|
2/5/2010
|
PCN_10-0201-01 [PDF]
|
SP7686AER-L, SP7686AER-L/TR, SP7686ER-L, SP7686ER-L/TR
|
Product Transfer from Polar fab to Tower.
|
Business consolidation and product re-characterization.
|
|
2/4/2010
|
PCN_09-0909-02a [PDF]
|
XRT5683AID-F, XRT5683AIDTR-F, XRT8000ID-F, XRT8000IDTR-F, XRT8001ID-F, XRT8001IDTR-F
|
Elimination of the back marking.
|
Standardization.
|
|
1/25/2010
|
PCN_10-0107-01 [PDF]
|
SP3232EHCA-L, SP3232EHCA-L/TR, SP3232EHEA-L, SP3232EHEA-L/TR, SP3232EUCA-L, SP3232EUCA-L/TR, SP3232EUEA-L, SP3232EUEA-L/TR, SP3232EBCA-L, SP3232EBCA-L/TR, SP3232EBEA-L, SP3232EBEA-L/TR, SP3232ECA-L, S...
|
Material Change; Product transfer to a qualified assembly supplier.
|
To enhance production capacity and also to use environmentally friendly Green material.
|
|
12/29/2009
|
PDN_09-1229-01 [PDF]
|
SPX29302AT5-L, SPX29302AT5-L/TR
|
Notice of Obsolescence
|
Discontinued due to low market demand, effective immediately.
|
|
12/21/2009
|
PCN_09-1217-01 [PDF]
|
SP3244ECA-L, SP3244ECA-L/TR, SP3244ECY-L, SP3244ECY-L/TR, SP3244EEA-L, SP3244EEA-L/TR, SP3244EER1-L, SP3244EER1-L/TR, SP3244EEY-L, SP3244EEY-L/TR, SP3245ECA-L, SP3245ECA-L/TR, SP3245ECY-L, SP3245ECY-L...
|
In reference to the PCN/letter PCN06-0130-06a dated March 2006 regarding the Hillview, USA
wafer fabrication closure, the SP324X products were transferred to Episil, Taiwan. In this transfer,
the family has received four layer changes (Poly, Via, Metal1, and Metal 2).
|
Fab closure and also to improve the product performance.
|
|
12/17/2009
|
PCN_09-1204-01 [PDF]
|
SP3224ECA-L/TR, SP3225ECA-L/TR, SP3226ECA-L/TR, SP3227ECA-L/TR, SP3224ECA-L, SP3225ECA-L, SP3226ECA-L, SP3227ECA-L, SP3224ECY-L/TR, SP3225ECY-L/TR, SP3226ECY-L/TR, SP3227ECY-L/TR, SP3224ECY-L, SP3225E...
|
In reference to the PCN/letter PCN06-0130-06a dated March 2006 regarding Hillview, USA wafer fabrication closure the SP322X products were transferred to Episil, Taiwan. In this transfer the family has received four layer changes (Poly, Via, Metal1, and Metal 2).
|
Fab closure and also to improve the product performance.
|
|
12/14/2009
|
PCN_09-1109-01 [PDF]
|
SP3220EBCY-L, SP3220EBCY-L/TR, SP3220EBEY-L, SP3220EBEY-L/TR, SP3220ECY-L, SP3220ECY-L/TR, SP3220EEY-L, SP3220EEY-L/TR, SP3220EUCY-L, SP3220EUCY-L/TR, SP3220EUEY-L, SP3220EUEY-L/TR, SP3223EUCY-L, SP32...
|
Material Change.
|
Use environmental friendly Green (halogen free) material and also for standardization.
|
|
12/8/2009
|
PCN_09-1028-01 [PDF]
|
XRT83SL28IV-F
|
Assembly supplier is changed from Unisem, Indonesia to ASAT, China. ASAT is an alternate qualified assembly supplier for this package family. There is no change to Form, Fit, or Function as stated in the applicable datasheet.
|
Using an attached heat spreader to the die paddle will improve product manufacturability and it is readily available in ASAT.
|
|
12/7/2009
|
PDN_091207-01 [PDF]
|
SP4446EK-G, SP4446EK-G/TR, SP4446EK-L, SP4446EK-L/TR, SP6690EK-L, SP6690EK-L/TR, SP6690ER-L, SP6690ER-L/TR, SP6691EK1-L, SP6691EK1-L/TR, SP6691EK-L, SP6691EK-L/TR
|
Notice of Obsolescence – Selected Power Management Parts
|
Discontinued due to cost effectiveness reasons, effective immediately.
|
|
12/7/2009
|
PCN_09-0911-01 [PDF]
|
LP2951CS-L-3-3, LP2951CS-L-3-3/TR,
LP2951CS-L-5-0, LP2951CS-L-5-0/TR,
SP1485ECN-L, SP1485ECN-L/TR,
SP1485EEN-L, SP1485EEN-L/TR,
SP1485EMN-L, SP1486EEN-L,
SP1486EEN-L/TR,
SP1486EMN-L,
SP1...
|
Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material.
|
Enhance packages to be Green (halogen-free).
|
|
10/28/2009
|
PCN_091020-01 [PDF]
|
SP508CF-L, SP508EF-L
|
Design and datasheet changes.
|
To improve device performance and to center the propagation delay.
|
|
10/21/2009
|
PCN_091007-01 [PDF]
|
SP2525A-1EN-L, SP2525A-1EN-L/TR, SP2525A-2EN-L, SP2525A-2EN-L/TR, SP2526A-1EN-L, SP2526A-1EN-L/TR, SP2526A-2EN-L, SP2526A-2EN-L/TR, SP2996BEN-L, SP2996BEN-L/TR, SP809EK-L-2-3/TR, SP809EK-L-2-6/TR, SP8...
|
Material Change
|
Enhance Pb-free package to be Pb-free and halogen free package.
|
|
10/13/2009
|
PDN_091013-01 [PDF]
|
XRT7298IP-F, XRT6166CP-F, XRT6166IP-F
|
Notice of Obsolescence.
|
Discontinued due to low market demand, effective immediately.
|
|
10/9/2009
|
PCN_090909-02 [PDF]
|
XRT5683AID-F, XRT5683AIDTR-F, XRT8000ID-F, XRT8000IDTR-F, XRT8001ID-F, XRT8001IDTR-F
|
To add an alternate assembly supplier.
|
Capacity enhancement.
|
|
10/1/2009
|
PDN_091001-01 [PDF]
|
XR88C681CP/28-F, XR88C681P/28-F
|
Notice of Obsolescence.
|
Discontinued due to low market demand, effective immediately.
|
|
9/28/2009
|
PDN_090928-01 [PDF]
|
XRT7296IP-F, XRT7296AIP-F
|
Notice of Obsolescence.
|
Discontinued due to low market demand, effective immediately.
|
|
9/21/2009
|
PCN_090911-02 [PDF]
|
SP334CT-L, SP334CT-L/TR, SP334ET-L, SP334ET-L/TR
|
Wafer Fabrication Site Transfer.
|
Complete the transfer of the SP334 wafer fabrication from Hillview foundry to Silan foundry (ref. PCN 06-0130-14).
|
|
9/18/2009
|
PCN_090806-01 [PDF]
|
XRT83VSH316IB-F
|
Pin “SDO/D0” (Ball Y5) will stay at High-Z when Pin “SER_PARB” (Ball T17) is pulled “High” and chip is not selected. Metal-2 layer is changed to implement the fix.
|
Certain applications require SDO/D0 pin to be at high-Z when the device is not selected.
|
|
9/17/2009
|
PCN_090909-01 [PDF]
|
SP705CN-L, SP706CN-L, SP707CN-L, SP708CN-L, SP705CN-L/TR, SP706CN-L/TR, SP707CN-L/TR, SP708CN-L/TR, SP705CU-L, SP706CU-L, SP707CU-L, SP708EN-L, SP705CU-L/TR, SP706CU-L/TR, SP707CU-L/TR, SP708EN-L/TR, ...
|
Test conditions for RESET Output Voltage @ max voltage =0.30V is changed.
|
Test standardization.
|
|
9/17/2009
|
PCN_09-0909-01 [PDF]
|
SP705CN-L, SP705CN-L/TR, SP705CU-L, SP705CU-L/TR, SP705EN-L, SP705EN-L/TR, SP706CN-L, SP706CN-L/TR, SP706CU-L, SP706CU-L/TR, SP706EN-L, SP706EN-L/TR, SP706RCN-L, SP706RCN-L/TR, SP706RCU-L, SP706RCU-L/...
