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Product Change Notifications

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Product Change Notifications
Date Distributed PCN No Part Number Description Reason
7/24/2014 PDN_14-0106-01 [PDF] XRT5894IV-F, XRT5894IVTR-F Product Discontinuation Notification Discontinued.
7/24/2014 PDN_14-0727-01 [PDF] SP7656EN2-L, SP7656EN2-L/TR Product Discontinuation Notification. Discontinued.
7/18/2014 PCN_14-0311-01 [PDF] XR17V352IB113-F, XR17V354IB176-F, XR17V358IB176-F, XRT75L06DIB-F, XRT83VSH28IB-F, XRT83VSH316IB-F, XRT86VX38IB256-F, XRT86VL38IB484, XRT83VSH314IB-SAM Material Change. UTAC qualification to use mold compound KSG1250LKDS, in addition to current qualified mold compound KMC2520AL.
7/18/2014 PCN_14-0313-01 [PDF] ST16C1550CQ48-F, ST16C1550CQ48TR-F, ST16C1550IQ48-F, ST16C450CQ48-F, ST16C450CQ48TR-F, ST16C450IQ48-F, ST16C550CQ48-F, ST16C550IQ48-F, ST16C550IQ48TR-F, ST16C580CQ48-F, ST16C580IQ48-F, ST16C650AIQ48-F... Elimination of back mark. Eliminate back mark; consolidate information in top mark.
7/16/2014 PDN_14-0418-01 [PDF] FMS3110KRC, FMS3115KRC, FMS3810KRC, FMS3815KRC, FMS3818KRC, TMC3003KRC30, TMC3003KRC50, TMC3003KRC80, TMC3003R2C30, TMC3003R2C50, TMC3003R2C80, TMC3033KRC30, TMC3033KRC50, TMC3033KRC80, TMC3033R2C30, ... Product Discontinuation Notification. Discontinued.
7/14/2014 PCN_13-0834-05 [PDF] SP3220EBCA-L/TR, SP3220EBCA-L, SP3220EBEA-L/TR, SP3220EBEA-L, SP3220ECA-L/TR, SP3220ECA-L, SP3220EEA-L/TR, SP3220EEA-L, SP3226ECA-L/TR, SP3226ECA-L, SP3226EEA-L/TR, SP3226EEA-L, SP3227ECA-L/TR, SP3227... Qualified 0.25um foundry process in TSMC and SSOP 16L in Greatek. Both copper and gold wire bonding processes qualified. Alternate Foundry and Assembly Site.
7/7/2014 PCN_14-0418-01 [PDF] CDK1300ITQ44, CDK1301ITQ44, CDK1304CSO28, CDK1304CTQ32, CDK1305CSO28, CDK1305CTQ32, CDK1306CSO28, CDK1306CTQ32, CDK3400CTQ48, CDK3400CTQ48MTR, CDK3400CTQ48X, CDK3401CTQ48, CDK3401CTQ48MTR, CDK3401CTQ4... Alternate Assembly Site. Qualified Greatek Taiwan as an alternate assembly site for the listed products.
6/4/2014 PCN_14-0520-01 [PDF] SP3232EUCA-L, SP3232EUCA-L/TR, SP3232EUEA-L, SP3232EUEA-L/TR, SP3232EUCN-L, SP3232EUCN-L/TR, SP3232EHEY-L, SP3232EHEY-L/TR, SP3232EUCY-L, SP3232EUCY-L/TR, SP3232EHCY-L, SP3232EHCY-L/TR, SP3232EUEY-L, ... Qualification of alternate foundry site, TSMC, using 0.25um CMOS process. Qualification of alternate assembly site, Carsem, for SOIC and TSSOP packages. Qualification of alternate assembly site, Greatek, for SSOP packages. Alternate Foundry & Assembly Site.
5/22/2014 PCN_13-0834-01 [PDF] SP233ACP-L, SP233ACT-L, SP233ACT-L/TR, SP233AEP-L, SP233AET-L, SP233AET-L/TR, SP233ECT-L, SP233ECT-L/TR, SP233EET-L, SP233EET-L/TR Qualification of Greatek, Taiwan, for assembly of 20L WSOIC and 20L PDIP, in addition to the current production site, Cirtek, Philippines. Alternate Assembly Site.
4/28/2014 PCN_14-0415-01 [PDF] SP6699EK-L/TR Design and datasheet changes. The SP6699 has been updated to improve compatibility with PWM dimming inputs.
4/14/2014 PCN_14-0414-02 [PDF] SP34063AEN-L, SP34063AEN-L/TR The SP34063A die has been revised to accommodate copper wire bonding assembly. Material and design changes.
4/2/2014 PCN_13-0729-02 [PDF] XR16L2550IL-F, XR16L2550ILTR-F, XR16L2551IL-F, XR16L2551ILTR-F, XR16L570IL24-F, XR16L570IL24TR-F, XR16L570IL32-F, XR16L570IL32TR-F, XR16L580IL24-F, XR16L580IL24TR-F, XR16L580IL-F, XR16L580ILTR-F, XR16... Qualified UTAC Thailand for assembly using copper wire or gold wire bonding assembly, in addition to the current qualified gold wire bonding assembly sites, Unisem Batam and UTAC China. Material change and alternate assembly site.
4/2/2014 PCN_13-0834-03 [PDF] ST16C1450CJ28-F, ST16C1450CJ28TR-F, ST16C1450IJ28-F, ST16C1450IJ28TR-F, ST16C1550CJ28-F, ST16C1550CJ28TR-F, ST16C1550IJ28-F, ST16C1550IJ28TR-F, ST16C1551CJ28-F, ST16C1551CJ28TR-F, ST16C1551IJ28-F, ST1... Qualification of ASE Malaysia for assembly of 28, 44, 68L PLCC packaged products. Alternate assembly site.
3/13/2014 PCN_13-1040-01 [PDF] SPX1431M1-L/TR, SPX1431M1-L, SPX431LM1-L/TR, SPX431LM1-L Qualification of an alternate SOT89 package assembly site, Greatek, Taiwan, in addition to the current qualified assembly site, Cirtek, Philippines. Alternate assembly site.
2/28/2014 PCN_13-1147-02 [PDF] XRT7295ATIW-F, XRT7295ATIWTR-F, XRT7295CTIW-F, XRT7295CTIWTR-F Qualification of the 20L SOJ production site, Greatek, Taiwan. Assembly site.
2/26/2014 PCN_13-1040-03 [PDF] SP310ECT-L/TR, SP310ECT-L, SP310EET-L/TR, SP310EET-L, SP312ACT-L/TR, SP312ACT-L, SP312AET-L/TR, SP312AET-L, SP312ECT-L/TR, SP312ECT-L, SP312EET-L/TR, SP312EET-L, SP3222EBCT-L/TR, SP3222EBCT-L, SP3222E... Qualification of an alternate qualified 18L WSOIC production site, Greatek, Taiwan, in addition to the current production site, Cirtek, Philippines. Alternate assembly site.
2/13/2014 PDN_13-1144-01 [PDF] PEB1756AE, PEB1756AE-L, PEB1757AE, PEB1757AE-L Product Discontinuation Notification Discontinued.
1/27/2014 PCN 13-0834-02 Greatek 8-14-16-40 PDIP [PDF] CLC1200IDP8, SP202ECP-L, SP202EEP-L, SP232ACP-L, SP232AEP-L, SP232ECP-L, SP232EEP-L, SP3232ECP-L, SP3232EEP-L, SP483ECP-L, SP483EEP-L, SP485CS-L, SP485ECP-L, SP485EEP-L, SP485ES-L, SP485RCP-L, SP485RE... Addition of an alternate qualified 8, 14, 16, 40 PDIP assembly site, Greatek, Taiwan. Alternate assembly site.
1/24/2014 PCAN_13-1147-02 [PDF] XRT7295ATIW-F, XRT7295ATIWTR-F, XRT7295CTIW-F, XRT7295CTIWTR-F Qualification of a 20L SOJ assembly site, Greatek, Taiwan. Alternate assembly site.
1/13/2014 PCN_13-1040-02 [PDF] LP2950ACN-L-3-3/TR, LP2950ACN-L-3-3, LP2950ACN-L-5-0/TR, LP2950ACN-L-5-0, LP2950CN-L-3-3/TR, LP2950CN-L-3-3, LP2950CN-L-5-0/TR, LP2950CN-L-5-0, SPX385N-L-2-5/TR, SPX385N-L-2-5, SPX431LAN-L/TR, SPX431L... Qualification of an alternate qualified 3L TO-92 production site, Greatek, Taiwan, in addition to the current production site, Carsem, Malaysia. Alternate assembly site.
12/5/2013 PCN_13-0521-02 [PDF] ST16C2450CQ48-F, ST16C2450CQ48TR-F, ST16C2450IQ48-F, ST16C2450IQ48TR-F, ST16C2550CQ48-F, ST16C2550CQ48TR-F, ST16C2550IQ48-F, ST16C2550IQ48TR-F, XR16C2550IM-F, XR16C2550IMTR-F, XR16L2550IM-F, XR16L2550... Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan) for assembly using copper or gold wire bonding. Material change and alternate assembly site.
12/5/2013 PCN_13-0623-03A [PDF] CDK3401CTQ48, SP503CM-L, SP510EM-L, SP510EM-L/TR, SP508ECF-L, SP508EEF-L, SP510CM-L/TR, SP510CM-L, SP510ECF-L, SP510EEF-L, XRT7300IVTR-F, XRT81L27IV-F, ST16C554CQ64-F,ST16C554CQ64TR-F, ST16C554DCQ64-F... Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Alternate assembly site.
11/26/2013 PDN_13-1003-01A [PDF] XRT83SL34IV-STC-F Product Discontinuation Notification Discontinued.
11/26/2013 PDN_13-1146-01 [PDF] XRP7657EDTR-F Product Discontinuation Notification Discontinued.
11/22/2013 PCN_13-0834-04 [PDF] XRT7296IW-F, XRT7296IWTR-F, XRT8220IW-F, XRT8220IWTR-F, XRT82D20IW-F, XRT82D20IWTR-F, XRT83D10IW-F, XRT83D10IWTR-F Qualification of an alternate qualified 28L SOJ production site, Greatek, Taiwan. Alternate assembly site.
11/20/2013 PCN_13-0832-04R [PDF] XRT86VX38IB329-F, XRT86VX38IB256-F Qualified copper wire bonding assembly and changed die revision from A to B. Material and design changes.
10/18/2013 PCN_13-1042-01 [PDF] XR20M1172IL32-F, XR20M1172IL32TR-F, XR20M1172IG28-F, XR20M1172IG28TR-F In the datasheet, added clarification that the part is specified in FIFO-enabled mode. Datasheet change.
10/16/2013 PCN_13-0936-01 [PDF] SP7650ER-L/TR, SP7650ER-L, SP7651ER-L/TR, SP7651ER-L, SP7652ER-L/TR, SP7652ER-L, SP7653ER-L/TR, SP7653ER-L Qualified PPF (NiPdAu) lead termination finish in assembly to replace matte-tin plating. Material change.
10/15/2013 PCN_13-0727-03 [PDF] SPX1117M3-L/MTR, SPX1117M3-L/TR, SPX1117M3-L, SPX1117M3-L-1-5/MTR, SPX1117M3-L-1-5/TR, SPX1117M3-L-1-5, SPX1117M3-L-1-8/MTR, SPX1117M3-L-1-8/TR, SPX1117M3-L-1-8, SPX1117M3-L-2-5/MTR, SPX1117M3-L-2-5/T... Qualification of an alternate qualified SOT223 production site, JCET Chuzhou, in addition to the current production site, JCET Jiangyin. Alternate assembly site.
10/4/2013 PCN_13-0522-04 [PDF] SP6201ER-L, SP6201ER-L/TR, SP6201ER-L-1-8, SP6201ER-L-1-8/TR, SP6201ER-L-3-3, SP6201ER-L-3-3/TR, SP6203ER-L, SP6203ER-L/MTR, SP6203ER-L/TR, SP6203ER-L-1-8, SP6203ER-L-1-8/MTR, SP6203ER-L-1-8/TR, SP620... Addition of an alternate qualified assembly site, UTAC Thailand, for assembly using copper or gold wire bonding. Material change and alternate assembly site.
10/3/2013 PDN_13-1003-01 [PDF] SP310ACT-L, SP310ACT-L/TR, SP310AET-L, SP310AET-L/TR, SP6125EK1-L, SP6125EK1-L/MTR, SP6125EK1-L/TR, SP6127EK1-L, SP6127EK1-L/TR, SP6655ER-L, SP6655ER-L/TR, SP7120BEK-L/TR, SP7121EK-F, SP7121EK-F/TR, S... Product Discontinuation Notification Discontinued.
10/3/2013 PCN_13-0522-02 [PDF] SP211EHCA-L/TR, SP211EHCA-L, SP211EHCT-L/TR, SP211EHCT-L, SP211EHEA-L/TR SP211EHEA-L, SP211EHET-L/TR SP211EHET-L, SP213EHCA-L/TR, SP213EHCA-L SP213EHEA-L/TR, SP213EHEA-L, SP2209EEY-L/TR, SP2209EEY-L, ... Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes.
10/3/2013 PCN_13-0623-03 [PDF] SP3508CF-L, SP3508EF-L, SP504MCM-L, SP505ACM-L, SP505BCM-L, SP506CM-L, SP507CM-L, SP508CF-L, SP508EF-L, ST16C1450CQ48-F, ST16C1450CQ48TR-F, ST16C1450IQ48-F, ST16C1450IQ48TR-F, ST16C1550CQ48-F, ST16C15... Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Material change and alternate assembly site.
9/16/2013 PCN_13-0730-02 [PDF] SP3232EEN-L, SP3232EEN-L/TR, SP3232ECN-L, SP3232ECN-L/TR, SP3232EEY-L, SP3232EEY-L/TR, SP3232ECY-L, SP3232ECY-L/TR, SP3232EBEN-L, SP3232EBEN-L/TR, SP3232EBCN-L, SP3232EBCN-L/TR, SP3232EBEY-L, SP3232EB... Qualification of an alternate foundry TSMC using 0.25um CMOS process. Alternate Foundry Site & Process Changes.
9/9/2013 PCN_13-0521-01 [PDF] SP3222EBCA-L, SP3222EBCA-L/TR, SP3222EBEA-L, SP3222EBEA-L/TR, SP3222ECA-L, SP3222ECA-L/TR, SP3222EEA-L, SP3222EEA-L/TR, SP3223EBCA-L, SP3223EBCA-L/TR, SP3223EBEA-L, SP3223EBEA-L/TR, SP3223ECA-L, SP32... Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 20 and 28 lead SSOP package using copper wire bonding. Material Change
9/9/2013 PCN_13-0730-01 [PDF] SP3070EEN-L, SP3070EEN-L/TR, SP3071EEN-L, SP3071EEN-L/TR, SP3072EEN-L, SP3072EEN-L/TR, SP3073EEN-L, SP3073EEN-L/TR, SP3074EEN-L, SP3074EEN-L/TR, SP3075EEN-L, SP3075EEN-L/TR, SP3076EEN-L, SP3076EEN-L/T... Qualification of 0.25um CMOS process at TSMC and alternate assembly sites, Carsem (for 8 and 14L nSOIC) and ASE Chung-Li (for 8L nSOIC). Process Change and Alternate Foundry & Assembly/Test Site.
