SP506

5V, Single Chip WAN Multi-Mode Serial Transceiver
Data Sheets OBS (Obsolete)

Overview

Information 5V, Single Chip WAN Multi-Mode Serial Transceiver
Supported Protocols RS232, RS449, EIA530, V.10, V.11, V.28, V.35, V.36, X.21
Supply Voltage (Nom) (V) 5
No. of Tx 7
No. of Rx 7
Data Rate (Mbps) 16
HBM ESD (kV) 2
Internal Termination V.35, V.11
VL Pin
Temperature Range (°C) 0 to 70
Package LQFP-80
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The SP506 is a monolithic IC that supports eight (8) popular serial interface standards for DTE to DCE connectivity. The SP506 is pin-to-pin compatible to our SP505 multi-protocol transceiver but with faster throughput. The seven (7) drivers and seven (7) receivers can transmit and receive signals at 20Mbps. As with the SP505, the SP506 requires no additional external components for compliant operation for all of the eight (8) modes of operation. All necessary termination is integrated within the SP506 and is switchable when V.35 drivers, V.35 receivers, and V.11 receivers are used. The SP506 can operate as either a DTE or DCE.

Additional features with the SP506 include internal loopback that can be initiated in either singleended or differential modes. While in loopback mode, driver outputs are internally connected to receiver inputs creating an internal signal path convenient for diagnostic testing. This eliminates the need for an external loopback plug. The SP506 also includes a latch enable pin with the driver and receiver address decoder. Tri-state ability for the driver and receiver outputs is controlled by supplying a 4-bit word into the address decoder. Seven (7) drivers and one (1) receiver in the SP506 include separate enable pins for added convenience.


  • Interface Modes Supported:
    • RS-232 (V.28)
    • X.21/RS-422 (V.11)
    • EIA-530 (V.10 & V.11)
    • EIA-530A (V.10 & V.11)
    • RS-449 (V.10 & V.11
    • V.35 (V.35 & V.28)
    • V.36 (V.10 & V.11)
    • RS-485 (unterminated V.11)
  • Software Selectable Protocol
  • Highest Differential Transmission Rates at over 20Mbps
  • +5V Only Operation
  • Seven (7) Drivers and Seven (7) Receivers
  • Driver and Receiver Tri-state Control
  • Internal Transceiver Termination Resistors for V.11 and V.35 Protocols
  • Loopback Self-Test Mode
  • Improved ESD Tolerance for Analog I/Os
  • Compliant to NET1/2 and TBR2 Physical Layer Requirements
  • Used in WAN Serial Ports in Routers, Switches, DSU/CSU's and other Access Devices

Documentation & Design Tools

All Types Data Sheets Application Notes Product Briefs & Brochures
Type Title Version Date File Size
Data Sheets SP506 5V Single Chip WAN Multi-Mode Serial Transceiver 1.0.1 August 2010 1.4 MB
Application Notes Advantages of Designing with Multi-Protocol Transceivers Application Note R00 September 2023 2.5 MB
Application Notes RS-232 and RS-485 PCB Layout Application Note R00 December 2022 2.8 MB
Application Notes AN218, SP50x RS-232 Latch-up Prevention April 2013 178.8 KB
Application Notes ANI-14, DTE and DCE Terminology Explained B December 2006 25.4 KB
Application Notes ANI-17, Multiprotocol DTE and DCE Options B December 2006 34.6 KB
Application Notes ANI-16, Design Guide for Multi-Protocol Serial Ports A November 2005 462.9 KB
Design Solutions DS-27, Signal Routing Considerations for 80-Pin Multiprotocol Communications Interface Devices November 2007 246.6 KB
Product Brochures Interface Brochure November 2023 3.7 MB
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Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement PDN
SP506CF MQFP80 0 70 OBS
SP506CF-L MQFP80 0 70 OBS
SP506CM-L LQFP80 14x14 0 70 OBS
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Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
LQFP80 14x14
  • JEDEC Reference: MS-026
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 36.8ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: 90
  • Quantity per Reel: 1000
  • Quantity per Tube: n/a
  • Quantity per Tray: 90
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 20
  • Tape & Reel Unit Orientation: Quadrant 2
  • Dimensions: mm
  • Length: 14.00
  • Width: 14.00
  • Thickness: 1.60
  • Lead Pitch: 0.65
MQFP80
  • JEDEC Reference: MS-022
  • MSL Pb-Free: L2a @ 250ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 44.0ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 500
  • Quantity per Tube: n/a
  • Quantity per Tray: 84
  • Reel Size (Dia. x Width x Pitch): 330 x 32 x 24
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 14.00
  • Width: 14.00
  • Thickness: 2.00
  • Lead Pitch: 0.65

Notifications

Distribution Date Description File
07/11/2017 Product Discontinuation Notification
02/11/2016 Foundry line qualification, Addition of qualified 6 inch wafer processing line in Silan
10/03/2013 Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes.
10/03/2013 Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Material change and alternate assembly site.
07/30/2010 Process Change. Capacity enhancement.
01/08/2008 Change of assembly subcontractor for all Sipex part numbers packaged in the 100 lead LQFP packages from Carsem to Unisem’s Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem’s Batam plant (formerly AIT). Current subcontractor, Carsem, is discontinuing the packages.
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/15/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

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ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.
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