SP336

Programmable RS232/RS485/RS422 Serial Transceiver

Description

The SP336 is a programmable RS-232 and/or RS-485/RS-422 transceivers. The SP336 contains four drivers and four receivers when selected in RS-232 mode; and two drivers and two receivers when selected in RS-485 mode.  In addition, it may be configured for RS-232 and RS-485/RS-422 mix mode configuration.

The RS-232 transceivers can typically operate at 250kbps or 1Mbps while adhering to the RS-232 specifications. The RS-485/RS-422 transceivers can operate at 250kbps and 10Mbps while adhering to the RS-485/RS-422 specifications. The slew rate control pin minimizes problems with reflections on long and un-terminated cables.  The RS-485/422 and RS-232 drivers and receivers can be disabled (High-Z output) by the three mode select pins.

For technical support or help choosing a product please email Exar’s Serial Technical Support group at:  serialtechsupport@exar.com.

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Features

  • +3.3V or +5V Supply Voltage Operation
  • Software Programmable RS-232 or RS-485/RS-422 Selection
  • Four RS-232 Drivers and Four Receivers in RS-232 Mode
  • Two RS-485/RS-422 Full-Duplex Transceivers in RS-485/RS-422 Mode
  • Mixed RS-232 and RS-485/422 Mode
  • Robust ESD Specifications:
    • ±15KV Human Body Model
    • ±15KV IEC1000-4-2 Air Discharge
    • ±8KV IEC1000-4-2 Contact Discharge
  • Slew Rate Control Feature, Low EMI
  • Advanced Failsafe - Receiver  failsafe on open, short or terminated lines
  • 1/8th Unit Load, 256 transceivers on bus
  • Full Differential Driver Tri-State (Hi-Z) Control
  • Receiver Output Tri-State Control

Application

Design Tools

Simulation Models

Packaging

Pkg Code Details Quantities Dimensions PDF
TSSOP28
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 83.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 2500
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 9.70
  • Width: 4.40
  • Thickness: 1.00
  • Lead Pitch: 0.65
WSOIC28
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 58.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1500
  • Quantity per Tube: 27
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 17.90
  • Width: 7.50
  • Thickness: 2.55 max
  • Lead Pitch: 1.27

Parts & Purchasing

Part Number Pkg Code RoHS Min Temp Max Temp Status Buy Now Order Samples
SP336ECT-L WSOIC28 0 70 Active
SP336ECT-L/TR WSOIC28 0 70 Active
SP336ECY-L TSSOP28 0 70 Active
SP336ECY-L/TR TSSOP28 0 70 Active
SP336EET-L WSOIC28 -40 85 Active
SP336EET-L/TR WSOIC28 -40 85 Active
SP336EEY-L TSSOP28 -40 85 Active
SP336EEY-L/TR TSSOP28 -40 85 Active
SP336EEY-0A-EB Board -40 85 Active
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Distribution Date Description File
05/10/2017 Qualification of alternate assembly subcon, JCET. PCN 17-0208-03 JCET-1033.pdf
02/23/2017 Qualification of alternate assembly subcon, ANST, China. PCN 16-1149-02-01 ANST-1033.pdf
02/09/2016 Qualification of alternate foundry subcon, Silan. PCN 15-0940-01 Silan-1033.pdf
07/03/2013 Addition of qualified 6 inch wafer processing line in Episil, in addition to the currently qualified 5 inch wafer processing line. Other change (foundry 6 inch wafer qualification). PCN_13-0507-01-1033.pdf
05/23/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change. PCN_13-0125-02-1033.pdf
03/08/2012 Wafer Fabrication Facility Wafer foundry request. PCAN_12-0206-01-1033.pdf
02/07/2011 Datasheet change: Datasheet is revised to increase the maximum driver output enable and disable times from 900ns to 1500ns for RS-485/RS-422 slew rate limited mode with a data rate of up to 250kbps. To correct typo errors. PCN_11-0201-01-1033.pdf
07/30/2010 Process Change. Capacity enhancement. PCN_10-0715-01-1033.pdf
07/15/2010 Change in packing quantity per reel and also carrier tape width/pitch. Standardization PCN_10-0706-02-1033.pdf