9/9/2013 PCN_13-0623-02 [PDF] SPX1117M3-L/MTR, SPX1117M3-L/TR, SPX1117M3-L, SPX1117M3-L-1-5/MTR, SPX1117M3-L-1-5/TR, SPX1117M3-L-1-5, SPX1117M3-L-1-8/MTR, SPX1117M3-L-1-8/TR, SPX1117M3-L-1-8, SPX1117M3-L-2-5/MTR, SPX1117M3-L-2-5/T... Addition of an alternate qualified SOT-223 assembly site, Carsem (Malaysia) using Hitachi CEL9240 molding compound, in addition to the current qualified assembly site, Unisem (Ipoh) using Sumitomo G600 molding compound. Material Change & Alternate Assembly Site.
9/5/2013 PDN_13-0905-01 [PDF] 1600R, 1605R, 1610R, 1615R, 1620R, 1625R, 9725HG Product Discontinuation Notification Discontinued.
8/16/2013 PCN_13-0503-01 [PDF] SP481ECN-L, SP481ECN-L/TR, SP481EEN-L, SP481EEN-L/TR, SP485ECN-L, SP485ECN-L/TR, SP485ECP-L, SP485EEN-L, SP485EEN-L/TR, SP485EEP-L, SP485EMN-L, SP485EMN-L/TR, SP490ECN-L, SP490ECN-L/TR, SP490ECP-L, SP... Remove 8KV contact discharge ESD specification to align with Industry Standard ESD specifications for Serial Transceiver products. Datasheet correction.
8/16/2013 PCN_13-0729-01 [PDF] XRP7724ILB-F, XRP7724ILBTR-F Addition of an alternate qualified site, UTAC Thailand, for assembly using copper or gold wire, in addition to the current qualified site, Unisem Malaysia, for assembly using gold wire. Material change & additional qualified Assembly Site.
7/30/2013 PCN_13-0521-03a [PDF] SP619EK-L/TR, SP619EK-L/TRR3, SP619EK-L, SP6200EM5-L-3-0/TR, SP6200EM5-L-3-0, SP6201EM5-G-3-3/TR, SP6201EM5-G-3-3, SP6201EM5-L/TR, SP6201EM5-L, SP6201EM5-L-1-5/MTR, SP6201EM5-L-1-5/TR, SP6201EM5-L-1-5... Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for SOT23 package using copper wire bonding. Material Change.
7/29/2013 PCN_13-0519-02 [PDF] XRP7659ISTR-F Qualified ABLECOAT 8008 (wafer back-side coated) die attach material in assembly to replace ABLEBOND 8290 (dispense type) die attach material. Material Change
7/26/2013 PCN_13-0507-02 [PDF] SP1481ECN-L, SP1481ECN-L/TR, SP1481EEN-L, SP1481EEN-L/TR, SP1485ECN-L, SP1485ECN-L/TR, SP1485EEN-L, SP1485EEN-L/TR, SP1485EMN-L, SP1485EMN-L/TR, SP1490ECN-L, SP1490ECN-L/TR, SP1490EEN-L, SP1490EEN-L/T... 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes.
7/15/2013 PCN_13-0728-03a [PDF] Starting Codes: 1324 (SPX1431M1-L, SPX1431M1-L/TR), 1322 (SPX431LM1-L, SPX431LM1-L/TR) Package marking change. To add manufacturing date code and lot traceability.
7/4/2013 PDN_13-0704-01 [PDF] 7956PT6/2-G Product Discontinuation Notification Discontinued.
7/3/2013 PCN_13-0507-01 [PDF] SP1486EEN-L/TR, SP1486EEN-L, SP3080EEN-L/TR, SP3080EEN-L, SP3081EEN-L, SP3081EEN-L/TR, SP3082EEN-L, SP3082EEN-L/TR, SP3083EEN-L/TR, SP3083EEN-L, SP3084EEN-L/TR, SP3084EEN-L, SP3085EEN-L/TR, SP3085EEN-... Addition of qualified 6 inch wafer processing line in Episil, in addition to the currently qualified 5 inch wafer processing line. Other change (foundry 6 inch wafer qualification).
7/2/2013 PCN_12-1106-01 [PDF] SP483ECP-L, SP483EEP-L, SP485CS-L, SP485ECP-L, SP485EEP-L, SP485ES-L, SP485RCP-L, SP485REP-L, SP490ECP-L, SP490EEP-L, SP690ACP-L, SP690AEP-L, SP813LCP-L, SP813LEP-L, XR2209CP-F, XR4151CP-F, XRD5408AIP... Qualification of an alternate qualified PDIP assembly site, Cirtek (Philippines), in addition to the current assembly site, Unisem (Malaysia). Alternate assembly site.
7/2/2013 PCN_12-1107-01 [PDF] LP2951CS-L-3-3, SP1481ECN-L/TR, SP1485EEN-L, SP1486EEN-L/TR, SP3071EEN-L, SP3072EEN-L/TR, SP3074EMN-L, SP3075EMN-L/TR, SP3078EEN-L, SP3081EEN-L/TR, SP3084EEN-L/TR, SP3087EEN-L, SP3483CN-L/TR, SP3485EN... Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified.
7/2/2013 PCN_12-1129-01 [PDF] SP206CT-L, SP206CT-L/TR, SP206ET-L, SP206ET-L/TR, SP207CT-L, SP207CT-L/TR, SP207ECT-L, SP207ECT-L/TR, SP207EET-L, SP207EET-L/TR, SP207ET-L, SP207ET-L/TR, SP208CT-L, SP208CT-L/TR, SP208ECT-L, SP208ECT-... Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change.
7/2/2013 PCN_13-0128-01 [PDF] SP202ECN-L, SP202ECN-L/TR, SP202EEN-L, SP202EEN-L/TR, SP232ACN-L, SP232ACN-L/TR, SP232AEN-L, SP232AEN-L/TR, SP232ECN-L, SP232ECN-L/TR, SP232EEN-L, SP232EEN-L/TR, SP3070EEN-L, SP3070EEN-L/TR, SP3070EMN... Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 14 and 16 lead NSOIC package using copper wire bonding. Material change.
7/2/2013 PCN_13-0501-01 [PDF] XR16C854CJ-F, XR16C854DCV-F, XR16C854IV-F, XR16C854CJTR-F, XR16C854DCVTR-F, XR16C854IVTR-F, XR16C854CQ-F, XR16C854IJ-F, XR16C854DIV-F, XR16C854CQTR-F, XR16C854IJTR-F, XR16C854DIVTR-F, XR16C854CV-F, XR... AC Electrical Characteristics updated in datasheet. Datasheet change.
7/2/2013 PCN_13-0501-02 [PDF] XR16C864CQ-F, XR16C864IQ-F, XR16C864CQTR-F, XR16C864IQTR-F AC Electrical Characteristics updated in datasheet. Datasheet change.
6/17/2013 PCN_13-0519-01 [PDF] XRP7664IDTR-F & XRP7665IDBTR-F Addition of an alternate qualified wafer foundry. Process change.
5/31/2013 PCN_13-0414-01 [PDF] XRP6657IHBTR-F Lead-frame plate from PPF to non-PPF lead-finish + Sn plating. Wire material change from gold to copper wire. Material change.
5/23/2013 PCN_13-0125-02 [PDF] SP3220EBCY-L, SP3220EBCY-L/TR, SP3220EBEY-L, SP3220EBEY-L/TR, SP3220ECY-L, SP3220ECY-L/TR, SP3220EEY-L, SP3220EEY-L/TR, SP3220EUCY-L, SP3220EUCY-L/TR, SP3220EUEY-L, SP3220EUEY-L/TR, SP3232EBCY-L, SP32... Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change.
5/23/2013 PCN_13-0125-03 [PDF] SP385ECA-L, SP385ECA-L/TR, SP385EEA-L, SP385EEA-L/TR, SP211CA-L, SP211CA-L/TR, SP211EA-L, SP211EA-L/TR, SP211ECA-L, SP211ECA-L/TR, SP211EEA-L, SP211EEA-L/TR, SP211EHCA-L, SP211EHCA-L/TR, SP211EHEA-L, ... Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change.
5/22/2013 PCN_12-0726-01 [PDF] SP1086V1-L-3-3/TR, SP7805V-LSPX2940T-L-5-0/TR, SP317V2-L/TR, SPX29150T-L-3-3/TR, SPX2940U-L-5-0, SP7805V2-L/TR, SPX29150T-L-5-0/TR, SPX431AN-L/TR Addition of JCET as an alternate qualified assembly and test location. Process & material change.
5/7/2013 PCN_13-0502-01 SPX431AM1-L_TR [PDF] SPX431AM1-L/TR (SOT-89 package) Addition of alternate Assembly and Test Site JCET (Chuzhou). Process change.
5/6/2013 PCN_12-0522-04 [PDF] SP508CF-L, SP508EF-L Change in wafer fabrication foundry and part numbers. Qualification of an alternate qualified wafer foundry, Silan, in addition to the current wafer foundry, Episil Technologies. Process & datasheet changes.
5/6/2013 PCN_12-0522-03 SP510E [PDF] SP510CM-L, SP510EM-L Change in wafer fabrication foundry and part numbers. Qualification of an alternate qualified wafer foundry, Silan, in addition to the current wafer foundry, Episil Technologies. Process & datasheet changes.
5/6/2013 PCN_13-0313-02A-SP3080E-88E [PDF] SP3080EEN-L/TR, SP3080EEN-L, SP3081EEN-L/TR, SP3081EEN-L, SP3082EEN-L/TR, SP3082EEN-L, SP3083EEN-L/TR, SP3083EEN-L, SP3084EEN-L/TR, SP3084EEN-L, SP3085EEN-L/TR, SP3085EEN-L, SP3086EEN-L/TR, SP3086EEN-... Qualified TSMC as an alternate foundry supplier. Qualified Cu wire bonding assembly process at Carsem, Ipoh, Malaysia and ASE, Chung-Li, Taiwan. Alternate foundry supplier.
4/17/2013 PCN_13-0402-01 [PDF] XRP7664IDTR-F Design & Datasheet Changes. Product Improvement and compatibility with industry equivalent devices.
4/8/2013 PCN_13-0402-02 [PDF] XRP7665IDBTR-F Die Revision Product Improvement and compatibility with industry equivalent devices.
3/19/2013 PDN_13-0315-01 [PDF] XRT73L03BIV, XRT81L27IV, XRT71D04IV, XRT73L04BIV, XRT73LC00AIV, XRT73LC00AIVTR, XRT73LC03AIV, XRT73LC04AIV, XRT75L00IV, XRT75L03DIV, XRT75L03IV, XRT75L04DIV, XRT75L04IV, XRT75R03IV, XRT83L34IVTR, XRT9... Product Discontinuation Notification Discontinued.
2/25/2013 PDN_13-0225-01 [PDF] 1050P Product Discontinuation Notification Discontinued.
1/25/2013 PCN_12-1009-01 [PDF] SP339ECR1-L, SP339ECR1-L/TR, SP339EER1-L, SP339EER1-L-TR The ESD performance of the die has been improved to pass ± 15KV air gap discharge model, as specified by IEC-61000-4-2. The ESD tolerance of the non-bus pins has also been increased from ±2kV to ±4kV HBM (Human Body Model). The Exar product datasheet has been revised to include these improved ratings. There are no other changes to Form, Fit, or Function, as per the applicable datasheets. To improve product performance.
1/21/2013 PDN_13-0121-01 [PDF] XRT83SL216IB-F Product Discontinuation Notification Discontinued due to low market demand.
10/17/2012 PCN_12-0824-01 [PDF] ST16C1450CJ28-F, ST16C1450CJ28TR-F, ST16C1450IJ28-F, ST16C1450IJ28TR-F, ST16C1550CJ28-F, ST16C1550CJ28TR-F, ST16C1550IJ28-F, ST16C1550IJ28TR-F, ST16C1551CJ28-F, ST16C1551CJ28TR-F, ST16C1551IJ28-F, ST1... Exar has qualified Millennium Microtech/Thailand as an alternate assembly supplier for 28, 44 and 68 lead PLCC packages in addition to the existing supplier, Unisem/Indonesia. Capacity enhancement
10/12/2012 PCN_12-0726-03 [PDF] XRT81L27IV Lead finish plating is changed from Sn/Pb to pure matte tin. Assembly supplier no longer supports leaded products in order to comply with the environment-friendly demands.
9/24/2012 PCN_12-0914-01 [PDF] SP202ECT-L, SP202ECT-L/TR, SP202EET-L, SP202EET-L/TR, SP232ACT-L, SP232ACT-L/TR, SP232AET-L, SP232AET-L/TR, SP232ECT-L, SP232ECT-L/TR, SP232EET-L, SP232EET-L/TR, SP3232EBCT-L, SP3232EBCT-L/TR, SP3232E... Material Change - Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity.
9/21/2012 PCN_12-0913-02 [PDF] SP233ACT-L, SP233ACT-L/TR, SP233AET-L, SP233AET-L/TR, SP233ACP-L, SP233AEP-L, SP233ECT-L, SP233ECT-L/TR, SP233EET-L, SP233EET-L/TR New Assembly Supplier, Cirtek, Philippines. CEI, Thailand, has been damaged due to the flooding and is out of business.
8/24/2012 PCN_12-0712-05 [PDF] SP3222EBCA-L, SP3222EBCA-L/TR, SP3222EBEA-L, SP3222EBEA-L/TR, SP3222ECA-L, SP3222ECA-L/TR, SP3222EEA-L, SP3222EEA-L/TR, SP3223EBCA-L, SP3223EBCA-L/TR, SP3223EBEA-L, SP3223EBEA-L/TR, SP3223ECA-L, SP322... Material Change - Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity.
8/22/2012 PDN_12-0822-01 [PDF] SP6330EK1-L-W-G-C, SP6330EK1-L-W-G-C/TR, SP6330EK1-L-X-J-C, SP6330EK1-L-X-J-C/TR, SP6330EK1-L-Z-J-C, SP6330EK1-L-Z-J-C/TR Product Discontinuation Notice. Discontinued due to low market demand.
8/16/2012 PCN_12-0726-02 [PDF] SPX1117M3-L, SPX1117M3-L/TR, SPX1117M3-L-1-5, SPX1117M3-L-1-5/TR, SPX1117M3-L-1-8, SPX1117M3-L-1-8/TR, SPX1117M3-L-2-5, SPX1117M3-L-2-5/TR, SPX1117M3-L-3-3, SPX1117M3-L-3-3/TR, SPX1117M3-L-5-0, SPX111... Material Change: Bonding wires are changed from 1.3 mils gold to 1.0 mils copper. Die attach material is also changed from ABLESTIK/8290 to NAMICS/9800. To update our manufacturing to be compatible with current industry standards and maintain capacity.
8/16/2012 PCN_12-0522-01 [PDF] XRP2997IDB-F, XRP6272IDB-F, XRP6272ITC5TR-F, SP809EK-L-x-x, SP809NEK-L-x-x, SP810EK-L-x-x Material change: Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity.
7/27/2012 PCN_12-0614-02 [PDF] XR20M1170IL24-F, XR20M1170IL24TR-F, XR20M1170IL16-F, XR20M1170IL16TR-F, XR20M1170IG24-F, XR20M1170IG24TR-F, XR20M1170IG16-F, XR20M1170IG16TR-F, XR20M1172IL32-F, XR20M1172IL32TR-F, XR20M1172IG28-F, XR2... Datasheet change. Product recharacterization.
5/28/2012 PDN_12-0528-01 [PDF] GLZ1100-01-PBAI, GLZ1200-02-HSAI, GLZ1215-04-CSAI, GLZ1215-04-CSBI, GLZ3300-04-CSAI, GLZ3300-04-CSBI, GLZ3301-02-CSAI, GLZ3301-02-CSBI, GLZ4300-04-CSAI, GLZ4300-04-CSBI, GLZ4301-02-CSAI, GLZ4301-02-CS... Product Discontinuation Notice. Discontinued due to low market demand.
