SP3232EB

True +3.0V to +5.5V RS-232 Transceivers

Description

The SP3222EB/SP3232EB series is an RS-232 transceiver solution intended for portable or hand-held applications such as notebook or palmtop computers. The SP3222EB/SP3232EB series has a high-efficiency, charge-pump power supply that requires only 0.1μF capacitors in 3.3V operation. This charge pump allows the SP3222EB/SP3232EB series to deliver true RS-232 performance from a single power supply ranging from +3.0V to +5.5V. The SP3222EB/SP3232EB are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222EB/SP3232EB devices are over +/-15kV for both Human Body Model and IEC1000- 4-2 Air discharge test methods. The SP3222EB device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1μA.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.
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Features

  • Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
  • 250kbps Transmission Rate Under Load
  • Interoperable with RS-232 down to +2.7V power source
  • Enhanced ESD Specifications:
    • ±15kV Human Body Model
    • ±15kV IEC1000-4-2 Air Discharge
    • ±8kV IEC1000-4-2 Contact Discharge

Documentation

Application

Design Tools

Technical Library

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC16
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 82.2ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 49
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 9.90
  • Width: 3.90
  • Thickness: 1.65 max
  • Lead Pitch: 1.27
PDIP16
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.9ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 25
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.75
  • Width: 0.25
  • Thickness: 0.13
  • Lead Pitch: 0.10
SSOP16
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 87ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 76
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 6.20
  • Width: 5.30
  • Thickness: 1.75
  • Lead Pitch: 0.65
TSSOP16
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 100.4ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 95
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 5.00
  • Width: 4.40
  • Thickness: 1.00
  • Lead Pitch: 0.65
WSOIC16
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 47
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 10.30
  • Width: 7.50
  • Thickness: 2.55 max
  • Lead Pitch: 1.27
QFN16 5x5
  • JEDEC Reference:
  • MSL Pb-Free:
  • MSL SnPb Eutectic:
  • ThetaJA:
  • Bulk Pack Style:
  • Quantity per Bulk Pack:
  • Quantity per Reel:
  • Quantity per Tube:
  • Quantity per Tray:
  • Reel Size (Dia. x Width x Pitch):
  • Tape & Reel Unit Orientation:
  • Dimensions:
  • Length:
  • Width:
  • Thickness:
  • Lead Pitch:

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP3232EBCA-L SSOP16 0 70 Active
SP3232EBCA-L/TR SSOP16 0 70 Active
SP3232EBCN-L NSOIC16 0 70 Active
SP3232EBCN-L/TR NSOIC16 0 70 Active
SP3232EBCP-L PDIP16 0 70 OBS Suggested:
SP3232EBCT-L
SP3232EBCT-L WSOIC16 0 70 OBS Suggested:
SP3232EBCT-L/TR
SP3232EBCT-L/TR WSOIC16 0 70 Active
SP3232EBCY-L TSSOP16 0 70 Active
SP3232EBCY-L/TR TSSOP16 0 70 Active
SP3232EBEA-L SSOP16 -40 85 Active
SP3232EBEA-L/TR SSOP16 -40 85 Active
SP3232EBEN-L NSOIC16 -40 85 Active
SP3232EBEN-L/TR NSOIC16 -40 85 Active
SP3232EBEP-L PDIP16 -40 85 OBS Suggested:
SP3232EBET-L
SP3232EBER-L QFN16 5x5 -40 85 Active
SP3232EBER-L/TR QFN16 5x5 -40 85 Active
SP3232EBET-L WSOIC16 -40 85 OBS Suggested:
SP3232EBET-L/TR
SP3232EBET-L/TR WSOIC16 -40 85 Active
SP3232EBEY-L TSSOP16 -40 85 Active
SP3232EBEY-L/TR TSSOP16 -40 85 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
02/23/2017 Qualification of alternate assembly subcon, ANST, China. PCN 16-1149-02-01 ANST-1033.pdf
02/15/2017 Qualification of alternate assembly subcon, ANST. PCN 16-1149-02 ANST-1033.pdf
01/16/2017 Material Change. ANST qualified Mitsui as alternate lead frame supplier for TSSOP16L package, in addition to current qualified lead frame supplier FULL RIVER. PCN 16-0835-05 Mitsui lead frame-1033.pdf
08/12/2016 Addition of an alternate qualified location, JCET, for assembly using copper wire bonding. PCN 16-0522-03 JCET-1033.pdf
08/11/2016 Qualification of alternate assembly subcon, JCET. PCN 16-0521-05 JCET-1033.pdf
07/26/2016 Product discontinuation notification. Discontinued. PDN 16-0626-01-1033.pdf
02/05/2016 Alternate assembly site. Addition of an alternate assembly supplier ANST (China) PCN 15-1041-01 ANST-1033.PDF
11/16/2015 Updated information subsequent to original published PCN 15-0625-02 on 09/29/2015. Addendum: Update to package marking. PCN 15-0625-02A UPDATE-1033.pdf
09/29/2015 Greatek as alternate assembly site Addition of an alternate production site, Greatek, Taiwan for 16L, 24L and 28L SOICW PCN 15-0625-02 16L-24L-28L SOICW Greatek-1033.pdf
09/11/2015 Alternate assembly site Addition of an alternate assembly supplier Greatek in Taiwan. PCN 15-0625-04 Greatek-1033.pdf
07/14/2014 Qualified 0.25um foundry process in TSMC and SSOP 16L in Greatek. Both copper and gold wire bonding processes qualified. Alternate Foundry and Assembly Site. PCN_13-0834-05-1033.pdf
09/16/2013 Qualification of an alternate foundry TSMC using 0.25um CMOS process. Alternate Foundry Site & Process Changes. PCN_13-0730-02-1033.pdf
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes. PCN_13-0507-02-1033.pdf
07/02/2013 Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 14 and 16 lead NSOIC package using copper wire bonding. Material change. PCN_13-0128-01-1033.pdf
05/23/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change. PCN_13-0125-02-1033.pdf
09/24/2012 Material Change - Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity. PCN_12-0914-01-1033.pdf
06/16/2011 Add an alternative qualified assembly & test supplier, JCET, China. Capacity enhancement. PCN_11-0609-01-1033.pdf
05/10/2011 Product Discontinuation Notice. Discontinued due to low market demand. PDN_11-0510-01-1033.pdf
01/26/2011 Use 6’’ production line in the Silan, China wafer fabrication. Capacity enhancement. PCN_11-0117-01-1033.pdf
10/05/2010 Addition of an alternative qualified assembly and test supplier – JCET, China. Capacity enhancement PCN_10-0920-01-1033.pdf
01/25/2010 Material Change; Product transfer to a qualified assembly supplier. To enhance production capacity and also to use environmentally friendly Green material. PCN_10-0107-01-1033.pdf
12/14/2009 Material Change. Use environmental friendly Green (halogen free) material and also for standardization. PCN_09-1109-01-1033.pdf
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free). PCN_09-0911-01-1033.pdf
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand PDN 081126-01-1033.pdf
11/26/2008 Notice of Obsolescence Package Discontinuation Notice PDN_081126-01-1033.pdf
09/29/2008 Product assembly of 14/16/18 lead PDIP families will be transferred from Unisem-Ipoh (Malaysia) to Unisem-Batam (Indonesia). Business consolidation and use of environmental friendly material. pcn08-0929-01-1033.pdf