XRP7620

4-Channel Adjustable Current I²C Controlled LED Driver
Data Sheets OBS (Obsolete)

Overview

# of Channels 4
Max Current/Ch (mA) 31.5
LEDs/ Ch. 1
Operating Voltage (MIN) (V) 2.5
Operating Voltage (MAX) (V) 5.5
Dropout Voltage (mV) 100
Ch./ Ch. Accuracy (%) 3
Control Interface I2C
Package DFN-8
Application General
Features RGBW/RGBA color mixing applications, Independent channel current programming, Over temperature protection
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The XRP7620 is a multi purpose 4-channel independently adjustable current sink driver. Optimized for LED backlighting and RGBW/RGBA color mixing applications, the XRP7620 can also be used as a generic software programmable current sink I/O expander.

Supporting an industry standard 2-line I²C serial interface, the XRP7620 provides full independent control of each channel and can be programmed up to a current of 31.5mA in steps of 500µA. Uniform display brightness is ensured through a better than 3% channel-to-channel current matching. Five internal registers are provided to set operational configuration and individual channel current programmation. A specific shutdown mode allows the device to retain the previously loaded configuration – operational and current programming – in order to be reused upon the next enabling.

The XRP7620 is designed to operate from a single cell lithium-ion battery or fixed 3.3V or 5.0V power rails and is available in a RoHS compliant, “green”/halogen free space saving 8-pin 2mm x 3mm DFN package

  • 4-Channel LED current sink driver
  • Individual channel current control
  • Up to 31.5mA per channel / 500µA steps
  • 100mV channel dropout voltage
  • I²C serial interface control
  • 2.7V - 5.5V input voltage range
  • 3% channel current matching
  • Configuration retention in shutdown
  • Shutdown current <1µA
  • Thermal and UVLO built-in protection
  • “Green”/halogen free 2 x 3mm 8-pin DFN package

  • LCD display and keypad backlighting
  • Color coded indicator lighting
  • RGBW/RGBA color mixing
  • Cell phones and handheld devices
  • Generic current sink I/O expander

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets XRP7620 4-Channel Adjustable Current I²C Controlled LED Driver 1.1.0 June 2012 772.9 KB
User Guides & Manuals XRP7620 Evaluation Board Manuals 1 June 2009 198.9 KB
Product Flyers 4-Channel Adjustable Current I2C Controlled LED Driver July 2009 516.4 KB
Product Brochures Power Management Brochure October 2020 2.4 MB
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Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement PDN
XRP7620IH-F DFN8 2x3 -40 100 OBS XRP7620IHTR-F
XRP7620IHTR-F DFN8 2x3 -40 100 OBS
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Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
DFN8 2x3
  • JEDEC Reference: MO-229
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 59ºC/W
  • Bulk Pack Style: Canister
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 3000
  • Quantity per Tube: n/a
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 2
  • Width: 3
  • Thickness: 1.00
  • Lead Pitch: 0.5

Notifications

Distribution Date Description File
03/02/2017 Product Discontinuation Notification
01/05/2017 Addition of an alternate qualified location, ANST, China.
07/26/2016 Product discontinuation notification. Discontinued.
10/04/2013 Addition of an alternate qualified assembly site, UTAC Thailand, for assembly using copper or gold wire bonding. Material change and alternate assembly site.