5/2/2012 PDN_12-0502-01 [PDF] XRT72L52IQ-F, XRT72L52IQTR-F, XRT72L53IB-F, XRT72L54IB, XRT72L54IB-F, XRT72L56IB, XRT72L58IB, XRT72L71IQ, XRT72L71IQ-F, XRT72L52ES-PCI, XRT72L53ES-PCI, XRT72L53-75L03PC1, XRT72L53-75L03DPC, XRT72L54ES... Product Discontinuation Notice. Discontinued due to low market demand.
4/19/2012 PCN_12-0419-01 [PDF] SP7662ER-L, SP7662ER-L/TR Change in FET supplier. Due to unavailability of the ANPEC FETs.
4/19/2012 PCN_12-0419-02 [PDF] SP7663ER-L, SP7663ER-L/TR Change in FET supplier. Due to unavailability of the ANPEC FETs.
3/30/2012 PCN_12-0305-01 [PDF] XR21V1410, XR21V1412, XR21V1414 XR21V141x Product Change from Rev B to Rev D Product improvement.
3/21/2012 PDN_12-0319-01 [PDF] XR3170EID-F, XR3170EIDTR-F, XR3171EID-F, XR3171EIDTR-F, XR3172EID-F, XR3172EIDTR-F, XR3173EID-F, XR3173EIDTR-F, XR3174EID-F, XR3174EIDTR-F, XR3175EID-F, XR3175EIDTR-F, XR3176EID-F, XR3176EIDTR-F, XR31... Product Discontinuation Notice. Discontinued due to low market demand.
3/8/2012 PCAN_12-0206-01 [PDF] SP336ECT-L/TR, SP336ECY-L, SP336ECY-L/TR, SP336EET-L, SP336EET-L/TR, SP336EEY-L, SP336EEY-L/TR, SP337EBCT-L/TR, SP337EBCY-L, SP337EBCY-L/TR, SP337EBET-L, SP337EBET-L/TR, SP337EBEY-L, SP337EBEY-L/TR, S... Wafer Fabrication Facility Wafer foundry request.
3/5/2012 PDN_12-0305-01 [PDF] XRT3588CP-F, XRT5620CP-F, XRT5683AIP-F, XRT8000IP-F, XRT8001IP-F Product Discontinuation Notice. Discontinuance of the .300” PDIP package by our assembly supplier.
3/1/2012 PDN_12-0223-01 [PDF] SP509CF-L, SP509EF-L Product Discontinuation Notice. Discontinued due to low market demand.
2/7/2012 PCN_12-0126-02 [PDF] SP211EEA-L, SP211EEA-L/TR, SP211ECA-L, SP211ECA-L/TR, SP211CA-L, SP211CA-L/TR, SP211EA-L, SP211EA-L/TR, SP213ECA-L, SP213ECA-L/TR, SP213EEA-L, SP213EEA-L/TR, SP3238EEA-L, SP3238EEA-L/TR, SP3238ECA-L, ... Material Change: Bond wire changed from gold to copper. To prevent a cost increase of product to customers due to the rising prices of gold.
2/7/2012 PDN_12-0207-01 [PDF] 9150HA, 9150HA-K, 9150HG, 9150HG-K, 9155HA, 9155HA-K, 9155HG, 9155HG-K Product Discontinuation Notice. Discontinued due to low market demand.
2/6/2012 PCN_12-0106-1 [PDF] SPX2945M3-L-3-3/TR, SPX3940AM3-L-1-8/TR, SPX3940AM3-L-2-5/TR, SPX3940AM3-L-3-3/T, SPX3940AM3-L-5-0/TR Packing Change: The carrier tape size changed from 16x12 mm to 12x8 mm. Quantity per reel remains the same (2.5Ku per reel). Standardization and business consolidation.
2/2/2012 PCN_12-0118-01 [PDF] SP3483CN-L, SP3483CN-L/TR, SP3483EN-L, SP3483EN-L/TR, SP3485CN-L, SP3485CN-L/TR, SP3485EN-L, SP3485EN-L/TR, SP3490CN-L, SP3490CN-L/TR, SP3490EN-L, SP3490EN-L/TR, SP3491CN-L, SP3491CN-L/TR, SP3491EN-L,... Design Change: Poly layer changed to optimize the receiver gate length. To improve device performance and production consistency.
1/31/2012 PCN_12-0126-01 [PDF] XRP2525ID-1-F, XRP2525IDTR-1-F, XRP2525ID-2-F, XRP2525IDTR-2-F, XRP2526ID-1-F, XRP2526IDTR-F, XRP2526ID-2-F, XRP2526IDTR-2-F, XRP2527IHB-1-F, XRP2527IHBTR-1-F, XRP2528IHB-1-F, XRP2528IHBTR-1-F Material Change: Bond wire changed from 2.0 mils gold to 1.5 mils copper. To prevent a cost increase of product to customers due to the rising prices of gold.
1/18/2012 PDN_12-0118-01 [PDF] XRT5793IJ-F, XRT5793IV-F, XRT5793IVTR-F, XRT5794IJ-F, XRT5794IV-F, XRT5795IJ-F, XRT5795IV-F, XRT5793ES-TQFP, XRT5794ES-PLCC, XRT5794ES-TQFP, XRT5897IV-F, XRT5897ES Product Discontinuation Notice. Discontinued due to low market demand.
1/11/2012 PCN_11-1123-01 [PDF] XRP6658 family Hana-JX/China is utilized as an alternate qualified assembly supplier for XRP6658 family in addition to the GTK. Capacity enhancement.
12/21/2011 PDN_11-1221-01 [PDF] SP322CF-L, SP526CF-L, SP488CT-L, SP488CT-L/TR, SP488ET-L, SP488ET-L/TR Product Discontinuation Notice. Discontinued due to low market demand.
12/20/2011 PCN_11-1026-01 [PDF] SP2525A-1EN-L, SP2525A-1EN-L/TR, SP2525A-2EN-L, SP2525A-2EN-L/TR Material Change: Bond wire changed from gold to copper. To prevent a cost increase of product to customers due to the rising prices of gold.
11/18/2011 PDN_11-1118-01 [PDF] 7815PP4, 7855PP4, 7855PP4-G, 7855PP6, 7855PP6-G, 7954PP6-G, 7954PT6/3-G, 7955PT6/3-G, 7956PT6/3-G, 7964PP6/2-G, 8155PP5, 8155PP5-G, 9620PT6-G, 9630PT6-G, 7870PP4-G, 7870PP6-G, 7965PP6/2-G, 7966PP6/2-G... Product Discontinuation Notice. Discontinued effective immediately.
10/17/2011 PDN_11-1017-01 [PDF] SP691ACP-L, SP691AEP-L Product Discontinuation Notice. Selected Power Management products listed have been discontinued by Exar Corporation in their through-hole package form.
9/29/2011 PCN_11-0915-01 [PDF] SP6201ER-L, SP6201ER-L/TR, SP6201ER-L-1-8, SP6201ER-L-1-8/TR, SP6201ER-L-3-3, SP6201ER-L-3-3/TR, SP6203ER-L, SP6203ER-L/TR, SP6203ER-L-1-8, SP6203ER-L-1-8/TR, SP6205ER-L, SP6205ER-L/TR, SP6205ER-L-2-5... Product marking change for products in 2x3mm, 8ld DFN. To improve product traceability.
9/28/2011 PDN_11-0928-01 [PDF] SP2996BEN-L, SP2996BEN-L/TR Product Discontinuation Notice. Discontinued effective immediately.
8/29/2011 PCN_11-0810-01 [PDF] SP6132HEU-L, SP6132HEU-L/TR, SP6134HEU-L, SP6134HEU-L/TR, SP6641BEK-L-3-3, SP6641BEK-L-3-3/TR, SP6648EU-L, SP6648EU-L/TR, SP6650EU-L, SP6650EU-L/TR, SP6651AEU-L, SP6651AEU-L/TR, SP6652EU-L, SP6652EU-L... Material change: Mold compound and die attach material are changed and the listed parts will be fully Green (halogen-free). Migrating to green environment and material standardization.
8/23/2011 PCN_11-0808-03 [PDF] All Exar Products Label standardization Post merger standardization of Exar and ex-Sipex inner labels.
8/23/2011 PCN_11-0816-01 [PDF] SP2526A-1EN-L, SP2526A-1EN-L/TR, SP2526A-2EN-L, SP2526A-2EN-L/TR Material change as bond wire changed from gold to copper. To maintain product supply not to be affected by the spiraling cost of gold.
8/23/2011 PCN_11-0808-02 [PDF] Refer to Attachment A of PCN. Moisture Sensitivity Level of both EXAR and ex- Sipex parts are adjusted to have the same rating when they share the same package types &/or lead counts. Standardization of MSL rating.
8/12/2011 PDN_11-0812-01 [PDF] DS 100 (7956HXL), DS 250 (8155HXL-G), DR 250 (250R), DS 255 (8155HXL-ES), DR 255 (255R), DS 4100 (4100S), DS 4100 (4100S-K) Product Discontinuation Notice. Discontinued due to low market demand.
8/10/2011 PCN_11-0724-01 [PDF] XR21B1411IL16-F, XR21B1411IL16TR-F, XR21V1410IL16-F, XR21V1410IL16TR-F, XR16L570IL24-F, XR16L570IL24TR-F, XR16L580IL24-F, XR16L580IL24TR-F, XR16M570IL24-F, XR16M570IL24TR-F, XR16M781IL24-F, XR16M781IL... Material change and a new assembly & test supplier (ASE, Kunshan). Business consolidation.
7/29/2011 PDN_11-0729-01 [PDF] SP7655ER-L, SP7655ER-L/TR, SP7661ER-L, SP7661ER-L/TR Product Discontinuation Notice. Discontinued due to low market demand, effective immediately.
7/26/2011 PCN_11-0630-02 [PDF] SP485CN-L, SP485CN-L/TR, SP485CS-L, SP485EN-L, SP485EN-L/TR, SP485ES-L Datasheet Change. Datasheet typos.
7/26/2011 PCN_11-0630-01 [PDF] SP490CN-L, SP490CN-L/TR, SP490CS-L, SP490EN-L, SP490EN-L/TR, SP490ES-L, SP491CN-L, SP491CN-L/TR, SP491CS-L, SP491EN-L, SP491EN-L/TR, SP491ES-L Datasheet Change. Datasheet typos.
6/16/2011 PCN_11-0609-01 [PDF] SP3232ECA-L, SP3232ECA-L/TR, SP3232EEA-L, SP3232EEA-L/TR, SP3232EBCA-L, SP3232EBCA-L/TR, SP3232EBEA-L, SP3232EBEA-L/TR, SP3232EUCA-L, SP3232EUCA-L/TR, SP3232EUEA-L, SP3232EUEA-L/TR, SP3232EHCA-L, SP32... Add an alternative qualified assembly & test supplier, JCET, China. Capacity enhancement.
6/10/2011 PCN_11-0608-01 [PDF] SPX1117M3-L/TR, SPX1117M3-L-1-5/TR, SPX1117M3-L-1-8/TR, SPX1117M3-L-2-5/TR, SPX1117M3-L-3-3/TR, SPX1117M3-L-5-0/TR Packing/Shipping: Change in carrier tape size though quantity per reel remains the same at 2500 units. Standardization and business consolidation.
6/6/2011 PCN_11-0509-01 [PDF] SP6669AEK-L/TRR3 Addition of the alternate assembly supplier. Capacity enhancement.
6/6/2011 PCN_11-0516-01 [PDF] SP3203ECY-L, SP3203ECY-L/TR, SP3203EEY-L, SP3203EEY-L/TR, SP3222EBCY-L, SP3222EBCY-L/TR, SP3222EBEY-L, SP3222EBEY-L/TR, SP3222ECY-L, SP3222ECY-L/TR, SP3222EEY-L, SP3222EEY-L/TR, SP3222EUCY-L, SP3222EU... Material Change: Convert all products in 20ld TSSOP package to Green (halogen-free) material using the same Bill of Material as 16ld TSSOP. Migrating to green environment and material standardization.
5/27/2011 PDN_11-0527-01 [PDF] GLZ2210-01-HSAI and GLZ2210-01HSBI Product Discontinuation Notice. Discontinued due to low market demand.
5/26/2011 PDN_11-0526-01 [PDF] GLZ1205-02-HSAI, GLZ1206-02-HSAI, GLZ1210-02-HSAI, GLZ1001-01-PBAI, GLZ1003-01-PBAI, GLZ1101-01-PBAI, GLZ3215-04-CSAI, GLZ3215-04-CSBI, GLZ4215-04-CSAI, GLZ4215-04-CSBI, GLZ5215-02-CSAI, GLZ5215-02-CS... Product Discontinuation Notice. Discontinued due to the standardization of part number nomenclature.
5/16/2011 PCN_11-0427-01A [PDF] DX184511 Process Change and Addition of two new PCB vendors. To improve process controls for the 820x series chip, and capacity enhancement for the cards.
5/11/2011 PCN_11-0502-01A [PDF] GLZ1215-04-CSBI, GLZ1215-04-CSAI, GLZ3215-04-CSBI, GLZ3215-04-CSAI, GLZ3300-04-CSBI, GLZ3300-04-CSAI, GLZ4215-04-CSBI, GLZ4215-04-CSAI, GLZ4300-04-CSBI, GLZ4300-04-CSAI, GLZ4310-04-CSBI, GLZ4310-04-CS... Material Change Material discontinuation
5/10/2011 PDN_11-0510-01 [PDF] SP207CA-L, SP207CA-L/TR, SP207EA-L, SP207EA-L/TR, SP208EHCA-L, SP208EHCA-L/TR, SP208EHCT-L, SP208EHCT-L/TR, SP208EHEA-L, SP208EHEA-L/TR, SP208EHET-L, SP208EHET-L/TR, SP26LV431CP-L, SP26LV432CP-L, SP31... Product Discontinuation Notice. Discontinued due to low market demand.
5/9/2011 PCN_11-0409-01 [PDF] XRP29302ET-L, XRP29302ETB-L, XRP29302ETBTR-L, SPX29300T-L-1-8, SPX29300T-L-1-8/TR, SPX29300T-L-2-5, SPX29300T-L-2-5/TR, SPX29300T-L-3-3, SPX29300T-L-3-3/TR, SPX29300T-L-5-0, SPX29300T-L-5-0/TR, SPX293... Revised two mask layers. To improve the manufacturing control margin.
5/2/2011 PDN_11-0502-01 [PDF] XR16L580IL28-F, XR16L580IL28TR-F, XR20M1170IL28-F, XR20M1170IL28TR-F Product Discontinuation Notice. Discontinued, effective immediately, due to low market demand and lead frame availability.
4/11/2011 PDN_11-0411-01 [PDF] ST16C2450CP40, ST16C2450IP40, ST16C2550CP40, ST16C2550IP40, ST16C450CP40, ST16C450IP40, ST16C550CP40, ST16C550IP40, ST16C650CP40, ST16C650IP40, ST78C34CP40, XR16L2550IL, XR16L2551IL, XR16L570IL24, XR1... Product Discontinuation Notice In support of “green” initiatives, the listed leaded part numbers will be discontinued by Exar.
4/5/2011 PCN_11-0404-01 [PDF] SP6336EK1-L-X-D-A & SP6336EK1-L-X-D-A/TR Part ordering number and marking are changed To improve the traceability as requested by the customers.
3/28/2011 PDN_11-0323-01 [PDF] S2C005254 Product Discontinuation Notice for Neterion Xframe II ASIC Discontinue the support and operations of the Neterion products previously acquired in March 2010.