|
Data Sheet Change
|
Test conditions for RESET Output Voltage @ max voltage =0.30V is changed From: Vcc =1.1V, Isink =50ua
To: Vcc =1.2V, Isink = 100ua
|
|
9/11/2009
|
PDN_090911-01 [PDF]
|
XRT56L85D-F, XRT56L85DTR-F
|
Notice of Obsolescence – Select Communication Products.
|
Discontinued due to low market demand, effective immediately.
|
|
9/9/2009
|
PCN_090903-01 [PDF]
|
ST16C2450CQ48-F, ST16C2450IQ48-F, ST16C2550CQ48-F, T16C2550CQ48TR-F, ST16C2550IQ48-F, ST16C2550IQ48TR-F, XR16C2550IM-F, XR16C2550IMTR-F
|
Utilize an existing qualified alternate assembly and test supplier.
|
Business consolidation.
|
|
8/24/2009
|
PDN_090824-01 [PDF]
|
SP7611AEC6-L, SP7611AEC6-L/TR, SP7611AER6-L, SP7611AER6-L/TR, SP7611CEC6-L, SP7611CEC6-L/TR, SP7612AEC6-L, SP7612AEC6-L/TR, SP7614AEC6-L, SP7614AEC6-L/TR, SP7614AER6-L, SP7614AER6-L/TR
|
Notice of Obsolescence – Selected Power Management Parts
|
Discontinued due to low market demand, effective immediately.
|
|
8/7/2009
|
PDN_090807-01 [PDF]
|
SP1086V1-L-3-3, SP317V2-L, SP34063AEN-L, SP6260AEK-L, SP6260BEK-L, SP6260CEK-L, SP6260DEK-L, SP6260EEK-L, SP6260FEK-L, SP6260GEK-L, SP6265AEK1-L, SP6265BEK1-L, SP6265FEK1-L, SP6265GEK1-L, SP6265HEK1-L...
|
Notice of Obsolescence – Selected Power Management Parts
|
Discontinued due to low market demand, effective immediately.
|
|
7/31/2009
|
PRN_090731-01 [PDF]
|
SP6205ER-L-1-8, SP6205ER-L-1-8/TR
|
Notice of Reactivation of previously announced obsoleted products –Selected Power Management Parts
|
Power Management products listed have been reactivated by Exar Corporation due to continuing customer demand, effective immediately.
|
|
7/16/2009
|
PCN_090716-01 [PDF]
|
XRS10L120IL-F, XRS10L220IV-F, XRS10L210IL-F, XRS10L210IV-F
|
One layer mask is changed in CSM, Singapore wafer fabrication (M2; Revision C to D). There is no change to
product Form, Fit or Function as stated in the applicable datasheets.
|
To improve product performance.
|
|
7/15/2009
|
PCN_090715-01 [PDF]
|
SP6669AEK-L/TRR3, SP6669BEK-L/TRR3, SP6669CEK-L/TRR3, SP6669DEK-L/TRR3, SP6260AEK-L/TR, SP6260BEK-L/TR, SP6260CEK-L/TR, SP6260DEK-L/TR, SP6260EEK-L/TR, SP6260FEK-L/TR, SP6260GEK-L/TRSP6699EK-L, SP6699...
|
These products will be dry packed to eliminate possible moisture related failures at board assembly. There is no change to Form, Fit, or Function as stated in the applicable datasheets.
|
Products having moisture sensitivity greater than level 1 require dry packs according to the internal procedures and JEDEC guidelines.
|
|
7/15/2009
|
PCN_090624-01 [PDF]
|
SP6685ER-L, SP6685ER-L/TR, SP6686ER-L, SP6686ER-L/TR
|
Wafer fabrication process flow in Jazz Semiconductor foundry has been modified and two metal masks were revised. Applicable datasheets are changed to specify all pins meet ESD-HBM of 2KV except EN pin that meets 1KV. There is no change to Form, Fit, or Function as stated in the applicable datasheets except for the ESD rating as stated above.
|
Process standardization to eliminate product specific flow.
|
|
6/26/2009
|
PCN_09-0626-01 [PDF]
|
XR20M1170IG16, XR20M1170IG16-F, XRT91L33IG, XRT91L33IGTR, XR20M1170IG24, XR20M1170IG24-F, XRT59L81IG, XRT59L81IG-F, XRT59L81IGTR, XRT59L81IGTR-F, XRT85L61IG, XRT85L61IG-F, XRT85L61IGTR, XRT85L61IGTR-F...
|
Elimination of the back (bottom) mark and addition of the lot number to the top mark.
|
To eliminate duplication and to reduce assembly cycle times.
|
|
6/26/2009
|
PDN_090626-01 [PDF]
|
SPX2815AR-L, SPX2815AR-L/TR
|
Notice of Obsolescence –Selected Power Management Parts
|
Discontinued due to low market demand, effective immediately.
|
|
6/4/2009
|
PCN_090604-01 [PDF]
|
SPX2940T-L-5-0/TR, SPX29150T-L-3-3/TR, SPX29150T-L-5-0/TR, SPX2940U-L-5-0, SPX2940T-L-5-0, SPX29150T-L-3-3, SPX29150T-L-5-0
|
Die attach material is changed from Pb/Sn/Ag solder to 84-1LMISR4 epoxy.
|
To eliminate lead – To be RoHS compliance without exemption.
|
|
5/29/2009
|
pcn09-0528-01_SP7616 [PDF]
|
SP7616ER-LSP7616ER-L/TR
|
High Accuracy 4-Channel Low Side LED Driver for CCFL Replacement
|
To improve manufacturability of these products as a result of process changes.
|
|
5/29/2009
|
SP7616_Rev2 0 4_2009-05-22 [PDF]
|
SP7616
|
High Accuracy 4-Channel Low Side LED Driver for CCFL Replacement
|
Refer to PCN for more details.
|
|
5/19/2009
|
PDN 081126-01 [PDF]
|
Serial Leaded Discontinuation Notice 081126-01
|
Notice of Obsolescence
|
Discontinued by Exar Corporation due to low market demand
|
|
3/4/2009
|
PDN_090304-01 [PDF]
|
Selected Power Management Parts (Refer to PDF)
|
Notice of Obsolescence
|
Discontinued by Exar Corporation due to low market demand
|
|
1/30/2009
|
PDN_090130-01 [PDF]
|
SP508CF, SP508CF/TR, SP508EF, SP509CF, SP3508EF, SP3508CF
|
Notice of Last-time Buy and Obsolescence
|
Package Discontinuation Notice
|
|
1/20/2009
|
PCN_09-0120-01 [PDF]
|
SP6134, SP6134H, SP6137, and SP6139 Families
|
Datasheet Changes
|
Refer to PCN for more details.
|
|
12/23/2008
|
PCN_08-1223-01 [PDF]
|
SP202ECN-L, SP202ECN-L/TR, SP202ECP-L, SP202ECT-L, SP202ECT-L/TR, SP202EEN-L, SP202EEN-L/TR, SP202EEP-L, SP202EET-L, SP202EET-L/TR, SP232ECN-L, SP232ECN-L/TR, SP232ECP-L, SP232ECT-L, SP232ECT-L/TR, SP...
|
ESD rating of +/- 15kV IEC 1000-4-2 Air Discharge and +/-8kV Contact Discharge are removed from the
datasheets.
|
Product re-characterization.
|
|
12/11/2008
|
PCN_08-1211-01 [PDF]
|
XRT73R12IB-F, XRT75R12IB-F, XRT75R12DIB-F, XRT83L314IB-F, XRT83SL314IB-F, XRT94L31IB-F, XRT94L33IB-F
|
Ordering part number
|
Exar is redefining the “-F” and – “L” portion of part number nomenclature.
|
|
12/1/2008
|
PCN_08-1201-01 [PDF]
|
SP6125EK1-L, SP6126EK1-L, SP6127EK1-L, SP7601EK1-L, SP6330EK1-L-W-G-C, SP6330EK1-L-X-J-C, SP6330EK1-L-Z-J-C, SP6336EK1-L-X-D-A, SP6339EK1-L-Z-J-C
|
Material Change
|
To enhance the assembly process and to promote the green environment.
