualification of alternate assembly subcon, ANST. PCN 16-1149-02 ANST-1033.pdf
06/29/2016 Qualification of alternate foundry subcon, TSMC, in addition to previously qualified foundry subcon, Silan. PCN 16-0313-04-1033.pdf
04/13/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0207-02 JCET-1033.pdf
02/11/2016 Foundry line qualification, Addition of qualified 6 inch wafer processing line in Silan PCN 15-0727-03 Silan 6 inch-1033.pdf
10/03/2013 Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes. PCN_13-0522-02-1033.pdf
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified. PCN_12-1107-01-1033.pdf
02/02/2012 Design Change: Poly layer changed to optimize the receiver gate length. To improve device performance and production consistency. PCN_12-0118-01-1033.pdf
07/30/2010 Process Change. Capacity enhancement. PCN_10-0715-01-1033.pdf
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free). PCN_09-0911-01-1033.pdf
04/04/2007 Power Management and Interface products as listed are being transferred to external wafer foundry, due to cessation of operations of the Sipex Hillview Wafer Fabrication manufacturing site. Updating previously announced transfer of certain Power Management and Interface Products from the Hillview wafer fabrication facility to wafer foundry Silan. PCN_07-0328-01-1033.pdf
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued. POL_022807-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-30-1033.pdf