SP1485E

20Mbps Half-Duplex RS-485 Transceivers with +/-15KV ESD

Description

The SP1481E and the SP1485E are a family of half-duplex transceivers that meet the specifications of RS-485 and RS-422 serial protocols with enhanced ESD performance. The ESD tolerance has been improved on these devices to over +15KV for both Human Body Model and IEC1000-4-2 Air Discharge Method. These devices are pin-to-pin compatible with Exar's SP481 and SP485 devices as well as popular industry standards. As with the original versions, the SP1481E and the SP1485E feature Exar's BiCMOS design allowing low power operation without sacrificing performance. The SP1481E and SP1485E meet the requirements of the RS-485 and RS-422 protocols up to 20Mbps under load. The SP1481E is equipped with a low power Shutdown mode.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.
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Features

  • +5V Only
  • Low Power BiCMOS
  • Driver/Receiver Enable for Multi-Drop configurations
  • Enhanced ESD Specifications:
    • ± 15KV Human Body Model
    • ± 15KV IEC1000-4-2 Air Discharge

Application

Design Tools

Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.65 max
  • Lead Pitch: 1.27
PDIP8
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 84.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.365
  • Width: 0.250
  • Thickness: 0.130
  • Lead Pitch: 0.100

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP1485ECN NSOIC8 0 70 OBS
SP1485ECN/TR NSOIC8 0 70 OBS
SP1485ECN-L NSOIC8 0 70 Active
SP1485ECN-L/TR NSOIC8 0 70 Active
SP1485ECP PDIP8 0 70 OBS
SP1485ECP-L PDIP8 0 70 OBS
SP1485EEN NSOIC8 -40 85 OBS
SP1485EEN/TR NSOIC8 -40 85 OBS
SP1485EEN-L NSOIC8 -40 85 EOL Upgrade :  SP1485EEN-L/TR
SP1485EEN-L/TR NSOIC8 -40 85 Active
SP1485EEP PDIP8 -40 85 OBS
SP1485EEP-L PDIP8 -40 85 OBS
SP1485EMN NSOIC8 -40 85 OBS
SP1485EMN/TR NSOIC8 -40 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
08/23/2016 Product Discontinuation Notification PDN 16-0519-01-1033.pdf
07/26/2016 Product discontinuation notification. Discontinued. PDN 16-0626-01-1033.pdf
04/28/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0207-03 JCET-1033.pdf
01/06/2016 Alternate assembly site Addition of an alternate assembly supplier JCET (China). PCN 15-0834-03 JCET-1033.PDF
07/13/2015 Alternate foundry Qualification of TSMC for 0.25um HV20 process PCN 15-0520-03 TSMC -1033.pdf
01/29/2015 Alternate foundry and process changes. Qualification of TSMC foundry for 0.25um HV20 process. PCN_14-1147-01-1033.pdf
08/16/2013 Remove 8KV contact discharge ESD specification to align with Industry Standard ESD specifications for Serial Transceiver products. Datasheet correction. PCN_13-0503-01-1033.pdf
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes. PCN_13-0507-02-1033.pdf
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified. PCN_12-1107-01-1033.pdf
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free). PCN_09-0911-01-1033.pdf
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued. POL_022807-1033.pdf
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-08a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-08-1033.pdf