|
|
12/1/2008
|
PCN_08-1201-02 [PDF]
|
XRT72L52IQ-F & XRT72L52IQTR-F
|
Material Change, Alternate Qualified Assembly Supplier
|
Supplier’s decision to end the life of this package body size and lead count.
|
|
11/26/2008
|
PDN_081126-01 [PDF]
|
SP1481EEN, SP1481EEN/TR, SP202ECN, SP202ECN/TR, SP202ECP, SP202ECT, SP202ECT/TR, SP202EEN, SP202EEN/TR, SP202EET, SP202EET/TR, SP207CT, SP207CT/TR, SP208CA, SP208CA/TR, SP208CT, SP208CT/TR, SP208EA, S...
|
Notice of Obsolescence
|
Package Discontinuation Notice
|
|
11/13/2008
|
pcn_08-1113-01 [PDF]
|
SPX29501T5-L-1-8, SPX29501T5-L-1-8/TR, SPX29501T5-L-2-5, SPX29501T5-L-2-5/TR, SPX29501T5-L-3-3, SPX29501T5-L-3-3/TR, SPX29501T5-L-5-0, SPX29501T5-L-5-0/TR, SPX29502T5-L, SPX29502T5-L/TR, SPX29502U5-L
|
Dropout Voltage Changes
|
Transfer from Hillview Fab to Silan Fab requires relaxation of the specification to provide acceptable manufacturing yields.
|
|
11/7/2008
|
PCN_08-1107-01 [PDF]
|
SP310ACT-L, SP310ACT-L/TR, SP310AET-L, SP310AET-L/TR, SP310ECT, SP310ECT/TR, SP310ECT-L, SP310ECT-L/TR, SP310EET-L, SP310EET-L/TR, SP385ECT-L, SP385ECT-L/TR, SP385EET-L, SP385EET-L/TR, SP312ACT-L, SP3...
|
1. Assembly of 18ld WSOIC will be moved from Unisem-Malaysia to MMS in Shanghai, China which is an alternate qualified supplier.
2. Mold compound is changed from Sumitomo non green 6730B-L to Sumitomo G600.
|
Unisem Corporation is ending the life of this package lead count in their assembly offerings.
|
|
10/29/2008
|
PDN_081029-01 [PDF]
|
XRD8785AIK, XRD8785AIK-F, XRD8785AIP-F, XRD87L85AIK, XRD87L85AIK-F, XRD87L85AIP-F
|
Package Discontinuation Notice of 24ld SOP and 24ld PDIP package offerings.
|
Package Discontinuation Notice.
|
|
10/27/2008
|
pcn_08-1027-01 [PDF]
|
SP6126 & SP7656
|
Datasheet Change
|
Changing datasheet to eliminate the Vref tolerance specification at room temperature.
|
|
10/27/2008
|
pcn_08-1027-02 [PDF]
|
SP6669
|
Four (4) part numbers were modified to reflect the exact Tape and Reel packaging method. SP6669xEK-L/TR to become SP6669xEK-L/TRR3 with x=A to D.
|
Current part number did not reflect the actual Tape & Reel packing method.
|
|
10/22/2008
|
pcn_08-1022-01 [PDF]
|
SP504MCM-L, SP504MCM-L/TR
|
ESD rating of 500V HBM was added.
|
Product Re-Characterization.
|
|
10/3/2008
|
pcn08-1003-01 [PDF]
|
SP3080EMN-L, SP3081EEN-L, SP3081EEN-L/TR, SP3087EEN-L/TR, SP3086EEN-L, SP3086EEN-L/TR, SP3084EMN-L, SP3084EEN-L, SP3084EEN-L/TR, SP3083EEN-L/TR, SP3080EEN-L, SP3080EEN-L/TR, SP3087EEN-L, SP3083EEN-L, ...
|
Wafer Fabrication – Episil 1.2um CMOS
|
To correct auto-doping of N-Well causing Vtp variation and to eliminate device leakage.
|
|
10/2/2008
|
pcn_08-1002-01 [PDF]
|
SP503EM-L, SP503CM-L
|
Datasheet Change: Temperature and ESD Rating Change
|
Product Re-Characterization.
|
|
9/29/2008
|
pcn08-0929-01 [PDF]
|
SP231ACP-L, SP491CS-L, SP491ECP-L, SP491EEP-L, SP491ES-L, SP202ECP-L, SP202EEP-L, SP232ACP-L, SP232AEP-L, SP232ECP-L, SP232EEP, SP232EEP-L, SP26LV432CP-L, SP3232EBEP-L, SP3232ECP-L, SP3232EEP-L, SP323...
|
Product assembly of 14/16/18 lead PDIP families will be transferred from Unisem-Ipoh (Malaysia) to Unisem-Batam (Indonesia).
|
Business consolidation and use of environmental friendly material.
|
|
9/10/2008
|
PDN_080910-01 [PDF]
|
SP1084V1-L, SP1084V1-L/TR, SP1084V1-L-1-5, SP1084V1-L-1-5/TR, SP1084V1-L-1-8, SP1084V1-L-1-8/TR, SP1084V1-L-2-5, SP1084V1-L-2-5/TR, SP1084V1-L-2-85, SP1084V1-L-2-85/TR, SP1084V1-L-3-3, SP10...
|
Notice of Obsolescence –Selected Power Management Parts
|
This is notification that the Power Management products listed on the attached page have been discontinued by Exar Corporation due to low market demand, effective immediately.
|
|
8/12/2008
|
pcn_08-0812-03_spx5205 [PDF]
|
SPX5205
|
Datasheet Change: Load & Line Regulations
|
Product Re-Characterization
|
|
8/12/2008
|
pcn_08-0812-02_spx3819 [PDF]
|
SPX3819
|
Datasheet Change: Line Regulation
|
Product Re-Characterization.
|
|
4/7/2008
|
PCN_08-0407-01 [PDF]
|
SP619EK-L, SP619EK-L/TR
|
Data Sheet Change
|
SP619 has been re- characterizated.
|
|
4/1/2008
|
pcn08-0401-01 [PDF]
|
SPX385M-L-2.5, SPX385M-L-2.5/TR, SPX385N-L-2.5, SPX385N-L-2.5/TR, SPX385S-L-2.5, SPX385S-L-2.5/TR
|
Micropower Voltage Reference
|
Change the temperature limits from MAX 100PPM/C to 140PPM/C.
|
|
1/8/2008
|
pcn07-1102-06a [PDF]
|
SP3508CFSP3508CF-L, SP509CF-L SP320ACF, SP504MCF-L/TR SP505ACF, SP506CF-L/TR SP507CF, SP3508CF-L/TRSP3508EF, SP320ACF-L SP320CF-L, SP505ACF-1 SP505ACF-2, SP507CF-L SP514CF, SP3508EF-L , SP503CF, SP505...
|
Change of assembly subcontractor for all Sipex part numbers packaged in the 100 lead LQFP packages from Carsem to Unisem’s Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem’s Batam plant (formerly AIT).
|
Current subcontractor, Carsem, is discontinuing the packages.
|
|
12/5/2007
|
PCN_07-1205-01 [PDF]
|
SPX3819R2-L, SPX3819R2-L-1-5, SPX3819R2-L-1-8, SPX3819R2-L-3-3, SPX3819R2-L-5-0
|
Announcing the re-activation of previously announced discontinued products
|
The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
|
|
12/5/2007
|
PCN_07-1204-01 [PDF]
|
SP6200EM5-L-1-8/TR, SPX1004AM1-L-1-2
|
Announcing the re-activation of previously announced discontinued products.
|
The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
|
|
11/28/2007
|
PCN_07-1128-01 [PDF]
|
SP6200EM5-L-3-0/TR, SP6200EM5-L-3-0
|
Announcing the re-activation of previously announced discontinued products.
|
The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
|
|
5/29/2007
|
PCN_07-0529-02 [PDF]
|
SPX1004AM1-L-1-2/TR
|
Announcing the re-activation of previously announced discontinued products
|
The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
|
|
5/23/2007
|
PCN_07-0523-01 [PDF]
|
SPX2951ACS-L-5-0, SPX2951ACS-L-5-0/TR, SPX2951ACS-5.0, SPX2951ACS-5-0/TR
|
Announcing the re-activation of previously announced discontinued products
|
The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
|
|
5/16/2007
|
PCN_07-0508-01 [PDF]
|
SPX1431N-L, SPX1431S-L, SP6214EC5-L-2
|
Announcing the re-activation of previously announced discontinued products.
