XRT86VL38

8-Channel T1/E1/J1 Framer and Line Interface Combination featuring R³ Technology™
Data Sheets OBS (Obsolete)

Overview

# of Channels 8
Data Rate(s) T1/E1/J1
Clk Rec Yes
SH/LH S/L
Temperature Range (°C) Ind.
Op Pwr Sup/Max Cur 3.3V +/-5%
Package BGA-484
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Building on Exar's heritage of delivering market-proven silicon solutions, the Company is capitalizing on its already established functional element devices: Line Interface Unit (LIU), framers, etc., and is combining them into one highly integrated product. The XRT86VL38 and XRT86VL34 greatly reduce board space requirements. They are targeted at telecommunications equipment including SONET/SDH and T1/E1/J1 multiplexers, digital cross-connect systems, wireless base stations, routers among others.

Product Details

The device is offered in eight and four-channel versions incorporating a T1/E1 (1.544 Mbit/s or 2.048 Mbt/s) framer and a LIU per channel. Each of the framers has its own framing synchronizer and transmit-receive slip buffers. The slip buffers can be independently enabled or disabled as required. Each framer also contains a transmit and overhead data input port, which permits data line terminal equipment direct access to the out-bound T1/E1/J1 frames. The device has a flexible microprocessor interface for easy configuration, control, and status monitoring. Furthermore, the device supports Channel Associated Signaling (CAS), Common Channel Signaling (CCS), supports ISDN primary Rate Interface (ISDN PRI) signaling and has three integrated HDLC controllers with two 96-byte transmit HDLC buffers and two 96-byte receive buffers per channel. In addition, the XRT86L38 and XRT86L34 includes a PRBS, QRSS and network loop code generator/receiver. It also detects OOF, LOF, LOS errors and COFA conditions.

R³ Technology™ Overview

Exar's R³ Technology™ (Reconfigurable, Relayless Redundancy) delivers key benefits to customers designing T1/E1/J1 interface cards. The devices are Reconfigurable with integrated termination supporting all common T1/E1/J1 line impedances enabling customers to build one board with a single bill-of-materials. (Conventional approaches require fixed settings - T1, or E1, or J1, forcing customers to estimate both market needs, and choose device settings before manufacturing.) Also, the series employs Relayless Redundancy eliminating the need for external relays for 1:1 and 1+1 applications by establishing a back-up channel that can be brought on-line in the event of failure.

  • Eight and Four-channel Independent, Full Duplex DS1 Tx and Rx Framers and LIUs
  • Interfaces with Leading Microprocessors: Intel, Motorola, MIPS, Power PC
  • Three Integrated HDLC Controllers with Two 96-byte Transmit HDLC Buffers and Two 96-byte Receive Buffers per Channel
  • Pb-Free, RoHS Compliant Versions Offered

  • Channel Service Units (CSUs)
  • Digital Access Cross-connect Systems (DACs)
  • Wireless Base Stations
  • Voice Over Packet Gateways
  • Framer Relay Switches and Access Devices (FRADS)

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets XRT86VL3x T1/E1/J1 FRAMER/LIU Combo - Architecture Description 1.2.3 October 2007 1.3 MB
Data Sheets XRT86VL38 Octal T1/E1/J1 FRAMER/LIU Combo - E1 Register Description 1.2.1 April 2007 2.8 MB
Data Sheets XRT86VL38 Octal T1/E1/J1 FRAMER/LIU Combo - Hardware Description 1.2.1 March 2007 1.8 MB
Data Sheets XRT86VL38 Octal T1/E1/J1 FRAMER/LIU Combo - Hardware Description 1.2.0 January 2007 1.7 MB
Data Sheets XRT86VL38 Octal T1/E1/J1 FRAMER/LIU Combo - T1 Register Description 1.2.0 January 2007 2.5 MB
Application Notes TAN-064, XRT86VL3x Interface Description 1.0.0 October 2007 33.7 KB
Application Notes TAN-200, MaxLinear APIs - OS Portability 1.0.0 August 2007 88.5 KB
Application Notes TAN-065, XRT86VL3x Physical Interface 1.0.0 July 2007 75.9 KB
Application Notes TAN-062, XRT86VL3x Processing HDLC Messages 1.0.0 February 2007 70.8 KB
Application Notes TAN-060, Converting From XRT86L3x to XRT86VL3x 1.0.0 October 2006 19 KB
Application Notes TAN-058, DS-1/E1 GR-1089 Surge Protection 1.0.1 September 2006 69.4 KB
Application Notes TAN-059, DS-1/E1 Line Recovered Clock PLL Timing 1.0.0 July 2006 23.4 KB
Application Notes TAN-057, DS1/E1 Layout Recommendations 1.0.0 June 2006 30 KB
Application Notes TAN-063, XRT86VL3x HMVIP High Speed Multiplexed Mode 1.0.0 April 2005 216.9 KB
Application Notes TAN-067, R3 Technology For T/E Carrier Redundancy Applications 1.0.0 April 2004 203.4 KB
Application Notes TAN-053, Line Card Redundancy Design With the XRT83SL38 T1/E1 SH/LH LIU ICs 1.3.0 November 2003 158.1 KB
Application Notes TAN-056, High Impedance Drivers During Power Failure Using XRT83SL3X/L3X LIU 1.0.0 November 2003 75.1 KB
Schematics & Design Files Device Schematic (BGA-420) 3.0.0 May 2006 156.9 KB
Schematics & Design Files Device Schematic (BGA-484) 1.0.0 April 2005 159.6 KB
Simulation Models
Package Type Vcc Temp Mode Version File
PBGA 3.3V Industrial 2
STBGA 3.3V Industrial 2
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Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement PDN
XRT86VL38IB PBGA420 -40 85 OBS XRT86VX38IB256-F
XRT86VL38IB-F PBGA420 -40 85 OBS XRT86VX38IB256-F
XRT86VL38IB484 L-fpBGA484 -40 85 OBS XRT86VX38IB256-F
XRT86VL38IB484-F L-fpBGA484 -40 85 OBS XRT86VX38IB256-F
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Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
L-fpBGA484
  • JEDEC Reference: MO-192
  • MSL Pb-Free: L4 @ 245ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 19.5ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: n/a
  • Quantity per Tray: 60
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: mm
  • Length: 23
  • Width: 23
  • Thickness: 1.94
  • Lead Pitch: 1.00
PBGA420
  • JEDEC Reference: n/a
  • MSL Pb-Free: L4 @ 245ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 9.4ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: n/a
  • Quantity per Tray: 24.00
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: mm
  • Length: 35.00
  • Width: 35.00
  • Thickness: 2.33
  • Lead Pitch: 1.27

Notifications

Distribution Date Description File
07/12/2017 Product Discontinuation Notice
03/20/2017 Material Change: Substrate material are changed from halogen type to halogen free type.
07/26/2016 Product discontinuation notification. Discontinued.
07/18/2014 Material Change. UTAC qualification to use mold compound KSG1250LKDS, in addition to current qualified mold compound KMC2520AL.
07/14/2014 Material Change. UTAC qualification to use mold compound KEG1250LKDS, in addition to current qualified mold compound KMC2520AL.

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