3/15/2011 PDN_11-0315-01 [PDF] X3110DA0001, X3110SR0001, X3120DA0001, X3120DA01FB, X3120DA01LB, X3120SR0001, S2K000041 Product Discontinuation Notice Discontinue the support and operations of the Neterion products previously acquired in March 2010.
2/24/2011 PCN_11-0222-01 [PDF] XRP7657EDTR-F Datasheet change: Maximum Quiescent Current is changed from 2mA to 2.5mA. To improve Cpk at the poly resistance step. There is no change to the form, fit, or the manufacturing process.
2/7/2011 PCN_11-0201-01 [PDF] SP336ECT-L, SP336ECT-L/TR, SP336ECY-L, SP336ECY-L/TR, SP336EET-L, SP336EET-L/TR, SP336EEY-L, SP336EEY-L/TR Datasheet change: Datasheet is revised to increase the maximum driver output enable and disable times from 900ns to 1500ns for RS-485/RS-422 slew rate limited mode with a data rate of up to 250kbps. To correct typo errors.
1/26/2011 PCN_10-1217-01 [PDF] XR21V1410IL16–F Packing / Shipping: Bulk packing change from tray to canister Packing standardization for 3x3mm QFN.
1/26/2011 PCN_11-0117-01 [PDF] SP3232EBCA-L, SP3232ECP-L, SP202EET-L, SP3232EBCA-L/TR, SP3232ECT-L, SP202EET-L/TR, SP3232EBCN-L, SP3232ECT-L/TR, SP232ECN-L, SP3232EBCN-L/TR, SP3232ECY-L, SP232ECN-L/TR, SP3232EBCP-L, SP3232ECY-L/TR,... Use 6’’ production line in the Silan, China wafer fabrication. Capacity enhancement.
1/20/2011 PDN_11-0120-01 [PDF] X3110DA0002, X3120DA0002 Product Discontinuance. Discontinued effective immediately.
1/12/2011 PDN_11-0112-01-XR2206D [PDF] XR2206D-F, XR2206DTR-F, XR2206CP-F Product Discontinuance of XR2206. Discontinued due to low market demand.
1/7/2011 PCN_10-1214-01A [PDF] SP6336EK1-L-X-D-A, SP6336EK1-L-X-D-A/TR Process Change, Datasheet Change & Wafer Fabrication Change Wafer fab discontinuation.
12/17/2010 PCN_10-1214-01 [PDF] SP6336EK1-L-X-D-A, SP6336EK1-L-X-D-A/TR Process & Wafer fabrication are changed. Wafer fab discontinuation.
11/24/2010 PDN_10-1124-01 [PDF] PEB1757E, PEB1756E Product Discontinuance. Discontinued effective immediately.
11/22/2010 PCN_10-1117-01 [PDF] X3120SR0001, X3120DA0001, X3120DA0003, X3120DA01LB, X3120DA01FB Use of alternate supplier for an inductor. To address current component supply concerns.
11/17/2010 PCN_10-1115-01 [PDF] XRT86SH328IB & XRT86SH328IB-F Die revision is changed from G to H (minor change to the metal layer). Customer request to fix the errata.
10/26/2010 PCN_10-1015-02 [PDF] SP3076EEN-L, SP3076EEN-L/TR, SP3076EMN-L, SP3076EMN-L/TR, SP3077EEN-L, SP3077EEN-L/TR, SP3077EMN-L, SP3077EMN-L/TR, SP3078EEN-L, SP3078EEN-L/TR, SP3078EMN-L, SP3078EMN-L/TR Datasheet change. The current datasheet is in error and mis-states the test limits and product capabilities.
10/25/2010 PCN_10-1022-02 [PDF] XRP7713ILB-F, XRP7713ILBTR-F, XRP7714ILB-0X10-F, XRP7714ILB-0X14-F, XRP7714ILB-0X18-F, XRP7714ILB-0X1C-F, XRP7714ILB-F, XRP7714ILBTR-0X10-F, XRP7714ILBTR-0X14-F, XRP7714ILBTR-0X18-F, XRP7714ILBTR-0X1C... Datasheet change. Input voltage range as originally defined could not be guaranteed from lot to lot. Additional information & typographical errors.
10/22/2010 PDN_10-1022-01 [PDF] XRT91L82IB, XRT91L82IB-F Product Discontinuance. Discontinued effective immediately.
10/20/2010 PCAN_10-1015-01 [PDF] SP6336EK1-L-X-D-A, SP6336EK1-L-X-D-A/TR Process and wafer fabrication change. Wafer fab discontinuation.
10/15/2010 PCN_10-1011-01 [PDF] XRP7704ILBTR-F, XRP7708ILBTR-F, XRP7713ILBTR-F, XRP7714ILBTR-F, XRP7740ILBTR-F Package/Shipping Change: New carrier tape dimension. Standardization.
10/14/2010 PCN_10-1008-01 [PDF] SP322CF-L, SP526CF-L Material change for LQFP44 from Sumitomo 7320AR to Sumitomo G700L. Enhance packages to be Green (halogen-free).
10/12/2010 PDN_10-1012-01 [PDF] XRT91L32IQ, XRT91L32IQTR Our assembly supplier has announced the discontinuation of its assembly operation of XRT91L32IQ and XRT91L32IQTR. Due to a continued lack of market demand, and in response to the accelerating trend away from parts containing lead.
10/5/2010 PCN_10-0920-01 [PDF] SPX1117M3-L, SPX1117M3-L/TR, SPX1117M3-L-1-5, SPX1117M3-L-1-5/TR, SPX1117M3-L-1-8, SPX1117M3-L-1-8/TR, SPX1117M3-L-2-5, SPX1117M3-L-2-5/TR, SPX1117M3-L-3-3, SPX1117M3-L-3-3/TR, SPX1117M3-L-5-0, SPX111... Addition of an alternative qualified assembly and test supplier – JCET, China. Capacity enhancement
9/22/2010 PDN_10-0922-01 [PDF] SP1486EMN-L, SP1486EMN-L/TR Notice of Obsolescence. Military temperature range versions discontinued due to low market demand, effective immediately.
9/8/2010 PDN_10-0908-01 [PDF] S2K000015 (Xframe II SR), S2K000016 (Xframe II LR), S2K000042 (Xframe II Sun Fire SR), S2K000046 (Xframe II Sun Fire LR), S2K000047 (Xframe II Sun Fire CX4), S2K000045 (Xframe E CX4), S2K000048 (Xfram... Notice of Obsolescence. Discontinued effective immediately.
9/6/2010 PDN_10-0906-01 [PDF] XRT91L80IB, XRT91L80IB-F Product Discontinuance. Discontinued effective immediately.
9/1/2010 PCN_10-0802-01a [PDF] Refer to Attachment A of PCN. Convert wire size from 1.3mil to 1.0mil in the following package types: a. SSOP: 20, 24, 28 leads b. TSSOP: 16, 20 leads c. NSOIC: 08, 14, 16 leads Standardization of wire size to optimize manufacturing process.
9/1/2010 PCN_10-0804-01 [PDF] Refer to Attachment A of PCN. Material change for certain SP & SPX (-L & -G, SOT223, SOT23, TSOT-23, SSOP, & TSSOP) and XR, XRD & XRT (-F, None, SSOP, & TSSOP) Die Attach Epoxy and Mold Compound. To use environmental friendly material “Green” as well as package material standardization.
8/4/2010 PCN_10-0716-01 [PDF] XR21V1410IL16TR-F, XR20M1170IL16TR-F, XR16L570IL24TR-F, XR16L580IL24TR-F, XR16M570IL24TR-F, XR20M1170IL24TR-F, XR16L2551ILTR-F, XR16L570IL32TR-F, XR16L580ILTR, XR16L580ILTR-F, XR16M2551IL32TR-F, XR16M... 1. Standardize pin #1 orientation in the reel per Attachment A. 2. Standardize # of units per reel per Attachment A. Refer to PCN for more information. Standardization
7/30/2010 PCN_10-0715-01 [PDF] Selected Interface Products, refer to the PCN for specific PNs (SP1481, SP1485, SP1486, SP1490, SP1491, SP202, SP206, SP207, SP208, SP211, SP213, SP2209, SP232, SP233, SP238, SP26LV43, SP26LV431, SP26... Process Change. Capacity enhancement.
7/28/2010 PDN_10-0728-01 [PDF] DR 1000 Product discontinuance. Product discontinuance.
7/16/2010 PCN_10-0615-01B [PDF] XRT86SH328IB, XRT86SH328IB-F Design and datasheet changes. To improve device performance and also to add new features.
7/15/2010 PCN_10-0706-01 [PDF] XR2206DTR-F, XRT5676IDTR-F, XRT6164AIDTR-F, XRT6164CDTR-F, XRT59L91IDTR-F, XRT5683AIDTR-F, XRT8000IDTR-F, XRT8001IDTR-F, XRD98L23ACDTR-F, XRD8785AIDTR-F, XRT3590IDTR-F, XRT3591BIDTR-F, XRT6165CDTR-F, ... Change in packing quantity per reel. Standardization
7/15/2010 PCN_10-0706-02 [PDF] SP3203ECY-L/TR, SP3203EEY-L/TR, SP3222EBCY-L/TR, SP3222EBEY-L/TR, SP3222ECY-L/TR, SP3222EEY-L/TR, SP3222EUCY-L/TR, SP3222EUEY-L/TR, SP3223EBCY-L/TR, SP3223EBEY-L/TR, SP3223ECY-L/TR, SP3223EEY-L/TR, SP... Change in packing quantity per reel and also carrier tape width/pitch. Standardization
7/14/2010 PCN_10-0523-01 [PDF] XRD5408AID-F, XRD5410AID-F, XRD5412AID-F, XRD54L08AID-F, XRD54L10AID-F, XRD54L12AID-F, XRT5675D-F, XR0215ACD, XR0215ACD, XR2206D-F, XRT5676ID-F, XRT59L91ID-F, XRT6164AID-F, XRT6164CD-F, XR20M1170IG16,... Standardize packing quantity in tubes, NSOIC9 (97 to 98 units/tube), WSOIC16 (46 to 47 units/tube), TSSOP16 (94 to 95 units/tube) Standardization
6/2/2010 PCN_10-0510-01 [PDF] SP2525A-1EN-L, SP2525A-1EN-L/TR, SP2525A-2EN-L, SP2525A-2EN-L/TR, SP2526A-1EN-L, SP2526A-1EN-L/TR, SP2526A-2EN-L, SP2526A-2EN-L/TR, SP2996BEN-L, SP2996BEN-L/TR, SP809EK-L-2-3/TR, SP809EK-L-2-6/TR, SP8... Add an alternative qualified assembly and test supplier. Capacity enhancement.
6/1/2010 PDN_10-0601-01 [PDF] SP7616EB, SP7616ER-L, SP7616ER-L/TR, SP7619EB, SP7619ER-L, SP7619ER-L/TR Notice of Obsolescence Discontinued due to a cessation of technology process, effective immediately.
5/25/2010 PDN_10-0521-01 [PDF] SP320ACM-L Notice of Obsolescence Discontinued due to low market demand, effective immediately.
5/7/2010 PCN_10-0413-01A [PDF] SP2525A-1EN-L, SP2525A-2EN-L,SP2525A-1EN-L/TR, SP2525A-2EN-L/TR Package Change & Reduction in bond wire diameter. Business improvement and standardization.
5/6/2010 ANC_050610 [PDF] XRP7603, XRP7604, SP7600 advance product change notice on said modifications and, while anticipated to be minor, review their impact on the products specifications and performances. Transfer of the controller to a different manufacturing site and process.
4/30/2010 PCN_10-0415-01 [PDF] SPX29300T-L-1-8, SPX29300T-L-1-8/TR, SPX29300T-L-2-5, SPX29300T-L-2-5/TR, SPX29300T-L-3-3, SPX29300T-L-3-3/TR, SPX29300T-L-5-0, SPX29300T-L-5-0/TR, SPX29301T5-L-3-3, SPX29301T5-L-3-3/TR, SPX29301T5-L-... Design and datasheet change. To improve product performance.
4/18/2010 PDN_10-0419-01 [PDF] XRS10L120IL-F, XRS10L140IV-F, XRS10L210IL-F, XRS10L210IV-F, XRS10L220IV-F, XRS10L240IV-F, XRS10L620CV-F Notice of Obsolescence Discontinued effective immediately, as the result of a recent re-assessment of research and development priorities.
4/16/2010 PDN_10-0416-01 [PDF] SP6222EC5-L-3-0, SP6222EC5-L-3-0/TR Notice of Obsolescence Discontinued due to low market demand, effective immediately.
4/15/2010 PDN_10-0415-01 [PDF] XRD8775AID-F, XRD8775AIP-F, XRD8775AIU, XRD8775AIU-F, XRD8785AID-F, XRD8799AIQ, XRD87L75AID-F, XRD87L75AIU-F, XRD87L75AIU-F, XRD87L75AIU-F, XRD87L75AIU-F, XRD87L75AIU-F, XRD87L85AID-F, XRD87L99AIQ, XR... Notice of Obsolescence Discontinued due to low market demand, effective immediately.
4/12/2010 PCN_10-0324-01 [PDF] ST78C36ACJ44-F, ST78C36CJ44-F, ST78C36CJ44TR-F Datasheet change. Change in datasheet due to the product recharacterization. There is no change in form, fit, or function of the product.
4/9/2010 PCN_10-0330-01 [PDF] SP7685ER-L, SP7685ER-L/TR Change in wafer foundry Business consolidation
3/23/2010 PCN_10-0309-01 [PDF] SP2996BEN-L, SP2996BEN-L/TR Reduction in bond wire diameter Business improvement and standardization
3/23/2010 PCN_10-0311-01 [PDF] SP485RCN-L, SP485RCN-L/TR, SP485REN-L, SP485REN-L/TR, SP690SCN-L, SP690SCN-L/TR, SP690SEN-L, SP690SEN-L/TR, SP690TCN-L, SP690TCN-L/TR, SP690TEN-L, SP690TEN-L/TR, SP690ACN-L, SP690ACN-L/TR, SP690AEN-L,... Alternate qualified assembly supplier Capacity enhancement
3/2/2010 PCN_10-0224-01 [PDF] XRT83VSH28IB, XRT83VSH28IB-F XRT83VSH28 is now being assembled with an existing qualified die with identical E1 performance. There is no change to Form, Fit, Function, Quality or Reliability as stated in the applicable datasheet. Business consolidation.
3/2/2010 PCN_10-0224-03 [PDF] SP7662ER-L, SP7662ER-L/TR Material Change; Datasheet change; Wafer fab transfer Due to unavailability of the controller chip in Polar fab, a new controller has been designed and fabricated in Jazz to replace the existing chip. FET chips have also been replaced to match the new controller.
2/26/2010 PCN_10-0224-02 [PDF] SP7663ER-L, SP7663ER-L/TR Material Change; Datasheet Change; Wafer fab transfer Due to unavailability of the controller chip in Polar fab, a new controller has been designed and fabricated in Jazz to replace the existing chip. FET chips have also been replaced to match the new controller.
2/22/2010 PCN_10-0126-01 [PDF] XR17D152IM-F, XR17D152CM-F, XR17D152CMTR-F, XR17C152CM-F Material and assembly supplier changes. Business consolidation.
2/22/2010 PCN_10-0201-02 [PDF] SP332CT-L, SP332CT-L/TR, SP332ET-L, SP332ET-L/TR Process Change Complete the transfer of the SP332 wafer fabrication from the Hillview to Silan foundry. In addition, clarify conditions for the datasheets specification limits.
2/22/2010 PCN_10-0201-03 [PDF] SP331CT-L, SP331CT-L/TR, SP331ET-L, SP331ET-L/TR Process Change Process optimization and clarify conditions for the datasheets parameters.