|
The previously announced discontinued products listed above are being re-activated due to continuing Customer demand.
|
|
5/10/2007
|
PCN-07-0430-01 [PDF]
|
SP3070-SP3078
|
Moving from waivered SP3070 material to original datasheet specification. Mask set change in order to do so.
|
To assure continuity of supply of wafers for these products.
|
|
5/7/2007
|
PCN-06-0130-14a [PDF]
|
SP332CT
SP332CT-L
SP332ET
SP332ET-L
SP333CT
SP333CT-L
SP333ET
SP333ET-L
SP334CA
SP334CA-L
SP334CT
SP334CT-L
SP334ET
SP334ET-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
4/20/2007
|
PCN_07-0426-01 [PDF]
|
SP485CN-L, SP485CN-L/TR, SP485CS-L, SP485EN, SP485EN/TR, SP485EN-L, SP485EN-L/TR, SP485ES-L, SP490CN-L, SP490CN-L/TR, SP490CS-L SP490EN-L, SP490EN-L/TR, SP490ES-L, P491CN-L, SP491CN-L/TR, SP491CS-L, ...
|
Migrating product from 5um CMOS process technology to 2um CMOS process technology to be sourced from both Episil, Taiwan, and Silan, Hangzhou, China foundries.
|
To assure continuity of supply of wafers for these products.
|
|
4/20/2007
|
PCN_07-0426-02 [PDF]
|
SP483CN-L, SP483CN-L/TR, SP483CS-L, SP483ECN-L, SP483ECN-L/TR, SP483ECP-L, SP483EEN-L, SP483EEN-L/TR, SP483EEP-L, SP483EN-L, SP483EN-L/TR, SP483ES-L, SP485RCN-L, SP485RCN-L/TR, SP485RCP-L, SP485REN-L,...
|
Migrating product from Episil wafer foundry’s 5um CMOS process to Silan, Hangzhou, China, foundry’s 5um CMOS process.
|
To assure continuity of supply of wafers for these products.
|
|
4/18/2007
|
PCN_07-0419-01 [PDF]
|
SPX1117
|
Change Dropout Voltage maximum (datasheet page 2) from 1.1V to 1.2V for Iout = 100mA; from 1.15V to 1.25V for Iout = 500mA; from 1.2V to 1.3V for Iout = 800mA.
|
Datasheet Change
|
|
4/10/2007
|
PCN_07-0410-01 [PDF]
|
SP7611A, SP7612A, SP7614A
|
• Added 2X2 TDFN package option.
• Corrected Absolute Maximum CTRL Voltage to GND from 0.5V to -0.5V.
• Reformatted parametric graphs to make them more readable.
• Corrected other datasheet typographical errors.
|
Datasheet Change
|
|
4/4/2007
|
PCN_07-0328-01 [PDF]
|
SP3243, SP232E, SP202, SP207, SP485E, SP3232, SP3485, SP485, SP507, SP483
|
Power Management and Interface products as listed are being transferred to external wafer foundry, due to cessation of operations of the Sipex Hillview Wafer Fabrication manufacturing site.
|
Updating previously announced transfer of certain Power Management and Interface Products from the Hillview wafer fabrication facility to wafer foundry Silan.
|
|
2/21/2007
|
PCN 07-0214-01 [PDF]
|
SP7663
|
Adding minimum and maximum oscillator frequency to the specification
|
Datasheet Change
|
|
10/16/2006
|
PCN 06-1016-02 _2_(1) [PDF]
|
SP690T/S/R, SP802T/S/R, SP804T/S/R, and SP805T/S/R product family and the SP705-708/813L/813M product family.
|
Adding “Note 1: WDI minimum rise/fall time is 1 microsecond.” to “WDI Pulse Width” specification
|
The Schmitt trigger input on the WDI pin may not recognize signals with rise or fall times shorter than 1 microsecond.
|
|
10/16/2006
|
PCN 06-1016-01 _2_ [PDF]
|
SP6222EC5-2-5-L
SP6222EC5-3-0-L
SP6222EC5-L
SP6222EK-2-5-L
SP6222EK-3-0-L
SP6222EK-L
SP6223EC5-L
SP6223EK-L
|
• Removing “Output Voltage Accuracy” max spec at room temperature of 2% (3% over full operating temperature still applies).
• Adding “Output Voltage Accuracy” typical spec at room temperature of 1%.
• Changing “Fixed Output Voltage (3.0V version)” and “Fixed Output Voltage (2.5V version)” typical spec to apply at room temperature only (not over full operating temperature range. The MIN and MAX for both of these specifications still apply over full operating temperature.
• Removing specification for “Shutdown Supply Current@125ºC”.
|
Full product characterization over temperature necessitated the changes.
|
|
6/26/2006
|
PCN 06-0130-01b [PDF]
|
SP3238CA
SP3238CA-L
SP3238CY
SP3238CY-L
SP3238EA
SP3238EA-L
SP3238ECA
SP3238ECA-L
SP3238ECY
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-02a [PDF]
|
SP508CF
SP508CF-L
SP508EF
SP508EF-L
SP509CF
SP509CF-L
SP508CF
SP508CF-L
SP508EF
SP508EF-L
SP509CF
SP509CF-L
SP508CF
SP508CF-L
SP508EF
SP508EF-L
SP509CF
SP509CF-L
SP508CF
SP508CF-L
...
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-03a [PDF]
|
SP3203CA
SP3203CA-L
SP3203CY
SP3203CY-L
SP3203EA
SP3203EA-L
SP3203ECA
SP3203ECA-L
SP3203ECY
SP3203ECY-L
SP3203EEA
SP3203EEA-L
SP3203EEY
SP3203EEY-L
SP3203EY
SP3203EY-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-10b [PDF]
|
SP3508CF
SP3508CF-L
SP3508EF
SP3508EF-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-11b [PDF]
|
SP3070EEN SP3070EEN-L SP3070EMN SP3070EMN-L SP3071EEN SP3071EEN-L SP3071EMN SP3071EMN-L SP3073EEN SP3073EEN-L SP3073EMN SP3073EMN-L SP3074EEN SP3074EEN-L SP3074EMN SP3074EMN-L SP3076EE...
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-12a [PDF]
|
SP320ACF
SP320ACF-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-13a [PDF]
|
SP485RCN
SP485RCN-L
SP485RCP
SP485RCP-L
SP485RCS-L
SP485REN
SP485REN-L
SP485REP
SP485REP-L
SP485RES-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-14b [PDF]
|
SP332CT
SP332CT-L
SP332ET
SP332ET-L
SP333CT
SP333CT-L
SP333ET
SP333ET-L
SP334CA
SP334CA-L
SP334CT
SP334CT-L
SP334ET
SP334ET-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-15a [PDF]
|
SP503CF
SP503CF-L
SP503CM
SP503CM-L
SP503EF
SP503EF-L
SP503EM
SP503EM-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-16a [PDF]
|
SP331CT
SP331CT-L
SP331ET
SP331ET-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-17a [PDF]
|
SP322CF
SP322CF-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-19b [PDF]
|
SP488ACP
SP488ACP-L
SP488ACT
SP488ACT-L
SP488AEP
SP488AEP-L
SP488AET
SP488AET-L
SP488CN
SP488CN-L
SP488CS
SP488CS-L
SP488CT
SP488CT-L
SP488ES
SP488ES-L
SP488ET
SP488ET-L
SP489CN
SP4...
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-21b [PDF]
|
SP505ACF
SP505ACF-L
SP505BCF
SP505BCF-L
SP506CF
SP506CF-L
SP507CF
SP507CF-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-22c [PDF]
|
SP231ACP
SP231ACP-L
SP231ACT
SP231ACT-L
SP231AEP
SP231AEP-L
SP231AET
SP231AET-L
SP233ACP
SP233ACP-L
SP233ACT
SP233ACT-L
SP233AEP
SP233AEP-L
SP233AET
SP233AET-L
SP310ACP
SP310ACP-L
SP...
