SP3072E

3.3V, 15kV, Failsafe RS-485/RS-422 Half-Duplex with Slew Limit

Description

The SP3070E-3078E differential line transceivers are suitable for bidirectional communication on balanced multipoint bus transmission lines and comply with both RS485 and RS422 EIA Standards. Each device consists of a differential driver and differential receiver. All devices operate from a 3.3V power supply.

High receiver input impedance allows a large number of transceivers to share a common data bus while maintaining signal margin and without excessive loading or use of expensive repeaters. The high impedance driver output is maintained over the entire common-mode voltage range from -7 to +12V. Receivers will failsafe to logic 1 output when inputs are open, shorted or terminated. Drivers include built-in short-circuit protection and a thermal-overload shutdown to protect against excessive power dissipation from bus contention or cable faults. All RS485 receiver inputs and driver outputs are ESD protected up to ±15kV (Air-Gap and Human Body Model) and up to ±8kV Contact discharge (IEC 1000-4-2).

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.
Read More

Features

  • ±15kV ESD protection for RS485 pins
  • 3.3V low-power operation
  • Advanced receiver-failsafe protection for open, shorted or terminated lines
  • Up to 256 Transceivers may share bus
  • Very low load for 8x greater fan-out
  • Hot Swap glitch protection RE and DE
  • Thermal shutdown protects against driver contention
  • Available in three industry standard footprints
    • SP3070E, SP3073E and SP3076E in Full-Duplex (14 pin)
    • SP3071E, SP3074E and SP3077E in Full-Duplex (8 pin)
    • SP3072E, SP3075E and SP3078E in Half-Duplex (8 pin)
  • Three applications-optimized speed grades
    • SP3070-72E: 250kbps fully slew-limited
    • SP3073-75E: 500kbps slew-limited
    • SP3076-78E: 16Mbps high speed
  • Small form factor SO-narrow packages
  • Industrial (-40 to +85ºC) & Extended (-40 to +125ºC) temperature grades

Application

Design Tools

Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.65 max
  • Lead Pitch: 1.27

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP3072EEN-L NSOIC8 -40 85 Active
SP3072EEN-L/TR NSOIC8 -40 85 Active
SP3072EMN-L NSOIC8 -40 125 Active
SP3072EMN-L/TR NSOIC8 -40 125 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
02/15/2017 Qualification of alternate assembly subcon, ANST. PCN 16-1149-02 ANST-1033.pdf
04/28/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0207-03 JCET-1033.pdf
08/27/2015 Exar has qualified 0.25um CMOS process at TSMC.Alternate assembly sites have been qualified: - Carsem has been added for 8L and 14L nSOIC- ASE Chung-Li has been added for 8L nSOIC Process change, alternate foundry and assembly sites PCN 15-0520-01 SP3070-78EMN-1033.PDF
09/09/2013 Qualification of 0.25um CMOS process at TSMC and alternate assembly sites, Carsem (for 8 and 14L nSOIC) and ASE Chung-Li (for 8L nSOIC). Process Change and Alternate Foundry & Assembly/Test Site. PCN_13-0730-01-1033.pdf
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes. PCN_13-0507-02-1033.pdf
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified. PCN_12-1107-01-1033.pdf
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free). PCN_09-0911-01-1033.pdf
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN 081126-01-1033.pdf
11/26/2008 Notice of Obsolescence Package Discontinuation Notice PDN_081126-01-1033.pdf
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN 06-0130-11b-1033.pdf
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-11a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-11-1033.pdf