2/5/2010 PCN_10-0201-01 [PDF] SP7686AER-L, SP7686AER-L/TR, SP7686ER-L, SP7686ER-L/TR Product Transfer from Polar fab to Tower. Business consolidation and product re-characterization.
2/4/2010 PCN_09-0909-02a [PDF] XRT5683AID-F, XRT5683AIDTR-F, XRT8000ID-F, XRT8000IDTR-F, XRT8001ID-F, XRT8001IDTR-F Elimination of the back marking. Standardization.
1/25/2010 PCN_10-0107-01 [PDF] SP3232EHCA-L, SP3232EHCA-L/TR, SP3232EHEA-L, SP3232EHEA-L/TR, SP3232EUCA-L, SP3232EUCA-L/TR, SP3232EUEA-L, SP3232EUEA-L/TR, SP3232EBCA-L, SP3232EBCA-L/TR, SP3232EBEA-L, SP3232EBEA-L/TR, SP3232ECA-L, S... Material Change; Product transfer to a qualified assembly supplier. To enhance production capacity and also to use environmentally friendly Green material.
12/29/2009 PDN_09-1229-01 [PDF] SPX29302AT5-L, SPX29302AT5-L/TR Notice of Obsolescence Discontinued due to low market demand, effective immediately.
12/21/2009 PCN_09-1217-01 [PDF] SP3244ECA-L, SP3244ECA-L/TR, SP3244ECY-L, SP3244ECY-L/TR, SP3244EEA-L, SP3244EEA-L/TR, SP3244EER1-L, SP3244EER1-L/TR, SP3244EEY-L, SP3244EEY-L/TR, SP3245ECA-L, SP3245ECA-L/TR, SP3245ECY-L, SP3245ECY-L... In reference to the PCN/letter PCN06-0130-06a dated March 2006 regarding the Hillview, USA wafer fabrication closure, the SP324X products were transferred to Episil, Taiwan. In this transfer, the family has received four layer changes (Poly, Via, Metal1, and Metal 2). Fab closure and also to improve the product performance.
12/17/2009 PCN_09-1204-01 [PDF] SP3224ECA-L/TR, SP3225ECA-L/TR, SP3226ECA-L/TR, SP3227ECA-L/TR, SP3224ECA-L, SP3225ECA-L, SP3226ECA-L, SP3227ECA-L, SP3224ECY-L/TR, SP3225ECY-L/TR, SP3226ECY-L/TR, SP3227ECY-L/TR, SP3224ECY-L, SP3225E... In reference to the PCN/letter PCN06-0130-06a dated March 2006 regarding Hillview, USA wafer fabrication closure the SP322X products were transferred to Episil, Taiwan. In this transfer the family has received four layer changes (Poly, Via, Metal1, and Metal 2). Fab closure and also to improve the product performance.
12/14/2009 PCN_09-1109-01 [PDF] SP3220EBCY-L, SP3220EBCY-L/TR, SP3220EBEY-L, SP3220EBEY-L/TR, SP3220ECY-L, SP3220ECY-L/TR, SP3220EEY-L, SP3220EEY-L/TR, SP3220EUCY-L, SP3220EUCY-L/TR, SP3220EUEY-L, SP3220EUEY-L/TR, SP3223EUCY-L, SP32... Material Change. Use environmental friendly Green (halogen free) material and also for standardization.
12/8/2009 PCN_09-1028-01 [PDF] XRT83SL28IV-F Assembly supplier is changed from Unisem, Indonesia to ASAT, China. ASAT is an alternate qualified assembly supplier for this package family. There is no change to Form, Fit, or Function as stated in the applicable datasheet. Using an attached heat spreader to the die paddle will improve product manufacturability and it is readily available in ASAT.
12/7/2009 PDN_091207-01 [PDF] SP4446EK-G, SP4446EK-G/TR, SP4446EK-L, SP4446EK-L/TR, SP6690EK-L, SP6690EK-L/TR, SP6690ER-L, SP6690ER-L/TR, SP6691EK1-L, SP6691EK1-L/TR, SP6691EK-L, SP6691EK-L/TR Notice of Obsolescence – Selected Power Management Parts Discontinued due to cost effectiveness reasons, effective immediately.
12/7/2009 PCN_09-0911-01 [PDF] LP2951CS-L-3-3, LP2951CS-L-3-3/TR, LP2951CS-L-5-0, LP2951CS-L-5-0/TR, SP1485ECN-L, SP1485ECN-L/TR, SP1485EEN-L, SP1485EEN-L/TR, SP1485EMN-L, SP1486EEN-L, SP1486EEN-L/TR, SP1486EMN-L, SP1... Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free).
10/28/2009 PCN_091020-01 [PDF] SP508CF-L, SP508EF-L Design and datasheet changes. To improve device performance and to center the propagation delay.
10/21/2009 PCN_091007-01 [PDF] SP2525A-1EN-L, SP2525A-1EN-L/TR, SP2525A-2EN-L, SP2525A-2EN-L/TR, SP2526A-1EN-L, SP2526A-1EN-L/TR, SP2526A-2EN-L, SP2526A-2EN-L/TR, SP2996BEN-L, SP2996BEN-L/TR, SP809EK-L-2-3/TR, SP809EK-L-2-6/TR, SP8... Material Change Enhance Pb-free package to be Pb-free and halogen free package.
10/13/2009 PDN_091013-01 [PDF] XRT7298IP-F, XRT6166CP-F, XRT6166IP-F Notice of Obsolescence. Discontinued due to low market demand, effective immediately.
10/9/2009 PCN_090909-02 [PDF] XRT5683AID-F, XRT5683AIDTR-F, XRT8000ID-F, XRT8000IDTR-F, XRT8001ID-F, XRT8001IDTR-F To add an alternate assembly supplier. Capacity enhancement.
10/1/2009 PDN_091001-01 [PDF] XR88C681CP/28-F, XR88C681P/28-F Notice of Obsolescence. Discontinued due to low market demand, effective immediately.
9/28/2009 PDN_090928-01 [PDF] XRT7296IP-F, XRT7296AIP-F Notice of Obsolescence. Discontinued due to low market demand, effective immediately.
9/21/2009 PCN_090911-02 [PDF] SP334CT-L, SP334CT-L/TR, SP334ET-L, SP334ET-L/TR Wafer Fabrication Site Transfer. Complete the transfer of the SP334 wafer fabrication from Hillview foundry to Silan foundry (ref. PCN 06-0130-14).
9/18/2009 PCN_090806-01 [PDF] XRT83VSH316IB-F Pin “SDO/D0” (Ball Y5) will stay at High-Z when Pin “SER_PARB” (Ball T17) is pulled “High” and chip is not selected. Metal-2 layer is changed to implement the fix. Certain applications require SDO/D0 pin to be at high-Z when the device is not selected.
9/17/2009 PCN_090909-01 [PDF] SP705CN-L, SP706CN-L, SP707CN-L, SP708CN-L, SP705CN-L/TR, SP706CN-L/TR, SP707CN-L/TR, SP708CN-L/TR, SP705CU-L, SP706CU-L, SP707CU-L, SP708EN-L, SP705CU-L/TR, SP706CU-L/TR, SP707CU-L/TR, SP708EN-L/TR, ... Test conditions for RESET Output Voltage @ max voltage =0.30V is changed. Test standardization.
9/17/2009 PCN_09-0909-01 [PDF] SP705CN-L, SP705CN-L/TR, SP705CU-L, SP705CU-L/TR, SP705EN-L, SP705EN-L/TR, SP706CN-L, SP706CN-L/TR, SP706CU-L, SP706CU-L/TR, SP706EN-L, SP706EN-L/TR, SP706RCN-L, SP706RCN-L/TR, SP706RCU-L, SP706RCU-L/... Datasheet change. Test conditions for RESET Output Voltage @ max voltage =0.30V is changed From: Vcc =1.1V, Isink =50ua To: Vcc =1.2V, Isink = 100ua
9/11/2009 PDN_090911-01 [PDF] XRT56L85D-F, XRT56L85DTR-F Notice of Obsolescence – Select Communication Products. Discontinued due to low market demand, effective immediately.
9/9/2009 PCN_090903-01 [PDF] ST16C2450CQ48-F, ST16C2450IQ48-F, ST16C2550CQ48-F, T16C2550CQ48TR-F, ST16C2550IQ48-F, ST16C2550IQ48TR-F, XR16C2550IM-F, XR16C2550IMTR-F Utilize an existing qualified alternate assembly and test supplier. Business consolidation.
8/24/2009 PDN_090824-01 [PDF] SP7611AEC6-L, SP7611AEC6-L/TR, SP7611AER6-L, SP7611AER6-L/TR, SP7611CEC6-L, SP7611CEC6-L/TR, SP7612AEC6-L, SP7612AEC6-L/TR, SP7614AEC6-L, SP7614AEC6-L/TR, SP7614AER6-L, SP7614AER6-L/TR Notice of Obsolescence – Selected Power Management Parts Discontinued due to low market demand, effective immediately.
8/7/2009 PDN_090807-01 [PDF] SP1086V1-L-3-3, SP317V2-L, SP34063AEN-L, SP6260AEK-L, SP6260BEK-L, SP6260CEK-L, SP6260DEK-L, SP6260EEK-L, SP6260FEK-L, SP6260GEK-L, SP6265AEK1-L, SP6265BEK1-L, SP6265FEK1-L, SP6265GEK1-L, SP6265HEK1-L... Notice of Obsolescence – Selected Power Management Parts Discontinued due to low market demand, effective immediately.
7/31/2009 PRN_090731-01 [PDF] SP6205ER-L-1-8, SP6205ER-L-1-8/TR Notice of Reactivation of previously announced obsoleted products –Selected Power Management Parts Power Management products listed have been reactivated by Exar Corporation due to continuing customer demand, effective immediately.
7/16/2009 PCN_090716-01 [PDF] XRS10L120IL-F, XRS10L220IV-F, XRS10L210IL-F, XRS10L210IV-F One layer mask is changed in CSM, Singapore wafer fabrication (M2; Revision C to D). There is no change to product Form, Fit or Function as stated in the applicable datasheets. To improve product performance.
7/15/2009 PCN_090715-01 [PDF] SP6669AEK-L/TRR3, SP6669BEK-L/TRR3, SP6669CEK-L/TRR3, SP6669DEK-L/TRR3, SP6260AEK-L/TR, SP6260BEK-L/TR, SP6260CEK-L/TR, SP6260DEK-L/TR, SP6260EEK-L/TR, SP6260FEK-L/TR, SP6260GEK-L/TRSP6699EK-L, SP6699... These products will be dry packed to eliminate possible moisture related failures at board assembly. There is no change to Form, Fit, or Function as stated in the applicable datasheets. Products having moisture sensitivity greater than level 1 require dry packs according to the internal procedures and JEDEC guidelines.
7/15/2009 PCN_090624-01 [PDF] SP6685ER-L, SP6685ER-L/TR, SP6686ER-L, SP6686ER-L/TR Wafer fabrication process flow in Jazz Semiconductor foundry has been modified and two metal masks were revised. Applicable datasheets are changed to specify all pins meet ESD-HBM of 2KV except EN pin that meets 1KV. There is no change to Form, Fit, or Function as stated in the applicable datasheets except for the ESD rating as stated above. Process standardization to eliminate product specific flow.
6/26/2009 PCN_09-0626-01 [PDF] XR20M1170IG16, XR20M1170IG16-F, XRT91L33IG, XRT91L33IGTR, XR20M1170IG24, XR20M1170IG24-F, XRT59L81IG, XRT59L81IG-F, XRT59L81IGTR, XRT59L81IGTR-F, XRT85L61IG, XRT85L61IG-F, XRT85L61IGTR, XRT85L61IGTR-F... Elimination of the back (bottom) mark and addition of the lot number to the top mark. To eliminate duplication and to reduce assembly cycle times.
6/26/2009 PDN_090626-01 [PDF] SPX2815AR-L, SPX2815AR-L/TR Notice of Obsolescence –Selected Power Management Parts Discontinued due to low market demand, effective immediately.
6/4/2009 PCN_090604-01 [PDF] SPX2940T-L-5-0/TR, SPX29150T-L-3-3/TR, SPX29150T-L-5-0/TR, SPX2940U-L-5-0, SPX2940T-L-5-0, SPX29150T-L-3-3, SPX29150T-L-5-0 Die attach material is changed from Pb/Sn/Ag solder to 84-1LMISR4 epoxy. To eliminate lead – To be RoHS compliance without exemption.
5/29/2009 pcn09-0528-01_SP7616 [PDF] SP7616ER-LSP7616ER-L/TR High Accuracy 4-Channel Low Side LED Driver for CCFL Replacement To improve manufacturability of these products as a result of process changes.
5/29/2009 SP7616_Rev2 0 4_2009-05-22 [PDF] SP7616 High Accuracy 4-Channel Low Side LED Driver for CCFL Replacement Refer to PCN for more details.
5/19/2009 PDN 081126-01 [PDF] Serial Leaded Discontinuation Notice 081126-01 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand
3/4/2009 PDN_090304-01 [PDF] Selected Power Management Parts (Refer to PDF) Notice of Obsolescence Discontinued by Exar Corporation due to low market demand
1/30/2009 PDN_090130-01 [PDF] SP508CF, SP508CF/TR, SP508EF, SP509CF, SP3508EF, SP3508CF Notice of Last-time Buy and Obsolescence Package Discontinuation Notice
1/20/2009 PCN_09-0120-01 [PDF] SP6134, SP6134H, SP6137, and SP6139 Families Datasheet Changes Refer to PCN for more details.
12/23/2008 PCN_08-1223-01 [PDF] SP202ECN-L, SP202ECN-L/TR, SP202ECP-L, SP202ECT-L, SP202ECT-L/TR, SP202EEN-L, SP202EEN-L/TR, SP202EEP-L, SP202EET-L, SP202EET-L/TR, SP232ECN-L, SP232ECN-L/TR, SP232ECP-L, SP232ECT-L, SP232ECT-L/TR, SP... ESD rating of +/- 15kV IEC 1000-4-2 Air Discharge and +/-8kV Contact Discharge are removed from the datasheets. Product re-characterization.
12/11/2008 PCN_08-1211-01 [PDF] XRT73R12IB-F, XRT75R12IB-F, XRT75R12DIB-F, XRT83L314IB-F, XRT83SL314IB-F, XRT94L31IB-F, XRT94L33IB-F Ordering part number Exar is redefining the “-F” and – “L” portion of part number nomenclature.
12/1/2008 PCN_08-1201-01 [PDF] SP6125EK1-L, SP6126EK1-L, SP6127EK1-L, SP7601EK1-L, SP6330EK1-L-W-G-C, SP6330EK1-L-X-J-C, SP6330EK1-L-Z-J-C, SP6336EK1-L-X-D-A, SP6339EK1-L-Z-J-C Material Change To enhance the assembly process and to promote the green environment.
12/1/2008 PCN_08-1201-02 [PDF] XRT72L52IQ-F & XRT72L52IQTR-F Material Change, Alternate Qualified Assembly Supplier Supplier’s decision to end the life of this package body size and lead count.