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-26a(1) [PDF]
|
SP504CF
SP504CF-L
SP504MCF
SP504MCF-L
SP514CF
SP514CF-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-26a [PDF]
|
SP504CF
SP504CF-L
SP504MCF
SP504MCF-L
SP514CF
SP514CF-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-27b [PDF]
|
SP233ECT
SP233ECT-L
SP233EET
SP233EET-L
SP310ECA
SP310ECA-L
SP310ECP
SP310ECP-L
SP310ECT
SP310ECT-L
SP310EEA
SP310EEA-L
SP310EEP
SP310EEP-L
SP310EET
SP310EET-L
SP312ECA
SP312ECA-L
SP...
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-29a [PDF]
|
SP526CF
SP526CF-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0130-59a [PDF]
|
SP481ECN
SP481ECN-L
|
Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN 06-0508-01 for RS232 products [PDF]
|
SP3222B/3232B Datasheet, SP3249E Datasheet, SP3243 Datasheet, SP3239E Datasheet, SP3238E Datasheet, SP3222EU/3232EU Datasheet, SP3222EB/3232EB Datasheet, SP3222E/3232E Datasheet
|
Change in ABSOLUTE MAXIMUM RATINGS of Input Voltages from: “-0.3V to +6.0V” to “-0.3V to Vcc + 0.3V” for the following pins (as appropriate to the specific product): TxIN, /EN,/ONLINE, /SHUTDOWN, EN SHDN, /SHDN
|
The datasheets originally mis-specified the absolute maximum ratings of the above listed pins.
|
|
6/26/2006
|
PCN 06-0508-02 for SPX2941 [PDF]
|
SPX2941 Datasheet
|
Removed reference to error flag; removed reference to “replacement for LM2941” and any other devices.
|
Enable is active high, opposite to competitors’ parts.
|
|
6/26/2006
|
PCN 06-0412-01 [PDF]
|
SP6683-03ER, SP6683-03ER-L, SP6683ER, SP6683ER-L, SP6683LVER, SP6683LVER-L
|
Metal routing change to insure that a flip-flop is initialized at circuit power-up
|
Corrective action to a circuit start-up problem.
|
|
6/26/2006
|
PCN 06-0330-01 [PDF]
|
SP682 family of Ultra-Low Power Inverting Voltage Doublers
|
Re-activation of previously discontinued part and transfer to wafer foundary silan
|
This previously discontinued prodcut is being re-activated due to Customer demand and is being transferred to an external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN-06-0130-46a [PDF]
|
SPX2810M3-2-8
SPX2810M3-L-2-8
SPX1117HM3-1-5
SPX1117HM3-L-1-5
SPX1117M3-1-5
SPX1117M3-L-1-5
SPX2810AM3-1-5
SPX2810AM3-L-1-5
SPX2810M3-1-5
SPX2810M3-L-1-5
SPX1117M3-1-8
SPX1117M3-L-1-8
SPX2...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN-06-0130-49a [PDF]
|
SPX1581T5-2-5
SPX1581T5-L-2-5
SPX1581U5-2-5
SPX1581U5-L-2-5
SPX1585AT-2-5
SPX1585AT-L-2-5
SPX1585AU-2-5
SPX1585AU-L-2-5
SPX1585T-2-5
SPX1585T-L-2-5
SPX1585U-2-5
SPX1585U-L-2-5
SPX1581T5-3-...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN-06-0130-40a [PDF]
|
SP6123CN
SP6123CN-L
SP6123EN
SP6123EN-L
SP6128ACY
SP6128ACY-L
SP6128AEY
SP6128AEY-L
SP6128AHY
SP6128AHY-L
SP6128EY
SP6128EY-L
SP6123ACN
SP6123ACN-L
SP6123AEN
SP6123AEN-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/26/2006
|
PCN-06-0130-34a [PDF]
|
SP707CN
SP707CN-L
SP707CP
SP707CP-L
SP707CU
SP707CU-L
SP707EN
SP707EN-L
SP707EP
SP707EP-L
SP707EU
SP707EU-L
SP708CN
SP708CN-L
SP708CP
SP708CP-L
SP708CU
SP708CU-L
SP708EN
SP708EN-L
...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
6/12/2006
|
PCN 06-0612-01 [PDF]
|
SP8059B
|
Capacitor and metal routing change
|
Improve band width and noise performance
|
|
5/8/2006
|
PCN-06-0130-27a [PDF]
|
SP233ECT
SP233ECT-L
SP233EET
SP233EET-L
SP310ECA
SP310ECA-L
SP310ECP
SP310ECP-L
SP310ECT
SP310ECT-L
SP310EEA
SP310EEA-L
SP310EEP
SP310EEP-L
SP310EET
SP310EET-L
SP312ECA
SP312ECA-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-22b [PDF]
|
SP231ACP
SP231ACP-L
SP231ACT
SP231ACT-L
SP231AEP
SP231AEP-L
SP231AET
SP231AET-L
SP233ACP
SP233ACP-L
SP233ACT
SP233ACT-L
SP233AEP
SP233AEP-L
SP233AET
SP233AET-L
SP310ACP
SP310ACP-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-22a [PDF]
|
SP231ACP
SP231ACP-L
SP231ACT
SP231ACT-L
SP231AEP
SP231AEP-L
SP231AET
SP231AET-L
SP232ACNSD
SP232ACNSD-L
SP232AENSD
SP232AENSD-L
SP233ACP
SP233ACP-L
SP233ACT
SP233ACT-L
SP233AEP
SP233A...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-19a [PDF]
|
SP488ACP
SP488ACP-L
SP488ACT
SP488ACT-L
SP488AEP
SP488AEP-L
SP488AET
SP488AET-L
SP488CN
SP488CN-L
SP488CS
SP488CS-L
SP488CT
SP488CT-L
SP488ES
SP488ES-L
SP488ET
SP488ET-L
SP489CN
SP4...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-11a [PDF]
|
SP3070EEN
SP3070EEN-L
SP3070EMN
SP3070EMN-L
SP3071EEN
SP3071EEN-L
SP3071EMN
SP3071EMN-L
SP3073EEN
SP3073EEN-L
SP3073EMN
SP3073EMN-L
SP3074EEN
SP3074EEN-L
SP3074EMN
SP3074EMN-L
SP3076EE...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-10a [PDF]
|
SP3508CF
SP3508CF-L
SP3508EF
SP3508EF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-09a [PDF]
|
SP204EP-L
SP208CA
SP208CA-L
SP208CP
SP208CP-L
SP208CT
SP208CT-L
SP208EA
SP208EA-L
SP208ECA
SP208ECA-L
SP208ECP
SP208ECP-L
SP208ECT
SP208ECT-L
SP208EEA
SP208EEA-L
SP208EEP
SP208EEP-L
...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-08a [PDF]
|
SP1485ECN
SP1485ECN-L
SP1485ECP
SP1485ECP-L
SP1485EEN
SP1485EEN-L
SP1485EEP
SP1485EEP-L
SP1485EMN
SP1485EMN-L
SP485ECN
SP485ECN-L
SP485ECP
SP485ECP-L
SP485EEN
SP485EEN-L
SP485EEP
SP48...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-07a [PDF]
|
SP3243CR
SP3243CR-L
SP3243BCA
SP3243BCA-L
SP3243BCR
SP3243BCR-L
SP3243BCT
SP3243BCT-L
SP3243BCY
SP3243BCY-L
SP3243BEA
SP3243BEA-L
SP3243BER
SP3243BER-L
SP3243BET
SP3243BET-L
SP3243BEY
...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-06a [PDF]
|
SP3232EEY
SP3232EEY-L
SP3232EN
SP3232EN-L
SP3232EP
SP3232EP-L
SP3232ET
SP3232ET-L
SP3232EY
SP3232EY-L
SP3223EHCA
SP3223EHCA-L
SP3223EHCP
SP3223EHCP-L
SP3223EHCY
SP3223EHCY-L
SP3223EHEA...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/8/2006
|
PCN-06-0130-04b [PDF]
|
SP202ECN
SP202ECN-L
SP202ECP
SP202ECP-L
SP202ECT
SP202ECT-L
SP202EEN
SP202EEN-L
SP202EEP
SP202EEP-L
SP202EET
SP202EET-L
SP232ACN
SP232ACN-L
SP232ACP
SP232ACP-L
SP232ACT
SP232ACT-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
5/7/2006
|
PCN-06-0130-01a(1) [PDF]
|
SP3238CA-L
SP3238CY
SP3238CY-L
SP3238EA
SP3238EA-L
SP3238ECA
SP3238ECA-L
SP3238ECY
SP3238ECY-L
SP3238EEA
SP3238EEA-L
SP3238EEY
SP3238EEY-L
SP3238EY
SP3238EY-L
SP3239CA
SP3239CA-L
SP32...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/15/2006
|
PCN-06-0130-21a [PDF]
|
SP505ACF
SP505ACF-L
SP505BCF
SP505BCF-L
SP506CF
SP506CF-L
SP507CF
SP507CF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/15/2006
|
PCN-06-0214-01 [PDF]
|
SP6128A
|
1. Adjusted the level shifter for correct low voltage operation. 2. Reduce bandgap compensation capacitor for better dV/dT performance. Note: There is no change in the data sheet or part functionality.
