SP3243EU

High Speed Intelligent +3.0V to +5.5V RS-232 Transceiver

Description

The SP3243E products are 3 driver/5 receiver RS-232 transceiver solutions intended for portable or hand-held applications such as notebook and palmtop computers. The SP3243E includes one complementary receiver that remains alert to monitor an external device's Ring Indicate signal while the device is shutdown. The SP3243E and EB devices feature slew-rate limited outputs for reduced crosstalk and EMI. The "U" and "H" series are optimized for high speed with data rates up to 1Mbps, easily meeting the demands of high speed RS-232 applications. The SP3243E series uses an internal high-efficiency, charge-pump power supply that requires only 0.1μF capacitors in 3.3V operation. This charge pump and Exar's driver architecture allow the SP3243E series to deliver compliant RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The AUTO ON-LINE® feature allows the device to automatically "wake-up" during a shutdown state when an RS-232 cable is con- nected and a connected peripheral is turned on. Otherwise, the device automatically shuts itself down drawing less than 1μA.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.
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Features

  • Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
  • ±15kV ESD protection
  • 1Mbps Data rate
  • AUTO ON-LINE® circuitry automatically wakes up from a 1µA shutdown
  • Regulated Charge Pump Yields Stable RS-232 Outputs Regardless of VCC Variations
  • Enhanced ESD Specifications:
    • ±15kV Human Body Model
    • ±15kV IEC1000-4-2 Air Discharge
    • ±8kV IEC1000-4-2 Contact Discharge
  • 250 Kbps min. transmission rate (EB)
  • 1000 Kbps min. transmission rate (EU)
  • Ideal for High Speed RS-232 Applications

Application

Design Tools

Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
QFN32 5x5
  • JEDEC Reference: MO-220
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 22.4ºC/W
  • Bulk Pack Style: ¹Canister
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 3000
  • Quantity per Tube: n/a
  • Quantity per Tray: ²490
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 5.00
  • Width: 5.00
  • Thickness: 0.90
  • Lead Pitch: 0.50
SSOP28
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 67.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 46
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole
  • Dimensions: mm
  • Length: 10.20
  • Width: 5.30
  • Thickness: 1.75
  • Lead Pitch: 0.65
TSSOP28
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 83.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 9.70
  • Width: 4.40
  • Thickness: 1.00
  • Lead Pitch: 0.65
WSOIC28
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 58.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 27
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 17.90
  • Width: 7.50
  • Thickness: 2.55 max
  • Lead Pitch: 1.27

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP3243EUCA-L SSOP28 0 70 EOL Suggested:
SP3243EUCA-L/TR
SP3243EUCA-L/TR SSOP28 0 70 Active
SP3243EUCR-L QFN32 5x5 0 70 OBS Suggested:
SP3243EUER-L/TR
SP3243EUCR-L/TR QFN32 5x5 0 70 OBS Suggested:
SP3243EUER-L/TR
SP3243EUCT-L WSOIC28 0 70 OBS Suggested:
SP3243EUCT-L
SP3243EUCT-L/TR WSOIC28 0 70 EOL Suggested:
SP3243EUCA-L/TR
SP3243EUCY-L TSSOP28 0 70 EOL Suggested:
SP3243EUCY-L/TR
SP3243EUCY-L/TR TSSOP28 0 70 Active
SP3243EUEA/TR SSOP28 -40 85 OBS
SP3243EUEA-L SSOP28 -40 85 EOL Suggested:
SP3243EUEA-L/TR
SP3243EUEA-L/TR SSOP28 -40 85 Active
SP3243EUER-L QFN32 5x5 -40 85 EOL Suggested:
SP3243EUER-L/TR
SP3243EUER-L/TR QFN32 5x5 -40 85 Active
SP3243EUET-L WSOIC28 -40 85 OBS Suggested:
SP3243EUCT-L/TR
SP3243EUET-L/TR WSOIC28 -40 85 OBS Suggested:
SP3243EUCT-L/TR
SP3243EUEY-L TSSOP28 -40 85 EOL Suggested:
SP3243EUEY-L/TR
SP3243EUEY-L/TR TSSOP28 -40 85 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
07/11/2017 Product Discontinuation Notification PDN_17-0626-02-1033.pdf
07/10/2017 Material Change. JCET qualification to use Tongling Poongsan Sanjia lead frame and HITACHI CEL-9240 mold compound for SSOP 28L package. PCN 17-0104-01 Lead frame mold compound-1033.pdf
05/10/2017 Qualification of alternate assembly subcon, JCET. PCN 17-0208-03 JCET-1033.pdf
01/05/2017 Addition of an alternate qualified location, ANST, China. PCN 16-0835-01 ANST-1033.pdf
12/19/2016 Qualification of alternate assembly subcon, ANST, China. PCN 16-0835-04 ANST-1033.pdf
08/11/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0521-05 JCET-1033.pdf
07/26/2016 Product discontinuation notification. Discontinued. PDN 16-0626-01-1033.pdf
11/16/2015 Updated information subsequent to original published PCN 15-0625-02 on 09/29/2015. Addendum: Update to package marking. PCN 15-0625-02A UPDATE-1033.pdf
09/29/2015 Greatek as alternate assembly site Addition of an alternate production site, Greatek, Taiwan for 16L, 24L and 28L SOICW PCN 15-0625-02 16L-24L-28L SOICW Greatek-1033.pdf
01/12/2015 Alternate Foundry and Assembly Site. Qualification of TSMC (using 0.25um CMOS process), and Greatek Taiwan (using either copper or gold wire-bond). PCN_14-0939-01-1033.pdf
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes. PCN_13-0507-02-1033.pdf
07/02/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change. PCN_12-1129-01-1033.pdf
02/07/2012 Material Change: Bond wire changed from gold to copper. To prevent a cost increase of product to customers due to the rising prices of gold. PCN_12-0126-02-1033.pdf
07/15/2010 Change in packing quantity per reel and also carrier tape width/pitch. Standardization PCN_10-0706-02-1033.pdf
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN 081126-01-1033.pdf
11/26/2008 Notice of Obsolescence Package Discontinuation Notice PDN_081126-01-1033.pdf
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-07a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-07-1033.pdf