11/26/2008 PDN_081126-01 [PDF] SP1481EEN, SP1481EEN/TR, SP202ECN, SP202ECN/TR, SP202ECP, SP202ECT, SP202ECT/TR, SP202EEN, SP202EEN/TR, SP202EET, SP202EET/TR, SP207CT, SP207CT/TR, SP208CA, SP208CA/TR, SP208CT, SP208CT/TR, SP208EA, S... Notice of Obsolescence Package Discontinuation Notice
11/13/2008 pcn_08-1113-01 [PDF] SPX29501T5-L-1-8, SPX29501T5-L-1-8/TR, SPX29501T5-L-2-5, SPX29501T5-L-2-5/TR, SPX29501T5-L-3-3, SPX29501T5-L-3-3/TR, SPX29501T5-L-5-0, SPX29501T5-L-5-0/TR, SPX29502T5-L, SPX29502T5-L/TR, SPX29502U5-L Dropout Voltage Changes Transfer from Hillview Fab to Silan Fab requires relaxation of the specification to provide acceptable manufacturing yields.
11/7/2008 PCN_08-1107-01 [PDF] SP310ACT-L, SP310ACT-L/TR, SP310AET-L, SP310AET-L/TR, SP310ECT, SP310ECT/TR, SP310ECT-L, SP310ECT-L/TR, SP310EET-L, SP310EET-L/TR, SP385ECT-L, SP385ECT-L/TR, SP385EET-L, SP385EET-L/TR, SP312ACT-L, SP3... 1. Assembly of 18ld WSOIC will be moved from Unisem-Malaysia to MMS in Shanghai, China which is an alternate qualified supplier. 2. Mold compound is changed from Sumitomo non green 6730B-L to Sumitomo G600. Unisem Corporation is ending the life of this package lead count in their assembly offerings.
10/29/2008 PDN_081029-01 [PDF] XRD8785AIK, XRD8785AIK-F, XRD8785AIP-F, XRD87L85AIK, XRD87L85AIK-F, XRD87L85AIP-F Package Discontinuation Notice of 24ld SOP and 24ld PDIP package offerings. Package Discontinuation Notice.
10/27/2008 pcn_08-1027-01 [PDF] SP6126 & SP7656 Datasheet Change Changing datasheet to eliminate the Vref tolerance specification at room temperature.
10/27/2008 pcn_08-1027-02 [PDF] SP6669 Four (4) part numbers were modified to reflect the exact Tape and Reel packaging method. SP6669xEK-L/TR to become SP6669xEK-L/TRR3 with x=A to D. Current part number did not reflect the actual Tape & Reel packing method.
10/22/2008 pcn_08-1022-01 [PDF] SP504MCM-L, SP504MCM-L/TR ESD rating of 500V HBM was added. Product Re-Characterization.
10/3/2008 pcn08-1003-01 [PDF] SP3080EMN-L, SP3081EEN-L, SP3081EEN-L/TR, SP3087EEN-L/TR, SP3086EEN-L, SP3086EEN-L/TR, SP3084EMN-L, SP3084EEN-L, SP3084EEN-L/TR, SP3083EEN-L/TR, SP3080EEN-L, SP3080EEN-L/TR, SP3087EEN-L, SP3083EEN-L, ... Wafer Fabrication – Episil 1.2um CMOS To correct auto-doping of N-Well causing Vtp variation and to eliminate device leakage.
10/2/2008 pcn_08-1002-01 [PDF] SP503EM-L, SP503CM-L Datasheet Change: Temperature and ESD Rating Change Product Re-Characterization.
9/29/2008 pcn08-0929-01 [PDF] SP231ACP-L, SP491CS-L, SP491ECP-L, SP491EEP-L, SP491ES-L, SP202ECP-L, SP202EEP-L, SP232ACP-L, SP232AEP-L, SP232ECP-L, SP232EEP, SP232EEP-L, SP26LV432CP-L, SP3232EBEP-L, SP3232ECP-L, SP3232EEP-L, SP323... Product assembly of 14/16/18 lead PDIP families will be transferred from Unisem-Ipoh (Malaysia) to Unisem-Batam (Indonesia). Business consolidation and use of environmental friendly material.
9/10/2008 PDN_080910-01 [PDF] SP1084V1-L, SP1084V1-L/TR, SP1084V1-L-1-5, SP1084V1-L-1-5/TR, SP1084V1-L-1-8, SP1084V1-L-1-8/TR, SP1084V1-L-2-5, SP1084V1-L-2-5/TR, SP1084V1-L-2-85, SP1084V1-L-2-85/TR, SP1084V1-L-3-3, SP10... Notice of Obsolescence –Selected Power Management Parts This is notification that the Power Management products listed on the attached page have been discontinued by Exar Corporation due to low market demand, effective immediately.
8/12/2008 pcn_08-0812-03_spx5205 [PDF] SPX5205 Datasheet Change: Load & Line Regulations Product Re-Characterization
8/12/2008 pcn_08-0812-02_spx3819 [PDF] SPX3819 Datasheet Change: Line Regulation Product Re-Characterization.
5/30/2008 PCN_08-0530-01 [PDF] SPX385-1.2, SPX385-5.0, SPX385AM-L-5-0, SPX385AML-5-O-TR, SPX385M-L-5-0, SPX385M-L-5-0/TR, SPX385N-L-5-0, SPX385N-L-5-0/TR, SPX385S-L-5-0, SPX385S-L-5-0/TR, SPX385AN-L-1-2, SPX385AN-L-1-2/TR, SPX385AS... Change Temperature Coefficient from MAX 50PPM to MAX 140PPM. Product re-characterization.
4/7/2008 PCN_08-0407-01 [PDF] SP619EK-L, SP619EK-L/TR Datasheet Change. SP619 has been recharacterizated.
4/1/2008 pcn08-0401-01 [PDF] SPX385M-L-2.5, SPX385M-L-2.5/TR, SPX385N-L-2.5, SPX385N-L-2.5/TR, SPX385S-L-2.5, SPX385S-L-2.5/TR Micropower Voltage Reference Change the temperature limits from MAX 100PPM/C to 140PPM/C.
1/8/2008 pcn07-1102-06a [PDF] SP3508CF, SP3508CF-L, SP509CF-L, SP320ACF, SP504MCF-L/TR, SP505ACF, SP506CF-L/TR, SP507CF, SP3508CF-L/TR, SP3508EF, SP320ACF-L, SP320CF-L, SP505ACF-1, SP505ACF-2, SP507CF-L, SP514CF, SP3508EF-L, SP503... Change of assembly subcontractor for all Sipex part numbers packaged in the 100 lead LQFP packages from Carsem to Unisem’s Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem’s Batam plant (formerly AIT). Current subcontractor, Carsem, is discontinuing the packages.
12/5/2007 PCN_07-1205-01 [PDF] SPX3819R2-L, SPX3819R2-L-1-5, SPX3819R2-L-1-8, SPX3819R2-L-3-3, SPX3819R2-L-5-0 Announcing the re-activation of previously announced discontinued products The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
12/5/2007 PCN_07-1204-01 [PDF] SP6200EM5-L-1-8/TR, SPX1004AM1-L-1-2 Announcing the re-activation of previously announced discontinued products. The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
11/28/2007 PCN_07-1128-01 [PDF] SP6200EM5-L-3-0/TR, SP6200EM5-L-3-0 Announcing the re-activation of previously announced discontinued products. The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
5/29/2007 PCN_07-0529-02 [PDF] SPX1004AM1-L-1-2/TR Announcing the re-activation of previously announced discontinued products The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
5/23/2007 PCN_07-0523-01 [PDF] SPX2951ACS-L-5-0, SPX2951ACS-L-5-0/TR, SPX2951ACS-5.0, SPX2951ACS-5-0/TR Announcing the re-activation of previously announced discontinued products The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
5/16/2007 PCN_07-0508-01 [PDF] SPX1431N-L, SPX1431S-L, SP6214EC5-L-2 Announcing the re-activation of previously announced discontinued products. The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
5/10/2007 PCN-07-0430-01 [PDF] SP3070-SP3078 Moving from waivered SP3070 material to original datasheet specification. Mask set change in order to do so. To assure continuity of supply of wafers for these products.
5/7/2007 PCN-06-0130-14a [PDF] SP332CT, SP332CT-L, SP332ET, SP332ET-L, SP333CT, SP333CT-L, SP333ET, SP333ET-L, SP334CA, SP334CA-L, SP334CT, SP334CT-L, SP334ET, SP334ET-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
4/20/2007 PCN_07-0426-01 [PDF] SP485CN-L, SP485CN-L/TR, SP485CS-L, SP485EN, SP485EN/TR, SP485EN-L, SP485EN-L/TR, SP485ES-L, SP490CN-L, SP490CN-L/TR, SP490CS-L SP490EN-L, SP490EN-L/TR, SP490ES-L, P491CN-L, SP491CN-L/TR, SP491CS-L, ... Migrating product from 5um CMOS process technology to 2um CMOS process technology to be sourced from both Episil, Taiwan, and Silan, Hangzhou, China foundries. To assure continuity of supply of wafers for these products.
4/20/2007 PCN_07-0426-02 [PDF] SP483CN-L, SP483CN-L/TR, SP483CS-L, SP483ECN-L, SP483ECN-L/TR, SP483ECP-L, SP483EEN-L, SP483EEN-L/TR, SP483EEP-L, SP483EN-L, SP483EN-L/TR, SP483ES-L, SP485RCN-L, SP485RCN-L/TR, SP485RCP-L, SP485REN-L,... Migrating product from Episil wafer foundry’s 5um CMOS process to Silan, Hangzhou, China, foundry’s 5um CMOS process. To assure continuity of supply of wafers for these products.
4/18/2007 PCN_07-0419-01 [PDF] SPX1117 Change Dropout Voltage maximum (datasheet page 2) from 1.1V to 1.2V for Iout = 100mA; from 1.15V to 1.25V for Iout = 500mA; from 1.2V to 1.3V for Iout = 800mA. Datasheet Change
4/10/2007 PCN_07-0410-01 [PDF] SP7611A, SP7612A, SP7614A • Added 2X2 TDFN package option. • Corrected Absolute Maximum CTRL Voltage to GND from 0.5V to -0.5V. • Reformatted parametric graphs to make them more readable. • Corrected other datasheet typographical errors. Datasheet change.
4/4/2007 PCN_07-0328-01 [PDF] SP3243, SP232E, SP202, SP207, SP485E, SP3232, SP3485, SP485, SP507, SP483 Power Management and Interface products as listed are being transferred to external wafer foundry, due to cessation of operations of the Sipex Hillview Wafer Fabrication manufacturing site. Updating previously announced transfer of certain Power Management and Interface Products from the Hillview wafer fabrication facility to wafer foundry Silan.
2/21/2007 PCN 07-0214-01 [PDF] SP7663 Adding minimum and maximum oscillator frequency to the specification Datasheet Change
10/16/2006 PCN 06-1016-02 _2_(1) [PDF] SP690T/S/R, SP802T/S/R, SP804T/S/R, and SP805T/S/R product family and the SP705-708/813L/813M product family. Adding “Note 1: WDI minimum rise/fall time is 1 microsecond.” to “WDI Pulse Width” specification The Schmitt trigger input on the WDI pin may not recognize signals with rise or fall times shorter than 1 microsecond.
10/16/2006 PCN 06-1016-01 _2_ [PDF] SP6222EC5-2-5-L, SP6222EC5-3-0-L, SP6222EC5-L, SP6222EK-2-5-L, SP6222EK-3-0-L, SP6222EK-L, SP6223EC5-L, SP6223EK-L • Removing “Output Voltage Accuracy” max spec at room temperature of 2% (3% over full operating temperature still applies). • Adding “Output Voltage Accuracy” typical spec at room temperature of 1%. • Changing “Fixed Output Voltage (3.0V version)” and “Fixed Output Voltage (2.5V version)” typical spec to apply at room temperature only (not over full operating temperature range. The MIN and MAX for both of these specifications still apply over full operating temperature. • Removing specification for “Shutdown Supply Current@125ºC”. Full product characterization over temperature necessitated the changes.
6/26/2006 PCN 06-0130-01b [PDF] SP3238CA, SP3238CA-L, SP3238CY, SP3238CY-L, SP3238EA, SP3238EA-L, SP3238ECA, SP3238ECA-L, SP3238ECY Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-02a [PDF] SP508CF, SP508CF-L, SP508EF, SP508EF-L, SP509CF, SP509CF-L, SP508CF, SP508CF-L, SP508EF, SP508EF-L, SP509CF, SP509CF-L, SP508CF, SP508CF-L, SP508EF, SP508EF-L, SP509CF, SP509CF-L, SP508CF, SP508CF-L, ... Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-03a [PDF] SP3203CA, SP3203CA-L, SP3203CY, SP3203CY-L, SP3203EA, SP3203EA-L, SP3203ECA, SP3203ECA-L, SP3203ECY, SP3203ECY-L, SP3203EEA, SP3203EEA-L, SP3203EEY, SP3203EEY-L, SP3203EY, SP3203EY-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-10b [PDF] SP3508CF, SP3508CF-L, SP3508EF, SP3508EF-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-11b [PDF] SP3070EEN, SP3070EEN-L, SP3070EMN, SP3070EMN-L, SP3071EEN, SP3071EEN-L, SP3071EMN, SP3071EMN-L, SP3073EEN, SP3073EEN-L, SP3073EMN, SP3073EMN-L, SP3074EEN, SP3074EEN-L, SP3074EMN, SP3074EMN-L, SP3076EE... Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-12a [PDF] SP320ACF, SP320ACF-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-13a [PDF] SP485RCN, SP485RCN-L, SP485RCP, SP485RCP-L, SP485RCS-L, SP485REN, SP485REN-L, SP485REP, SP485REP-L, SP485RES-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-14b [PDF] SP332CT, SP332CT-L, SP332ET, SP332ET-L, SP333CT, SP333CT-L, SP333ET, SP333ET-L, SP334CA, SP334CA-L, SP334CT, SP334CT-L, SP334ET, SP334ET-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-15a [PDF] SP503CF, SP503CF-L, SP503CM, SP503CM-L, SP503EF, SP503EF-L, SP503EM, SP503EM-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-16a [PDF] SP331CT, SP331CT-L, SP331ET, SP331ET-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-17a [PDF] SP322CF, SP322CF-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-19b [PDF] SP488ACP, SP488ACP-L, SP488ACT, SP488ACT-L, SP488AEP, SP488AEP-L, SP488AET, SP488AET-L, SP488CN, SP488CN-L, SP488CS, SP488CS-L, SP488CT, SP488CT-L, SP488ES, SP488ES-L, SP488ET, SP488ET-L, SP489CN, SP4... Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-21b [PDF] SP505ACF, SP505ACF-L, SP505BCF, SP505BCF-L, SP506CF, SP506CF-L, SP507CF, SP507CF-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-22c [PDF] SP231ACP, SP231ACP-L, SP231ACT, SP231ACT-L, SP231AEP, SP231AEP-L, SP231AET, SP231AET-L, SP233ACP, SP233ACP-L, SP233ACT, SP233ACT-L, SP233AEP, SP233AEP-L, SP233AET, SP233AET-L, SP310ACP, SP310ACP-L, SP... Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-26a(1) [PDF] SP504CF, SP504CF-L, SP504MCF, SP504MCF-L, SP514CF, SP514CF-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-26a [PDF] SP504CF, SP504CF-L, SP504MCF, SP504MCF-L, SP514CF, SP514CF-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-27b [PDF] SP233ECT, SP233ECT-L, SP233EET, SP233EET-L, SP310ECA, SP310ECA-L, SP310ECP, SP310ECP-L, SP310ECT, SP310ECT-L, SP310EEA, SP310EEA-L, SP310EEP, SP310EEP-L, SP310EET, SP310EET-L, SP312ECA, SP312ECA-L, SP... Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-29a [PDF] SP526CF, SP526CF-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0130-59a [PDF] SP481ECN, SP481ECN-L Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN 06-0508-01 for RS232 products [PDF] SP3222B/3232B Datasheet, SP3249E Datasheet, SP3243 Datasheet, SP3239E Datasheet, SP3238E Datasheet, SP3222EU/3232EU Datasheet, SP3222EB/3232EB Datasheet, SP3222E/3232E Datasheet Change in ABSOLUTE MAXIMUM RATINGS of Input Voltages from: “-0.3V to +6.0V” to “-0.3V to Vcc + 0.3V” for the following pins (as appropriate to the specific product): TxIN, /EN,/ONLINE, /SHUTDOWN, EN SHDN, /SHDN The datasheets originally mis-specified the absolute maximum ratings of the above listed pins.