|
Customer Request
|
|
2/12/2006
|
PCN-06-0130-04a [PDF]
|
SP233ECP
SP233ECP-L
SP233EEP
SP233EEP-L
SP202ECN
SP202ECN-L
SP202ECP
SP202ECP-L
SP202ECT
SP202ECT-L
SP202EEN
SP202EEN-L
SP202EEP
SP202EEP-L
SP202EET
SP202EET-L
SP232ACN
SP232ACN-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-58 [PDF]
|
SPX29500T-1-8
SPX29500T-L-1-8
SPX29500U-1-8
SPX29500U-L-1-8
SPX29500T-2-5
SPX29500T-L-2-5
SPX29500U-2-5
SPX29500U-L-2-5
SPX29500T-3-3
SPX29500T-L-3-3
SPX29500U-3-3
SPX29500U-L-3-3
SPX29500...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-57 [PDF]
|
SPX5205M5
SPX5205M5-L
SPX5205M5-1-8
SPX5205M5-L-1-8
SPX5205M5-2-0
SPX5205M5-L-2-0
SPX5205M5-2-5
SPX5205M5-L-2-5
SPX5205M5-2-8
SPX5205M5-L-2-8
SPX5205M5-3-0
SPX5205M5-L-3-0
SPX5205M5-3-3
S...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-55 [PDF]
|
SPX29150T-1-8
SPX29150T-L-1-8
SPX2940T-1-8
SPX2940T-L-1-8
SPX2940U-1-8
SPX2940U-L-1-8
SPX3940AM3-1-8
SPX3940AM3-L-1-8
SPX3940AT-1-8
SPX3940AT-L-1-8
SPX3940AU-1-8
SPX3940AU-L-1-8
SPX3940M3-...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-54 [PDF]
|
SPX1129M3-5-0
SPX1129M3-L-5-0
SPX1129R-5-0
SPX1129R-L-5-0
SPX1129T-5-0
SPX1129T-L-5-0
SPX1129U-5-0
SPX1129U-L-5-0
SPX1521M3-5-0
SPX1521M3-L-5-0
SPX1521R-5-0
SPX1521R-L-5-0
SPX1521T-5-0
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-53 [PDF]
|
SPX1121M3-5-0
SPX1121M3-L-5-0
SPX1121N-5-0
SPX1121N-L-5-0
SPX2950ACN-5-0
SPX2950ACN-L-5-0
SPX2950CN-5-0
SPX2950CN-L-5-0
SPX2954AM3-5-0
SPX2954AM3-L-5-0
SPX2954AN-5-0
SPX2954AN-L-5-0
SPX295...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-52 [PDF]
|
LP2950ACN-5-0
LP2950ACN-L-5-0
LP2950CN-5-0
LP2950CN-L-5-0
LP2951ACS-5-0
LP2951ACS-L-5-0
LP2951CS-5-0
LP2951CS-L-5-0
LP2950ACN-3-3
LP2950ACN-L-3-3
LP2950CN-3-3
LP2950CN-L-3-3
LP2951ACS-3-3
...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-51 [PDF]
|
SPX2815AR-2-5 SPX2815AR-L-2-5 SPX2815AT-2-5 SPX2815AT-L-2-5 SPX2815AU-2-5 SPX2815AU-L-2-5 SPX2815R-2-5 SPX2815R-L-2-5 SPX2815T-2-5 SPX2815T-L-2-5 SPX2815U-2-5 SPX2815U-L-2-5 SPX2815AR-3-3 ...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-50 [PDF]
|
SPX1117R-2-8-5
SPX1117R-L-2-8-5
SPX1117U-2-8-5
SPX1117U-L-2-8-5
SPX2810T-L-1-5
SPX1117R-1-5
SPX1117R-L-1-5
SPX1117T-1-5
SPX1117T-L-1-5
SPX1117U-1-5
SPX1117U-L-1-5
SPX2810AU-1-5
SPX2810AU-L...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-49 [PDF]
|
SPX1581T5-2-5
SPX1581T5-L-2-5
SPX1581U5-2-5
SPX1581U5-L-2-5
SPX1585AT-2-5
SPX1585AT-L-2-5
SPX1585AU-2-5
SPX1585AU-L-2-5
SPX1585T-2-5
SPX1585T-L-2-5
SPX1585U-2-5
SPX1585U-L-2-5
SPX1581T5-3-...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-48 [PDF]
|
SPX1582T5-5-0
SPX1582T5-L-5-0
SPX1582U5-5-0
SPX1582U5-L-5-0
SPX1582T5-1-5
SPX1582T5-L-1-5
SPX1582U5-1-5
SPX1582U5-L-1-5
SPX1583T5-1-5
SPX1583T5-L-1-5
SPX1583U5-1-5
SPX1583U5-L-1-5
SPX1587A...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-47 [PDF]
|
SPX1004M1-2-5
SPX1004M1-L-2-5
SPX1004N-2-5
SPX1004N-L-2-5
SPX1004S1-2-5
SPX1004S1-L-2-5
SPX1004S2-2-5
SPX1004S2-L-2-5
SPX1004AM1-1-2
SPX1004AM1-L-1-2
SPX1004AN-1-2
SPX1004AN-L-1-2
SPX1004A...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-45 [PDF]
|
SP4446EK-L
SP6690EK
SP6690EK1
SP6690EK1-L
SP6690EK-L
SP6690ER
SP6690ER-L
SP6691EK
SP6691EK1
SP6691EK1-L
SP6691EK-L
SP6691ER
SP6691ER-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-44 [PDF]
|
SPX4041M
SPX4041M-L
SPX4041AS
SPX4041AS-L
SPX4041N
SPX4041N-L
SPX4041S
SPX4041S-L
SPX432AM
SPX432AM1
SPX432AM1-L
SPX432AM5
SPX432AM5-L
SPX432AM-L
SPX432AN
SPX432AN-L
SPX432AS
SPX432AS...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-43 [PDF]
|
SPX431BN
SPX431BN-L
SPX431BS
SPX431BS-L
SPX431CM1
SPX431CM1-L
SPX431CM5
SPX431CM5-L
SPX431CN
SPX431CN-L
SPX431CS
SPX431CS-L
SPX1431M1
SPX1431M1-L
SPX1431M5
SPX1431M5-L
SPX1431N
SPX143...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary BCD. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-42 [PDF]
|
SPX3431M
SPX3431M-L
SPX2431AM
SPX2431AM5
SPX2431AM5-L
SPX2431AM-L
SPX2431M
SPX2431M5
SPX2431M5-L
SPX2431M-L
SPX431LAM
SPX431LAM1
SPX431LAM1-L
SPX431LAM-L
SPX431LAN
SPX431LAN-L
SPX431LA...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-41 [PDF]
|
SP6120BCY
SP6120BCY-L
SP6120BEW
SP6120BEW-L
SP6120BEY
SP6120BEY-L
SP6120BHY
SP6120BHY-L
SP6120HBEY
SP6120HBEY-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-40 [PDF]
|
SP6123CN
SP6123CN-L
SP6123EN
SP6123EN-L
SP6128ACY
SP6128ACY-L
SP6128AEY
SP6128AEY-L
SP6128AHY
SP6128AHY-L
SP6123ACN
SP6123ACN-L
SP6123AEN
SP6123AEN-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-39 [PDF]
|
SP6121EN
SP6121EN-L
SP6121CN
SP6121CN-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-38 [PDF]
|
SP6122ACU
SP6122ACU-L
SP6122ACU-1-5
SP6122ACU-L-1-5
SP6122ACU-1-2-5
SP6122ACU-L-1-2-5
SP6122CU
SP6122CU-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-37 [PDF]
|
SP706XP
SP706XP-L
SP813MXN
SP813MXN-L
SP813MXP
SP813MXP-L
SP705CN
SP705CN-L
SP705CP
SP705CP-L
SP705CU
SP705CU-L
SP705EN
SP705EN-L
SP705EP
SP705EP-L
SP705EU
SP705EU-L
SP705XN
SP705XN...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-36 [PDF]
|
SP6120CY
SP6120CY-L
SP6120EY
SP6120EY-L
SP6120HEY
SP6120HEY-L
SP6120HY
SP6120HY-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-35 [PDF]
|
SP693AXN
SP693AXN-L
SP693AXP
SP693AXP-L
SP693AXT
SP693AXT-L
SP691ACN
SP691ACN-L
SP691ACP
SP691ACP-L
SP691ACT
SP691ACT-L
SP691AEN
SP691AEN-L
SP691AEP
SP691AEP-L
SP691AET
SP691AET-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-34 [PDF]
|
SP707CN
SP707CN-L
