SP3232EH

3.3V, 460Kbps RS-232 Transceivers

Description

The SP3232EH is a 2 driver / 2 receiver RS-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. The data transmission rate of 460kbps can meet the demands of high speed RS-232 applications. This device has a high-efficiency, charge-pump power supply that requires only 0.1μF capacitors in 3.3V operation. This charge pump allows the SP3232EH device to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The ESD tolerance of the SP3232EH device exceeds +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test methods.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.

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Features

  • Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
  • Interoperable with RS-232 down to a +2.7V power source
  • Enhanced ESD Specifications:
    • +15kV Human Body Model
    • +15kV IEC61000-4-2 Air Discharge
    • +8kV IEC61000-4-2 Contact Discharge
  • 460kbps Minimum Transmission Rate
  • Ideal for Handheld, Battery Operated Applications

Application

Design Tools

Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
PDIP16
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.9ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 25
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.75
  • Width: 0.25
  • Thickness: 0.13
  • Lead Pitch: 0.10
SSOP16
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 87ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 76
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 6.20
  • Width: 5.30
  • Thickness: 1.75
  • Lead Pitch: 0.65
TSSOP16
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 100.4ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 95
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 5.00
  • Width: 4.40
  • Thickness: 1.00
  • Lead Pitch: 0.65
WSOIC16
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 47
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 10.30
  • Width: 7.50
  • Thickness: 2.55 max
  • Lead Pitch: 1.27

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP3232EHCA SSOP16 0 70 OBS
SP3232EHCA/TR SSOP16 0 70 OBS Suggested:
SP3232EHCA-L/TR
SP3232EHCA-L SSOP16 0 70 OBS Suggested:
SP3232EHCY-L
SP3232EHCA-L/TR SSOP16 0 70 OBS Suggested:
SP3232EHCY-L/TR
SP3232EHCP PDIP16 0 70 OBS Suggested:
SP3232EHCP-L
SP3232EHCP-L PDIP16 0 70 OBS Suggested:
SP3232EHCY-L
SP3232EHCT WSOIC16 0 70 OBS Suggested:
SP3232EHCT-L
SP3232EHCT/TR WSOIC16 0 70 OBS Suggested:
SP3232EHCT-L/TR
SP3232EHCT-L WSOIC16 0 70 OBS Suggested:
SP3232EHCY-L
SP3232EHCT-L/TR WSOIC16 0 70 OBS Suggested:
SP3232EHCY-L/TR
SP3232EHCY TSSOP16 0 70 OBS Suggested:
SP3232EHCY-L
SP3232EHCY/TR TSSOP16 0 70 OBS Suggested:
SP3232EHCY-L/TR
SP3232EHCY-L TSSOP16 0 70 EOL Suggested:
SP3232EHCY-L/TR
SP3232EHCY-L/TR TSSOP16 0 70 Active
SP3232EHEA SSOP16 0 70 OBS
SP3232EHEA/TR SSOP16 0 70 OBS
SP3232EHEA-L SSOP16 -40 85 OBS Suggested:
SP3232EHEY-L
SP3232EHEA-L/TR SSOP16 -40 85 OBS Suggested:
SP3232EHEY-L/TR
SP3232EHEP PDIP16 0 70 OBS Suggested:
SP3232EHEP-L
SP3232EHEP-L PDIP16 -40 85 OBS Suggested:
SP3232EHEY-L
SP3232EHET WSOIC16 0 70 OBS Suggested:
SP3232EHET-L
SP3232EHET/TR WSOIC16 0 70 OBS Suggested:
SP3232EHET-L/TR
SP3232EHET-L WSOIC16 -40 85 OBS Suggested:
SP3232EHEY-L
SP3232EHET-L/TR WSOIC16 -40 85 OBS Suggested:
SP3232EHEY-L/TR
SP3232EHEY TSSOP16 0 70 OBS Suggested:
SP3232EHEY-L
SP3232EHEY/TR TSSOP16 0 70 OBS Suggested:
SP3232EHEY-L/TR
SP3232EHEY-L TSSOP16 -40 85 EOL Suggested:
SP3232EHEY-L/TR
SP3232EHEY-L/TR TSSOP16 -40 85 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
07/11/2017 Product Discontinuation Notification PDN_17-0626-02-1033.pdf
05/10/2017 Qualification of alternate assembly subcon, JCET. PCN 17-0208-03 JCET-1033.pdf
01/16/2017 Material Change. ANST qualified Mitsui as alternate lead frame supplier for TSSOP16L package, in addition to current qualified lead frame supplier FULL RIVER. PCN 16-0835-05 Mitsui lead frame-1033.pdf
02/05/2016 Alternate assembly site. Addition of an alternate assembly supplier ANST (China) PCN 15-1041-01 ANST-1033.PDF
06/04/2014 Qualification of alternate foundry site, TSMC, using 0.25um CMOS process. Qualification of alternate assembly site, Carsem, for SOIC and TSSOP packages. Qualification of alternate assembly site, Greatek, for SSOP packages. Alternate Foundry & Assembly Site. PCN_14-0520-01-1033.pdf
05/23/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change. PCN_13-0125-02-1033.pdf
06/16/2011 Add an alternative qualified assembly & test supplier, JCET, China. Capacity enhancement. PCN_11-0609-01-1033.pdf
05/10/2011 Product Discontinuation Notice. Discontinued due to low market demand. PDN_11-0510-01-1033.pdf
10/05/2010 Addition of an alternative qualified assembly and test supplier – JCET, China. Capacity enhancement PCN_10-0920-01-1033.pdf
01/25/2010 Material Change; Product transfer to a qualified assembly supplier. To enhance production capacity and also to use environmentally friendly Green material. PCN_10-0107-01-1033.pdf
12/14/2009 Material Change. Use environmental friendly Green (halogen free) material and also for standardization. PCN_09-1109-01-1033.pdf
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN 081126-01-1033.pdf
11/26/2008 Notice of Obsolescence Package Discontinuation Notice PDN_081126-01-1033.pdf
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-06a-1033.pdf
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site PCN-06-0130-06-1033.pdf