6/26/2006 PCN 06-0508-02 for SPX2941 [PDF] SPX2941T5-L, SPX2941T5-L/TR, SPX2941T5, SPX2941T5/TR, SPX2941U5, SPX2941U5-L Removed reference to error flag; removed reference to “replacement for LM2941” and any other devices. Enable is active high, opposite to competitors’ parts.
6/26/2006 PCN 06-0412-01 [PDF] SP6683-03ER, SP6683-03ER-L, SP6683ER, SP6683ER-L, SP6683LVER, SP6683LVER-L Metal routing change to insure that a flip-flop is initialized at circuit power-up Corrective action to a circuit start-up problem.
6/26/2006 PCN 06-0330-01 [PDF] SP682CN, SP682CP, SP682CU, SP682EN, SP682EP, SP682EU, SP682CN-L, SP682CP-L, SP682CU-L, SP682EN-L, SP682EP-L, SP682EU-L Re-activation of previously discontinued part and transfer to wafer foundry Silan. This previously discontinued prodcut is being re-activated due to Customer demand and is being transferred to an external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site.
6/26/2006 PCN-06-0130-46a [PDF] SPX2810M3-2-8, SPX2810M3-L-2-8, SPX1117HM3-1-5, SPX1117HM3-L-1-5, SPX1117M3-1-5, SPX1117M3-L-1-5, SPX2810AM3-1-5, SPX2810AM3-L-1-5, SPX2810M3-1-5, SPX2810M3-L-1-5, SPX1117M3-1-8, SPX1117M3-L-1-8, SPX2... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN-06-0130-49a [PDF] SPX1581T5-2-5, SPX1581T5-L-2-5, SPX1581U5-2-5, SPX1581U5-L-2-5, SPX1585AT-2-5, SPX1585AT-L-2-5, SPX1585AU-2-5, SPX1585AU-L-2-5, SPX1585T-2-5, SPX1585T-L-2-5, SPX1585U-2-5, SPX1585U-L-2-5, SPX1581T5-3-... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN-06-0130-40a [PDF] SP6123CN, SP6123CN-L, SP6123EN, SP6123EN-L, SP6128ACY, SP6128ACY-L, SP6128AEY, SP6128AEY-L, SP6128AHY, SP6128AHY-L, SP6128EY, SP6128EY-L, SP6123ACN, SP6123ACN-L, SP6123AEN, SP6123AEN-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/26/2006 PCN-06-0130-34a [PDF] SP707CN, SP707CN-L, SP707CP, SP707CP-L, SP707CU, SP707CU-L, SP707EN, SP707EN-L, SP707EP, SP707EP-L, SP707EU, SP707EU-L, SP708CN, SP708CN-L, SP708CP, SP708CP-L, SP708CU, SP708CU-L, SP708EN, SP708EN-L, ... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
6/12/2006 PCN 06-0612-01 [PDF] SP8059B Capacitor and metal routing change Improve band width and noise performance
5/8/2006 PCN-06-0130-27a [PDF] SP233ECT, SP233ECT-L, SP233EET, SP233EET-L, SP310ECA, SP310ECA-L, SP310ECP, SP310ECP-L, SP310ECT, SP310ECT-L, SP310EEA, SP310EEA-L, SP310EEP, SP310EEP-L, SP310EET, SP310EET-L, SP312ECA, SP312ECA-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-22b [PDF] SP231ACP, SP231ACP-L, SP231ACT, SP231ACT-L, SP231AEP, SP231AEP-L, SP231AET, SP231AET-L, SP233ACP, SP233ACP-L, SP233ACT, SP233ACT-L, SP233AEP, SP233AEP-L, SP233AET, SP233AET-L, SP310ACP, SP310ACP-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-22a [PDF] SP231ACP, SP231ACP-L, SP231ACT, SP231ACT-L, SP231AEP, SP231AEP-L, SP231AET, SP231AET-L, SP232ACNSD, SP232ACNSD-L, SP232AENSD, SP232AENSD-L, SP233ACP, SP233ACP-L, SP233ACT, SP233ACT-L, SP233AEP, SP233A... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-19a [PDF] SP488ACP, SP488ACP-L, SP488ACT, SP488ACT-L, SP488AEP, SP488AEP-L, SP488AET, SP488AET-L, SP488CN, SP488CN-L, SP488CS, SP488CS-L, SP488CT, SP488CT-L, SP488ES, SP488ES-L, SP488ET, SP488ET-L, SP489CN, SP4... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-11a [PDF] SP3070EEN, SP3070EEN-L, SP3070EMN, SP3070EMN-L, SP3071EEN, SP3071EEN-L, SP3071EMN, SP3071EMN-L, SP3073EEN, SP3073EEN-L, SP3073EMN, SP3073EMN-L, SP3074EEN, SP3074EEN-L, SP3074EMN, SP3074EMN-L, SP3076EE... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-10a [PDF] SP3508CF, SP3508CF-L, SP3508EF, SP3508EF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-09a [PDF] SP204EP-L, SP208CA, SP208CA-L, SP208CP, SP208CP-L, SP208CT, SP208CT-L, SP208EA, SP208EA-L, SP208ECA, SP208ECA-L, SP208ECP, SP208ECP-L, SP208ECT, SP208ECT-L, SP208EEA, SP208EEA-L, SP208EEP, SP208EEP-L,... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-08a [PDF] SP1485ECN, SP1485ECN-L, SP1485ECP, SP1485ECP-L, SP1485EEN, SP1485EEN-L, SP1485EEP, SP1485EEP-L, SP1485EMN, SP1485EMN-L, SP485ECN, SP485ECN-L, SP485ECP, SP485ECP-L, SP485EEN, SP485EEN-L, SP485EEP, SP48... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-07a [PDF] SP3243CR, SP3243CR-L, SP3243BCA, SP3243BCA-L, SP3243BCR, SP3243BCR-L, SP3243BCT, SP3243BCT-L, SP3243BCY, SP3243BCY-L, SP3243BEA, SP3243BEA-L, SP3243BER, SP3243BER-L, SP3243BET, SP3243BET-L, SP3243BEY,... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-06a [PDF] SP3232EEY, SP3232EEY-L, SP3232EN, SP3232EN-L, SP3232EP, SP3232EP-L, SP3232ET, SP3232ET-L, SP3232EY, SP3232EY-L, SP3223EHCA, SP3223EHCA-L, SP3223EHCP, SP3223EHCP-L, SP3223EHCY, SP3223EHCY-L, SP3223EHEA... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/8/2006 PCN-06-0130-04b [PDF] SP202ECN, SP202ECN-L, SP202ECP, SP202ECP-L, SP202ECT, SP202ECT-L, SP202EEN, SP202EEN-L, SP202EEP, SP202EEP-L, SP202EET, SP202EET-L, SP232ACN, SP232ACN-L, SP232ACP, SP232ACP-L, SP232ACT, SP232ACT-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
5/7/2006 PCN-06-0130-01a(1) [PDF] SP3238CA-L, SP3238CY, SP3238CY-L, SP3238EA, SP3238EA-L, SP3238ECA, SP3238ECA-L, SP3238ECY, SP3238ECY-L, SP3238EEA, SP3238EEA-L, SP3238EEY, SP3238EEY-L, SP3238EY, SP3238EY-L, SP3239CA, SP3239CA-L, SP32... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/15/2006 PCN-06-0130-21a [PDF] SP505ACF, SP505ACF-L, SP505BCF, SP505BCF-L, SP506CF, SP506CF-L, SP507CF, SP507CF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/15/2006 PCN-06-0214-01 [PDF] SP6128A 1. Adjusted the level shifter for correct low voltage operation. 2. Reduce bandgap compensation capacitor for better dV/dT performance. Note: There is no change in the data sheet or part functionality. Customer Request
2/12/2006 PCN-06-0130-04a [PDF] SP233ECP, SP233ECP-L, SP233EEP, SP233EEP-L, SP202ECN, SP202ECN-L, SP202ECP, SP202ECP-L, SP202ECT, SP202ECT-L, SP202EEN, SP202EEN-L, SP202EEP, SP202EEP-L, SP202EET, SP202EET-L, SP232ACN, SP232ACN-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-58 [PDF] SPX29500T-1-8, SPX29500T-L-1-8, SPX29500U-1-8, SPX29500U-L-1-8, SPX29500T-2-5, SPX29500T-L-2-5, SPX29500U-2-5, SPX29500U-L-2-5, SPX29500T-3-3, SPX29500T-L-3-3, SPX29500U-3-3, SPX29500U-L-3-3, SPX29500... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-57 [PDF] SPX5205M5, SPX5205M5-L, SPX5205M5-1-8, SPX5205M5-L-1-8, SPX5205M5-2-0, SPX5205M5-L-2-0, SPX5205M5-2-5, SPX5205M5-L-2-5, SPX5205M5-2-8, SPX5205M5-L-2-8, SPX5205M5-3-0, SPX5205M5-L-3-0, SPX5205M5-3-3, S... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-55 [PDF] SPX29150T-1-8, SPX29150T-L-1-8, SPX2940T-1-8, SPX2940T-L-1-8, SPX2940U-1-8, SPX2940U-L-1-8, SPX3940AM3-1-8, SPX3940AM3-L-1-8, SPX3940AT-1-8, SPX3940AT-L-1-8, SPX3940AU-1-8, SPX3940AU-L-1-8, SPX3940M3-... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-54 [PDF] SPX1129M3-5-0, SPX1129M3-L-5-0, SPX1129R-5-0, SPX1129R-L-5-0, SPX1129T-5-0, SPX1129T-L-5-0, SPX1129U-5-0, SPX1129U-L-5-0, SPX1521M3-5-0, SPX1521M3-L-5-0, SPX1521R-5-0, SPX1521R-L-5-0, SPX1521T-5-0, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-53 [PDF] SPX1121M3-5-0, SPX1121M3-L-5-0, SPX1121N-5-0, SPX1121N-L-5-0, SPX2950ACN-5-0, SPX2950ACN-L-5-0, SPX2950CN-5-0, SPX2950CN-L-5-0, SPX2954AM3-5-0, SPX2954AM3-L-5-0, SPX2954AN-5-0, SPX2954AN-L-5-0, SPX295... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-52 [PDF] LP2950ACN-5-0, LP2950ACN-L-5-0, LP2950CN-5-0, LP2950CN-L-5-0, LP2951ACS-5-0, LP2951ACS-L-5-0, LP2951CS-5-0, LP2951CS-L-5-0, LP2950ACN-3-3, LP2950ACN-L-3-3, LP2950CN-3-3, LP2950CN-L-3-3, LP2951ACS-3-3,... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-51 [PDF] SPX2815AR-2-5, SPX2815AR-L-2-5, SPX2815AT-2-5, SPX2815AT-L-2-5, SPX2815AU-2-5, SPX2815AU-L-2-5, SPX2815R-2-5, SPX2815R-L-2-5, SPX2815T-2-5, SPX2815T-L-2-5, SPX2815U-2-5, SPX2815U-L-2-5, SPX2815AR-3-3,... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-50 [PDF] SPX1117R-2-8-5, SPX1117R-L-2-8-5, SPX1117U-2-8-5, SPX1117U-L-2-8-5, SPX2810T-L-1-5, SPX1117R-1-5, SPX1117R-L-1-5, SPX1117T-1-5, SPX1117T-L-1-5, SPX1117U-1-5, SPX1117U-L-1-5, SPX2810AU-1-5, SPX2810AU-L... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-49 [PDF] SPX1581T5-2-5, SPX1581T5-L-2-5, SPX1581U5-2-5, SPX1581U5-L-2-5, SPX1585AT-2-5, SPX1585AT-L-2-5, SPX1585AU-2-5, SPX1585AU-L-2-5, SPX1585T-2-5, SPX1585T-L-2-5, SPX1585U-2-5, SPX1585U-L-2-5, SPX1581T5-3-... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-48 [PDF] SPX1582T5-5-0, SPX1582T5-L-5-0, SPX1582U5-5-0, SPX1582U5-L-5-0, SPX1582T5-1-5, SPX1582T5-L-1-5, SPX1582U5-1-5, SPX1582U5-L-1-5, SPX1583T5-1-5, SPX1583T5-L-1-5, SPX1583U5-1-5, SPX1583U5-L-1-5, SPX1587A... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-47 [PDF] SPX1004M1-2-5, SPX1004M1-L-2-5, SPX1004N-2-5, SPX1004N-L-2-5, SPX1004S1-2-5, SPX1004S1-L-2-5, SPX1004S2-2-5, SPX1004S2-L-2-5, SPX1004AM1-1-2, SPX1004AM1-L-1-2, SPX1004AN-1-2, SPX1004AN-L-1-2, SPX1004A... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-45 [PDF] SP4446EK-L, SP6690EK, SP6690EK1, SP6690EK1-L, SP6690EK-L, SP6690ER, SP6690ER-L, SP6691EK, SP6691EK1, SP6691EK1-L, SP6691EK-L, SP6691ER, SP6691ER-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-44 [PDF] SPX4041M, SPX4041M-L, SPX4041AS, SPX4041AS-L, SPX4041N, SPX4041N-L, SPX4041S, SPX4041S-L, SPX432AM, SPX432AM1, SPX432AM1-L, SPX432AM5, SPX432AM5-L, SPX432AM-L, SPX432AN, SPX432AN-L, SPX432AS, SPX432AS... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-43 [PDF] SPX431BN, SPX431BN-L, SPX431BS, SPX431BS-L, SPX431CM1, SPX431CM1-L, SPX431CM5, SPX431CM5-L, SPX431CN, SPX431CN-L, SPX431CS, SPX431CS-L, SPX1431M1, SPX1431M1-L, SPX1431M5, SPX1431M5-L, SPX1431N, SPX143... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-42 [PDF] SPX3431M, SPX3431M-L, SPX2431AM, SPX2431AM5, SPX2431AM5-L, SPX2431AM-L, SPX2431M, SPX2431M5, SPX2431M5-L, SPX2431M-L, SPX431LAM, SPX431LAM1, SPX431LAM1-L, SPX431LAM-L, SPX431LAN, SPX431LAN-L, SPX431LA... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-41 [PDF] SP6120BCY, SP6120BCY-L, SP6120BEW, SP6120BEW-L, SP6120BEY, SP6120BEY-L, SP6120BHY, SP6120BHY-L, SP6120HBEY, SP6120HBEY-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-40 [PDF] SP6123CN, SP6123CN-L, SP6123EN, SP6123EN-L, SP6128ACY, SP6128ACY-L, SP6128AEY, SP6128AEY-L, SP6128AHY, SP6128AHY-L, SP6123ACN, SP6123ACN-L, SP6123AEN, SP6123AEN-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-39 [PDF] SP6121EN, SP6121EN-L, SP6121CN, SP6121CN-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-38 [PDF] SP6122ACU, SP6122ACU-L, SP6122ACU-1-5, SP6122ACU-L-1-5, SP6122ACU-1-2-5, SP6122ACU-L-1-2-5, SP6122CU, SP6122CU-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-37 [PDF] SP706XP, SP706XP-L, SP813MXN, SP813MXN-L, SP813MXP, SP813MXP-L, SP705CN, SP705CN-L, SP705CP, SP705CP-L, SP705CU, SP705CU-L, SP705EN, SP705EN-L, SP705EP, SP705EP-L, SP705EU, SP705EU-L, SP705XN, SP705XN... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-36 [PDF] SP6120CY, SP6120CY-L, SP6120EY, SP6120EY-L, SP6120HEY, SP6120HEY-L, SP6120HY, SP6120HY-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-35 [PDF] SP693AXN, SP693AXN-L, SP693AXP, SP693AXP-L, SP693AXT, SP693AXT-L, SP691ACN, SP691ACN-L, SP691ACP, SP691ACP-L, SP691ACT, SP691ACT-L, SP691AEN, SP691AEN-L, SP691AEP, SP691AEP-L, SP691AET, SP691AET-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-34 [PDF] SP707CN, SP707CN-L, SP707CP, SP707CP-L, SP707CU, SP707CU-L, SP707EN, SP707EN-L, SP707EP, SP707EP-L, SP707EU, SP707EU-L, SP707XN, SP707XN-L, SP707XP, SP707XP-L, SP708CN, SP708CN-L, SP708CP, SP708CP-L, ... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-33 [PDF] SP791XN, SP791XN-L, SP791XP, SP791XP-L, SP791CN, SP791CN-L, SP791CP, SP791CP-L, SP791EN, SP791EN-L, SP791EP, SP791EP-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-32 [PDF] SP690AXN, SP690AXN-L, SP690AXP, SP690AXP-L, SP802LXN, SP802LXN-L, SP802LXP, SP802LXP-L, SP692AXN, SP692AXN-L, SP692AXP, SP692AXP-L, SP802MXN, SP802MXN-L, SP802MXP, SP802MXP-L, SP690ACN, SP690ACN-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-31 [PDF] SP802SXN, SP802SXN-L, SP802SXP, SP802SXP-L, SP802TXN, SP802TXN-L, SP802TXP, SP802TXP-L, SP802RXN, SP802RXN-L, SP802RXP, SP802RXP-L, SP690SXN, SP690SXN-L, SP690SXP, SP690SXP-L, SP690TXN, SP690TXN-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-30 [PDF] SP3485CN, SP3485CN-L, SP3485CP, SP3485CP-L, SP3485EN, SP3485EN-L, SP3485EP-L, SP3481CN, SP3481CN-L, SP3481CP, SP3481CP-L, SP3481EN, SP3481EN-L, SP3481EP, SP3481EP-L, SP3483CN, SP3483CN-L, SP3483CP, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-29 [PDF] SP526CF, SP526CF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-27 [PDF] SP233ECT, SP233ECT-L, SP233EET, SP233EET-L, SP310ECA, SP310ECA-L, SP310ECP, SP310ECP-L, SP310ECT, SP310ECT-L, SP310EEA, SP310EEA-L, SP310EEP, SP310EEP-L, SP310EET, SP310EET-L, SP385ECA, SP385ECA-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-26 [PDF] SP504CF, SP504CF-L, SP504MCF, SP504MCF-L, SP514CF, SP514CF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-25 [PDF] SP200CP, SP200CP-L, SP200CT, SP200CT-L, SP200EP, SP200EP-L, SP200ET, SP200ET-L, SP204CP, SP204CP-L, SP204CT, SP204CT-L, SP204ET, SP204ET-L, SP205BCP, SP205BCP-L, SP205BEP, SP205BEP-L, SP205CP, SP205CP... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-24 [PDF] SP485BN, SP485BN-L, SP485CN, SP485CN-L, SP485CS, SP485CS-L, SP485DN, SP485DN-L, SP485EN, SP485EN-L, SP485ES, SP485ES-L, SP485SN, SP485SN-L, SP485SS, SP485SS-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-23 [PDF] SP2209EEY, SP2209EEY-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-22 [PDF] SP231ACP, SP231ACP-L, SP231ACT, SP231ACT-L, SP231AEP, SP231AEP-L, SP231AET, SP231AET-L, SP232ACNSD, SP232ACNSD-L, SP232AENSD, SP232AENSD-L, SP233ACP, SP233ACP-L, SP233ACT, SP233ACT-L, SP233AEP, SP233A... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-21 [PDF] SP507CF, SP507CF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-20 [PDF] SP483CN, SP483CN-L, SP483CS, SP483CS-L, SP483ECN, SP483ECN-L, SP483ECP, SP483ECP-L, SP483EEN, SP483EEN-L, SP483EEP, SP483EEP-L, SP483EN, SP483EN-L, SP483ES, SP483ES-L Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-19 [PDF] SP488ACP, SP488ACP-L, SP488ACT, SP488ACT-L, SP488AEP, SP488AEP-L, SP488AET, SP488AET-L, SP488CN, SP488CN-L, SP488CS, SP488CS-L, SP488CT, SP488CT-L, SP488ES, SP488ES-L, SP488ET, SP488ET-L, SP489CN, SP4... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-18 [PDF] SP486CN, SP486CN-L, SP486CP, SP486CP-L, SP486EP, SP486EP-L, SP487CN, SP487CN-L, SP487CP, SP487CP-L, SP487EP, SP487EP-L, SP486CS, SP486CS-L, SP486CT, SP486CT-L, SP486ES, SP486ES-L, SP486ET, SP486ET-L, ... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-17 [PDF] SP322CF, SP322CF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-16 [PDF] SP331CT, SP331CT-L, SP331ET, SP331ET-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-15 [PDF] SP503CF, SP503CF-L, SP503CM, SP503CM-L, SP503EF, SP503EF-L, SP503EM, SP503EM-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-14 [PDF] SP334CA, SP334CA-L, SP334CT, SP334CT-L, SP334ET, SP334ET-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-13 [PDF] SP485RCN, SP485RCN-L, SP485RCP, SP485RCP-L, SP485RCS-L, SP485REN, SP485REN-L, SP485REP, SP485REP-L, SP485RES-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-12 [PDF] SP320ACF, SP320ACF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-11 [PDF] SP3070EEN, SP3070EEN-L, SP3070EMN, SP3070EMN-L, SP3071EEN, SP3071EEN-L, SP3071EMN, SP3071EMN-L, SP3073EEN, SP3073EEN-L, SP3073EMN, SP3073EMN-L, SP3074EEN, SP3074EEN-L, SP3074EMN, SP3074EMN-L, SP3076EE... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-10 [PDF] SP3508CF, SP3508CF-L, SP3508EF, SP3508EF-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-09 [PDF] SP204EP-L, SP208CA, SP208CA-L, SP208CP, SP208CP-L, SP208CT, SP208CT-L, SP208EA, SP208EA-L, SP208ECA, SP208ECA-L, SP208ECP, SP208ECP-L, SP208ECT, SP208ECT-L, SP208EEA, SP208EEA-L, SP208EEP, SP208EEP-L,... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-08 [PDF] SP1485ECN, SP1485ECN-L, SP1485ECP, SP1485ECP-L, SP1485EEN, SP1485EEN-L, SP1485EEP, SP1485EEP-L, SP1485EMN, SP1485EMN-L, SP485ECN, SP485ECN-L, SP485ECP, SP485ECP-L, SP485EEN, SP485EEN-L, SP485EEP, SP48... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-07 [PDF] SP3243CR, SP3243CR-L, SP3243BCA, SP3243BCA-L, SP3243BCR, SP3243BCR-L, SP3243BCT, SP3243BCT-L, SP3243BCY, SP3243BCY-L, SP3243BEA, SP3243BEA-L, SP3243BER, SP3243BER-L, SP3243BET, SP3243BET-L, SP3243BEY,... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-06 [PDF] SP3232ECT, SP3232ECT-L, SP3232ECY, SP3232ECY-L, SP3232EEA, SP3232EEA-L, SP3232EEN, SP3232EEN-L, SP3232EEP, SP3232EEP-L, SP3232EET, SP3232EET-L, SP3232EEY, SP3232EEY-L, SP3232EN, SP3232EN-L, SP3232EP, ... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-04 [PDF] SP233ECP, SP233ECP-L, SP233EEP, SP233EEP-L, SP202ECN, SP202ECN-L, SP202ECP, SP202ECP-L, SP202ECT, SP202ECT-L, SP202EEN, SP202EEN-L, SP202EEP, SP202EEP-L, SP202EET, SP202EET-L, SP232ACN, SP232ACN-L, SP... Announcing transfer of certain Power Management and Interface Products from Hillview wafer fabrication facility to wafer foundry Episil. See attached Product List. Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-03 [PDF] SP3203CA, SP3203CA-L, SP3203CY, SP3203CY-L, SP3203EA, SP3203EA-L, SP3203ECA, SP3203ECA-L, SP3203ECY, SP3203ECY-L, SP3203EEA, SP3203EEA-L, SP3203EEY, SP3203EEY-L, SP3203EY, SP3203EY-L Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-02 [PDF] SP508CF, SP508CF-L, SP508EF, SP508EF-L, SP509CF, SP509CF-L, SP508CF, SP508CF-L, SP508EF, SP508EF-L, SP509CF, SP509CF-L, SP508CF, SP508CF-L, SP508EF, SP508EF-L, SP509CF, SP509CF-L, SP508CF, SP508CF-L, ... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
2/2/2006 PCN-06-0130-01 [PDF] SP3238CA, SP3238CA-L, SP3238CY, SP3238CY-L, SP3238EA, SP3238EA-L, SP3238ECA, SP3238ECA-L, SP3238ECY, SP3238ECY-L, SP3238EEA, SP3238EEA-L, SP3238EEY, SP3238EEY-L, SP3238EY, SP3238EY-L, SP3239CA, SP3239... Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
1/17/2006 PCN-06-0117-01 [PDF] SP301CT, SP301ES, SP301ET, SP302CT, SP303CT, SP304CS, SP304CT, SP304ES, SP304ET, SP306CT, SP306ET, SP319CF, SP319CF-L, SP3222EHCA, SP3222EHCA-L, SP3222EHCP, SP3222EHCP-L, SP3222EHCT, SP3222EHCT-L, SP3... Announcing discontinuance of certain low volume Power Management and Interface Products and last dates to place lifetime. buy orders Low Volume Power Management and Interface products are being discontinued due to cessation of operations of the Sipex Hillview Fabrication manufacturing site.
12/9/2005 PCN-05-1208-01 [PDF] SP8028, SP8029, SP8080, SP8082, SP8083, SP8084 Adding Taiwan IC Packaging Corp. (TICP) as additional assembly suncontractor for the OLCC packages To increase capacity for the OLCC pkg so as to be able to meet Customer demand with continued high quality and reliability
9/1/2005 PCN-05-0801-02 [PDF] SP6682 Sipex qualified UMC as an alternative manufacturing source for the SP6682. Sipex plans to add UMC for additional capacity for the SP6682.
9/1/2005 PCN-05-0801-01 [PDF] SP6648 Sipex qualified UMC as an alternative manufacturing source for the SP6648. Sipex plans to add UMC for additional capacity for the SP6648.
7/28/2005 PCN-05-0725-01 [PDF] SP8069DG Sipex qualified Linseng as an alternate assembly and test source for the SP8069DG. ASE is currently not capable of providing the required capacity for the assembly and test service so Sipex for the Sipex OPLGA pkg configuration.
7/27/2005 PCN-05-0725-02 [PDF] SP8127DG Sipex qualified Linseng as an alternate assembly and test source for SP8127DG. ASE is currently not capable of providing the required capacity for the assembly and test service so Sipex for the Sipex OPLGA pkg configuration.
6/16/2005 PCN-05-0615-01 [PDF] SP8069 (SP8069DG) Add qualified assembly subcontractor Lingsen (in addition to existing qualified subcontructor ASE) for 16ld OPLGA package type. Ordering part Number for new Lingsen version is SP8069DGA4. Ordering part number for existing ASE version remains SP8069DG Operational flexibility and cost reduction
4/29/2005 PCN-05-0428-01 [PDF] All TO263 3 Lead Packages Addition of assembly sub-contractor CET Manufacturing flexibility
4/29/2005 PCN-05-0428-01(2) [PDF] All TO92 Packages Addition of assembly sub-contractor CET Manufacturing flexibility
4/14/2005 PCN-04-0410-01 [PDF] SP6682 Product Family SP6648 Product Family UMC has been added as Qualified wafer fab. subcontractor for SP6682 & SP6684 product families. Consolidation of wafer fab subcontractors which will result in decrease manufacturing cycle.
12/22/2004 PCN-04-1222-01 [PDF] SP730CK-4-375, SP730EK-4-375, SPX1432AM, SPX1432M, SPX2431AM, SPX2431AM-L, SPX2431LAM, SPX2431LM, SPX2431M, SPX2431M-L, SPX3431M, SPX385AM-2-5, SPX385AM-5-0, SPX385M-2-5, SPX385M-5-0, SPX4040AM-2-5, S... Sipex has qualified CET to perform assembly operation fot the SOT23 -3 L package. Some of the CET SOT23 3 L pkg. dimensions are slightly different than the Jedec To-236 Variation AB std. Improve manufacturability
12/9/2004 PCN-04-1118-01 [PDF] Applies to all voltage accuracy and temperature options for the 1.2 micron. Sipex has qualified the 1.2 micron wafer fab process for the above-listed products Improve manufacturability
11/2/2004 PCN-04-1102-04 [PDF] Applies to all voltage accuracy and temperature options for listed devices delivered in the TSSOP 16 lead package Applies to all packing option (T/R, Tube or Bulk) Sipex qualified CET as an alternate assembly and test source for the above listed products. Improve manufacturability flexibility.
11/2/2004 PCN-04-1102-03 [PDF] Applies to all voltage accuracy and temperature options for above devices delivered in the 3-leadSOT - 22 package Applies to all packing option (T/R, Tube or Bulk for 3-lead SOT-223) Sipex qualified CET as an alternate assembly and test source for the above listed products. Improve manufacturability flexibility.
11/2/2004 PCN-04-1102-02(1) [PDF] Applies to all voltage accuracy and temperature options for above devices delivered in the NSOIC16 16 -lead package Applies to all packing option (T/R, Tube or Bulk for NSOIC16) Sipex qualified Fujitsu as an alternate assembly and test source for the above listed products. Improve manufacturability flexibility.
11/2/2004 PCN-04-1102-01 [PDF] Applies to all voltage accuracy and temperature options for above devices in the NSOIC8 8 -lead package Applies to all packing option (T/R, Tube or Bulk for NSOIC16) Sipex qualified Fujitsu as an alternate assembly and test source for the above listed products. Improve manufacturability flexibility.
11/2/2004 PCN-04-1101-02 [PDF] Applies to all voltage accuracy and temperature options for listed devices delivered in the SOT-23 3 lead package Applies to all packing option (T/R, Tube or Bulk) Sipex qualified CET as an alternate assembly and test source for the above listed products. Improve manufacturability flexibility.
11/2/2004 PCN-04-1101-01 [PDF] Applies to all voltage accuracy and temperature options for listed devices delivered in the SOT-89 3 lead package Applies to all packing option (T/R, Tube or Bulk) Sipex qualified CET as an alternate assembly and test source for the above listed products. Improve manufacturability flexibility.
10/22/2004 PCN-04-0818-01 [PDF] T/R 14LD and 16LD TSSOP packages Change from the present 16mmx12mm T/R carrier tape to 12mm to 8mm. Standard reel qty. from 1500pcs. To 2500pcs. Implemented to comply with EIA and industry standards
10/5/2004 PCN-04-1004-01 [PDF] SP682 Sipex transfering the wafer fab for this device from outside foundary to Sipex Hillview wafer Fab Improved manufacturing and availability of Sp682 charge pump device
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