SP707CP
SP707CP-L
SP707CU
SP707CU-L
SP707EN
SP707EN-L
SP707EP
SP707EP-L
SP707EU
SP707EU-L
SP707XN
SP707XN-L
SP707XP
SP707XP-L
SP708CN
SP708CN-L
SP708CP
SP708CP-L
...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-33 [PDF]
|
SP791XN
SP791XN-L
SP791XP
SP791XP-L
SP791CN
SP791CN-L
SP791CP
SP791CP-L
SP791EN
SP791EN-L
SP791EP
SP791EP-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-32 [PDF]
|
SP690AXN
SP690AXN-L
SP690AXP
SP690AXP-L
SP802LXN
SP802LXN-L
SP802LXP
SP802LXP-L
SP692AXN
SP692AXN-L
SP692AXP
SP692AXP-L
SP802MXN
SP802MXN-L
SP802MXP
SP802MXP-L
SP690ACN
SP690ACN-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-31 [PDF]
|
SP802SXN
SP802SXN-L
SP802SXP
SP802SXP-L
SP802TXN
SP802TXN-L
SP802TXP
SP802TXP-L
SP802RXN
SP802RXN-L
SP802RXP
SP802RXP-L
SP690SXN
SP690SXN-L
SP690SXP
SP690SXP-L
SP690TXN
SP690TXN-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-30 [PDF]
|
SP3485CN
SP3485CN-L
SP3485CP
SP3485CP-L
SP3485EN
SP3485EN-L
SP3485EP-L
SP3481CN
SP3481CN-L
SP3481CP
SP3481CP-L
SP3481EN
SP3481EN-L
SP3481EP
SP3481EP-L
SP3483CN
SP3483CN-L
SP3483CP
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-29 [PDF]
|
SP526CF
SP526CF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-27 [PDF]
|
SP233ECT
SP233ECT-L
SP233EET
SP233EET-L
SP310ECA
SP310ECA-L
SP310ECP
SP310ECP-L
SP310ECT
SP310ECT-L
SP310EEA
SP310EEA-L
SP310EEP
SP310EEP-L
SP310EET
SP310EET-L
SP385ECA
SP385ECA-L
SP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-26 [PDF]
|
SP504CF
SP504CF-L
SP504MCF
SP504MCF-L
SP514CF
SP514CF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-25 [PDF]
|
SP200CP
SP200CP-L
SP200CT
SP200CT-L
SP200EP
SP200EP-L
SP200ET
SP200ET-L
SP204CP
SP204CP-L
SP204CT
SP204CT-L
SP204ET
SP204ET-L
SP205BCP
SP205BCP-L
SP205BEP
SP205BEP-L
SP205CP
SP205CP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-24 [PDF]
|
SP485BN
SP485BN-L
SP485CN
SP485CN-L
SP485CS
SP485CS-L
SP485DN
SP485DN-L
SP485EN
SP485EN-L
SP485ES
SP485ES-L
SP485SN
SP485SN-L
SP485SS
SP485SS-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-23 [PDF]
|
SP2209EEY
SP2209EEY-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-22 [PDF]
|
SP231ACP
SP231ACP-L
SP231ACT
SP231ACT-L
SP231AEP
SP231AEP-L
SP231AET
SP231AET-L
SP232ACNSD
SP232ACNSD-L
SP232AENSD
SP232AENSD-L
SP233ACP
SP233ACP-L
SP233ACT
SP233ACT-L
SP233AEP
SP233A...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-21 [PDF]
|
SP507CF
SP507CF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-20 [PDF]
|
SP483CN
SP483CN-L
SP483CS
SP483CS-L
SP483ECN
SP483ECN-L
SP483ECP
SP483ECP-L
SP483EEN
SP483EEN-L
SP483EEP
SP483EEP-L
SP483EN
SP483EN-L
SP483ES
SP483ES-L
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-19 [PDF]
|
SP488ACP
SP488ACP-L
SP488ACT
SP488ACT-L
SP488AEP
SP488AEP-L
SP488AET
SP488AET-L
SP488CN
SP488CN-L
SP488CS
SP488CS-L
SP488CT
SP488CT-L
SP488ES
SP488ES-L
SP488ET
SP488ET-L
SP489CN
SP4...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-18 [PDF]
|
SP486CN
SP486CN-L
SP486CP
SP486CP-L
SP486EP
SP486EP-L
SP487CN
SP487CN-L
SP487CP
SP487CP-L
SP487EP
SP487EP-L
SP486CS
SP486CS-L
SP486CT
SP486CT-L
SP486ES
SP486ES-L
SP486ET
SP486ET-L
...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-17 [PDF]
|
SP322CF
SP322CF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-16 [PDF]
|
SP331CT
SP331CT-L
SP331ET
SP331ET-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-15 [PDF]
|
SP503CF
SP503CF-L
SP503CM
SP503CM-L
SP503EF
SP503EF-L
SP503EM
SP503EM-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-14 [PDF]
|
SP334CA
SP334CA-L
SP334CT
SP334CT-L
SP334ET
SP334ET-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-13 [PDF]
|
SP485RCN
SP485RCN-L
SP485RCP
SP485RCP-L
SP485RCS-L
SP485REN
SP485REN-L
SP485REP
SP485REP-L
SP485RES-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-12 [PDF]
|
SP320ACF
SP320ACF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-11 [PDF]
|
SP3070EEN
SP3070EEN-L
SP3070EMN
SP3070EMN-L
SP3071EEN
SP3071EEN-L
SP3071EMN
SP3071EMN-L
SP3073EEN
SP3073EEN-L
SP3073EMN
SP3073EMN-L
SP3074EEN
SP3074EEN-L
SP3074EMN
SP3074EMN-L
SP3076EE...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-10 [PDF]
|
SP3508CF
SP3508CF-L
SP3508EF
SP3508EF-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-09 [PDF]
|
SP204EP-L
SP208CA
SP208CA-L
SP208CP
SP208CP-L
SP208CT
SP208CT-L
SP208EA
SP208EA-L
SP208ECA
SP208ECA-L
SP208ECP
SP208ECP-L
SP208ECT
SP208ECT-L
SP208EEA
SP208EEA-L
SP208EEP
SP208EEP-L
...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-08 [PDF]
|
SP1485ECN
SP1485ECN-L
SP1485ECP
SP1485ECP-L
SP1485EEN
SP1485EEN-L
SP1485EEP
SP1485EEP-L
SP1485EMN
SP1485EMN-L
SP485ECN
SP485ECN-L
SP485ECP
SP485ECP-L
SP485EEN
SP485EEN-L
SP485EEP
SP48...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-07 [PDF]
|
SP3243CRSP3243CR- LSP3243BCASP3243BCA- LSP3243BCRSP3243BCR- LSP3243BCTSP3243BCT- LSP3243BCYSP3243BCY- LSP3243BEASP3243BEA- LSP3243BERSP3243BER- LSP3243BETSP3243BET- LSP3243BEYSP3243BEY- LSP3243CASP324...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-06 [PDF]
|
SP3232ECTSP3232ECT- LSP3232ECYSP3232ECY- LSP3232EEASP3232EEA- LSP3232EENSP3232EEN- LSP3232EEPSP3232EEP- LSP3232EETSP3232EET- LSP3232EEYSP3232EEY- LSP3232ENSP3232EN- LSP3232EPSP3232EP- LSP3232ETSP3232E...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-04 [PDF]
|
SP233ECPSP233ECP- LSP233EEPSP233EEP- LSP202ECNSP202ECN- LSP202ECPSP202ECP- LSP202ECTSP202ECT- LSP202EENSP202EEN- LSP202EEPSP202EEP- LSP202EETSP202EET- LSP232ACNSP232ACN- LSP232ACPSP232ACP- LSP232ACTSP...
|
Announcing transfer of certain Power Management and Interface Products fro
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-03 [PDF]
|
SP3203CASP3203CA- LSP3203CYSP3203CY- LSP3203EASP3203EA- LSP3203ECASP3203ECA- LSP3203ECYSP3203ECY- LSP3203EEASP3203EEA- LSP3203EEYSP3203EEY- LSP3203EYSP3203EY-L
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-02 [PDF]
|
SP508CFSP508CF- LSP508EFSP508EF- LSP509CFSP509CF- LSP508CFSP508CF- LSP508EFSP508EF- LSP509CFSP509CF- LSP508CFSP508CF- LSP508EFSP508EF- LSP509CFSP509CF- LSP508CFSP508CF- LSP508EFSP508EF- LSP509CFSP509C...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
2/2/2006
|
PCN-06-0130-01 [PDF]
|
SP3238CASP3238CA- LSP3238CYSP3238CY- LSP3238EASP3238EA- LSP3238ECASP3238ECA- LSP3238ECYSP3238ECY- LSP3238EEASP3238EEA- LSP3238EEYSP3238EEY- LSP3238EYSP3238EY- LSP3239CASP3239CA- LSP3239CYSP3239CY- LSP...
|
Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List
|
Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
|
|
1/17/2006
|
PCN-06-0117-01 [PDF]
|
SP489ECN- LSP489ECPSP489ECP- LSP489ECTSP489ECT- LSP489EENSP489EEN- LSP489EEPSP489EEP- LSP489EETSP489EET- LSP495CTSP495CTSP495CT- LSP495CT- LSP495ETSP495ET- LSP502CFSP502CMSP516CFSP522CASP522CA- LSP522...
|
Announcing discontinuance of certain low volume Power Management and Interface Products and last dates to place lifetime. buy orders
|
Low Volume Power Management and Interface products are being discontinued due to cessation of operations of the Sipex Hillview Fabrication manufacturing site.
|
|
12/9/2005
|
PCN-05-1208-01 [PDF]
|
SP8028, SP8029, SP8080, SP8082, SP8083, SP8084
|
Adding Taiwan IC Packaging Corp. (TICP) as additional assembly suncontractor for the OLCC packages
|
To increase capacity for the OLCC pkg so as to be able to meet Customer demand with continued high quality and reliability
|
|
9/1/2005
|
PCN-05-0801-02 [PDF]
|
SP6682
|
Sipex is qualifying UMC as an alter- native manufacturing source for the listed product
|
Sipex plans to add UMC for additional capacity for this product.
|
|
9/1/2005
|
PCN-05-0801-01 [PDF]
|
SP6648
|
Sipex is qualifying UMC as an alter- native manufacturing source for the listed product
|
Sipex plans to add UMC for additional capacity for this product
|
|
7/28/2005
|
PCN-05-0725-01 [PDF]
|
SP8069DG
|
Sipex has qualified Linseng as an alternate assembly and test source for the listed product
|
ASE is currently not capable of providing the required capacity for the assembly and test service so Sipex for the Sipex OPLGA pkg configuration
|
|
7/27/2005
|
PCN-05-0725-02 [PDF]
|
SP8127DG
|
Sipex has qualified Linseng as an alternate assembly and test source for the listed product.
|
ASE is currently not capable of providing the required capacity for the assembly and test service so Sipex for the Sipex OPLGA pkg configuration
|
|
6/16/2005
|
PCN-05-0615-01 [PDF]
|
SP8069 (SP8069DG)
|
Add qualified assembly subcontractor Lingsen (in addition to existing qualified subcontructor ASE) for 16ld OPLGA package type. Ordering part Number for new Lingsen version is SP8069DGA4. Ordering part number for existing ASE version remains SP8069DG
|
Operational flexibility and cost reduction
|
|
4/29/2005
|
PCN-05-0428-01 [PDF]
|
All TO263 3 Lead Packages
|
Addition of assembly sub-contractor CET
|
Manufacturing flexibility
|
|
4/29/2005
|
PCN-05-0428-01(2) [PDF]
|
All TO92 Packages
|
Addition of assembly sub-contractor CET
|
Manufacturing flexibility
|
|
4/14/2005
|
PCN-04-0410-01 [PDF]
|
SP6682 Product Family SP6648 Product Family
|
UMC has been added as Qualified wafer fab. Sub- contractor for SP6682 and. SP6684 Prod. Family
|
Consolidation of Wafer Fab Subcontractors which will result in decrease manufacturing cycle
|
|
12/22/2004
|
PCN-04-1222-01 [PDF]
|
See attached Sipex part# SOT-23 -3L pkg.product may vary from JEDEC TO-236. Variation AB
|
Sipex has qualified CET to perform assembly operation fot the SOT23 -3 L package. Some of the CET SOT23 3 L pkg. dimensions are slightly different than the Jedec To-236 Variation AB std.
|
Improve manufacturability
|
|
12/9/2004
|
PCN-04-1118-01 [PDF]
|
Applies to all voltage accuracy and temperature options for the 1.2 micron.
|
Sipex has qualified the 1.2 micron wafer fab process for the above-listed products
|
Improve manufacturability
|
|
11/2/2004
|
PCN-04-1102-04 [PDF]
|
Applies to all voltage accuracy and temperature options for listed devices delivered in the TSSOP 16 lead package Applies to all packing option (T/R, Tube or Bulk
|
Sipex has qualified CET as an alternate assembly and test source for the above- listed products
|
Improve manufacturability flexibility
|
|
11/2/2004
|
PCN-04-1102-03 [PDF]
|
Applies to all voltage accuracy and temperature options for above devices delivered in the 3-leadSOT - 22 package Applies to all packing option (T/R, Tube or Bulk for 3-lead SOT-223
|
Sipex has qualified CET as an alternate assembly and test source for the above- listed products
|
Improve manufacturability flexibility
|
|
11/2/2004
|
PCN-04-1102-02(1) [PDF]
|
Applies to all voltage accuracy and temperature options for above devices delivered in the NSOIC16 16 -lead package Applies to all packing option (T/R, Tube or Bulk for NSOIC16
|
Sipex qualified Fujitsu aa an alternate assembly and test source for the above-listed products
|
Improve manufacturability flexibility
|
|
11/2/2004
|
PCN-04-1102-01 [PDF]
|
Applies to all voltage accuracy and temperature options for above devices in the NSOIC8 8 -lead package Applies to all packing option (T/R, Tube or Bulk for NSOIC16
|
Sipex qualified Fujitsu aa an alternate assembly and test source for the above-listed products
|
Improve manufacturability flexibility
|
|
11/2/2004
|
PCN-04-1101-02 [PDF]
|
Applies to all voltage accuracy and temperature options for listed devices delivered in the SOT-23 3 lead package Applies to all packing option (T/R, Tube or Bulk
|
Sipex has qualified CET as an alternate assembly and test source for the above- listed products
|
Improve manufacturability flexibility
|
|
11/2/2004
|
PCN-04-1101-01 [PDF]
|
Applies to all voltage accuracy and temperature options for listed devices delivered in the SOT-89 3 lead package Applies to all packing option (T/R, Tube or Bulk
|
Sipex has qualified CET as an alternate assembly and test source for the above- listed products
|
Improve manufacturability flexibility
|
|
10/22/2004
|
PCN-04-0818-01 [PDF]
|
T/R 14LD and 16LD TSSOP packages
|
Change from the present 16mmx12mm T/R carrier tape to 12mm to 8mm. Standard reel qty. from 1500pcs. To 2500pcs.
|
Implemented to comply with EIA and industry standards
|
|
10/5/2004
|
PCN-04-1004-01 [PDF]
|
SP682
|
Sipex transfering the wafer fab for this device from outside foundary to Sipex Hillview wafer Fab
|
Improved manufacturing and availability of Sp682 charge pump device
|